信创ETF（159537）跟踪的是国证信创指数（CN5075），该指数从沪深市场中选取涉及半导体、软件 开发、计算机设备等信息技术领域的上市公司证券作为指数样本，以反映信息技术创新领域相关上市公 司证券的整体表现。该指数偏重大盘风格，成分股平均市值较高，行业配置侧重于半导体、软件开发及 IT服务。 （文章来源：每日经济新闻） 申万宏源证券指出，半导体全产业链与生产制造工艺高度绑定，国产晶圆厂在设备限制下开发出新技术 路径，而海外EDA工具无法支撑分化的国产工艺，这为国产EDA厂商创造了独立市场空间。近期EDA 行业IPO和并购活跃，交易金额逐步放大，标的趋向数字IC设计核心环节，行业进入加速发展阶段。地 方政府及国家大基金对EDA产业的支持将推动头部厂商整合，形成2~3家平台型领军企业。中长期看， 国产EDA厂商将通过并购整合打通数字IC设计全流程，并布局先进制程制造类工具，与国产晶圆厂匹 配，未来随产线成熟将迎来收入释放。行业当前处于先进领域攻坚与并购活跃并行的阶段，政策、资本 及产业链协同将加速这一进程。 1月8日，信创ETF（159537）盘中涨超2.5%，行业壁垒与国产替代空间受关注。 ...

每日经济新闻 （责任编辑：张晓波 ） 风险提示：提及个股仅用于行业事件分析，不构成任何个股推荐或投资建议。指数等短期涨跌仅供 参考，不代表其未来表现，亦不构成对基金业绩的承诺或保证。观点可能随市场环境变化而调整，不构 成投资建议或承诺。提及基金风险收益特征各不相同，敬请投资者仔细阅 读基金法律文件，充分了解产品要素、风险等级及收益分配原则，选择与自身风险承受能力匹配的 产品，谨慎投资。 1月6日，科创芯片ETF国泰（589100）涨超1.7%，半导体自主可控与EDA国产化进程引关注。 申万宏源证券指出，半导体全产业链与生产制造工艺高度绑定，在设备限制等因素下，国产晶圆厂 开发出新技术路径，海外EDA工具无法为分化的国产工艺提供支撑，这为国产EDA厂商创造了独立市 场空间。近期EDA行业IPO和并购活跃，交易金额逐步放大，标的趋向数字IC设计的核心环节，行业进 入加速发展阶段。未来5年，国产EDA厂商将通过并购整合打通数字IC设计全流程，布局先进制程制造 类工具，与国产晶圆厂匹配。地方政府和国家大基金对EDA行业的支持将推动头部厂商并购整合，加 速行业集中。中长期看，EDA行业将形成2~3家头部厂商，国产替代逻 ...

1月6日，消电ETF（561310）涨超1.1%，半导体自主可控与EDA国产化受关注 申万宏源证券指出，半导体全产业链与生产制造工艺高度绑定，在设备限制等因素下，国产晶圆厂 开发出新技术路径，海外EDA工具无法为分化的国产工艺提供支撑，这为国产EDA厂商创造了独立市 场空间。近期EDA行业IPO和并购活跃，交易金额逐步放大，标的趋向数字IC设计的核心环节，行业进 入加速发展阶段。未来5年，国产EDA厂商将通过并购整合打通数字IC设计全流程，布局先进制程制造 类EDA工具，与国产晶圆厂匹配。地方政府和国家大基金对EDA行业的支持将推动头部厂商并购整 合，加速行业发展。中长期看，EDA行业将形成2-3家头部厂商，国产替代逻辑持续强化。 消电ETF（561310）跟踪的是消费电子指数（931494），该指数从市场中选取涉及消费电子产品设 计、制造和销售等相关业务的上市公司证券作为指数样本，涵盖智能手机、家用电器、个人电脑及相关 配件等领域的代表性企业。该指数旨在反映消费电子行业的整体表现和发展趋势，具有较高的科技含量 和市场敏感性。 读基金法律文件，充分了解产品要素、风险等级及收益分配原则，选择与自身风险承受能力匹 ...

申万宏源证券指出，半导体全产业链与生产制造工艺高度绑定，国产晶圆厂在设备限制下开发出新 技术路径，海外EDA工具无法支撑国产工艺分叉，为国产EDA厂商创造了独立市场空间。行业近期IPO 和并购活跃，3家一级公司启动IPO流程，所处环节差异化，符合行业集中化趋势；并购交易金额放大 且标的趋向数字IC设计核心环节，进入"先进领域攻坚+并购活跃"阶段。政策与资本支持加速行业整 合，地方政府及国家大基金三期将持续推动EDA平台型厂商通过并购打通全流程工具链，匹配国产晶 圆厂需求。中长期看，行业将形成2-3家头部厂商，伴随国产先进产线放量迎来收入释放。当前需关注 国产工艺分叉机遇、产业链协同效应及工具链补齐进度。 信创ETF（159537）跟踪的是国证信创指数（CN5075），该指数从沪深市场中选取涉及半导体、 软件开发、计算机设备等信息技术领域的上市公司证券作为指数样本，以反映信息技术创新行业相关上 市公司证券的整体表现。该指数偏重大盘风格，行业配置上以半导体、软件开发及IT服务为主，具有较 高的平均个股市值。 风险提示：提及个股仅用于行业事件分析，不构成任何个股推荐或投资建议。指数等短期涨跌仅供 参考，不代表其未来 ...

Core Viewpoint - The article discusses the absolute monopoly of the United States in the semiconductor industry, highlighting the dominance in core technologies such as design tools, high-end IP cores, advanced architectures, key manufacturing equipment, and testing instruments. This monopoly creates significant barriers to entry and establishes a comprehensive technological hegemony that is difficult to challenge globally, while also leaving room for diversification and breakthroughs in specific fields, particularly in China's domestic semiconductor industry [1]. Group 1: Chip Design Tools (EDA) - The monopoly is held by Synopsys, Cadence, and Siemens EDA, which together account for over 95% of the global market share, providing a comprehensive toolchain for chip design [3]. - These tools are essential for advanced process nodes of 7nm and below, featuring capabilities such as lithography simulation and yield optimization, making them critical infrastructure for chip development [3]. - The high density of patent barriers and deep collaboration with leading foundries like TSMC and Samsung create strong user ecosystem stickiness, making it difficult for latecomers to replace these tools [3]. Group 2: High-Performance IP Cores and Architectures - The monopoly is dominated by X86 architecture (Intel, AMD), GPU architecture (NVIDIA, AMD), and AI acceleration IP (NVIDIA, Xilinx), with ARM's technology also heavily influenced by U.S. regulations [6]. - The X86 architecture leads in high-performance computing, while NVIDIA's CUDA architecture defines global AI computing standards, creating dual barriers of performance and ecosystem [6]. - Global chip design companies are highly dependent on U.S. IP, and the U.S. can restrict access to these IPs through licensing, directly impacting the design capabilities of other nations [6]. Group 3: Key Manufacturing Equipment - The monopoly is held by U.S. companies like Applied Materials, Lam Research, and KLA, which lead in critical equipment for etching, film deposition, and process inspection [9]. - These companies provide essential technologies for advanced processes, with high barriers to entry due to long R&D cycles and significant capital investment [9]. - The dependency of global foundries like TSMC and Samsung on U.S. equipment means that U.S. export controls can directly affect the expansion and technological upgrades of advanced manufacturing capacities [9]. Group 4: High-End Chip Design and Architecture Innovation - U.S. companies like NVIDIA, Qualcomm, AMD, and Apple dominate the global technology direction in AI chips, mobile terminal chips, and high-performance computing chips [12]. - Continuous high R&D investment (approximately 17.7% of semiconductor industry revenue) and strong ecosystem integration capabilities allow these companies to maintain significant advantages [12]. - The U.S. leads in defining the demand and technological evolution of high-end chips, influencing the global semiconductor supply chain [12]. Group 5: Semiconductor Testing and Packaging Technologies - The monopoly is held by U.S. companies like Teradyne and Cohu, which dominate the high-end chip testing equipment market [15]. - These companies provide comprehensive testing solutions that meet the high precision requirements of advanced process nodes [15]. - The global chip production's yield control and quality assurance are highly reliant on U.S. testing equipment, and export restrictions can impact production efficiency and quality stability [15]. Group 6: Core Materials Technology - U.S. companies like Dow Chemical, DuPont, and GlobalFoundries dominate the market for critical semiconductor materials such as photoresists and electronic specialty gases [18]. - The high purity and stability requirements for semiconductor materials create significant barriers for new entrants [18]. - Advanced process chip manufacturing relies over 80% on U.S. core materials, and U.S. export controls can directly affect global production capacities [18]. Group 7: Semiconductor Software and Ecosystem - U.S. companies like Microsoft, Google, and NVIDIA dominate the software ecosystem that supports chip applications [21]. - The NVIDIA CUDA ecosystem monopolizes AI training and inference software, with over 90% of AI developers using the CUDA platform [21]. - The strong network effects of these ecosystems create significant barriers for new entrants, making it difficult for other countries to commercialize breakthroughs in high-performance chip development [21]. Group 8: Industry Standard Setting Authority - The U.S. leads international standard organizations like IEEE and JEDEC, controlling the core industry standards for chip interfaces and performance specifications [24]. - The binding of industry standards with technology patents creates dual barriers that are difficult for non-U.S. companies to overcome [24]. - The U.S. can guide global semiconductor technology development through standard-setting, impacting the innovation paths of non-U.S. enterprises [24]. Group 9: High-End Semiconductor Products and Solutions - U.S. companies like NVIDIA, Intel, Qualcomm, and Micron hold a dominant share in the global high-end semiconductor product market [27]. - These companies have established significant performance advantages through long-term technological accumulation and deep integration with downstream manufacturers [27]. - The global technology industry is highly dependent on U.S. semiconductor products, and U.S. export controls can directly influence the development of global technology sectors [27].

在人类文明的长河中，总有一些时刻，一条看似寻常的决策注定在未来掀起壮阔的波澜；而这样的决 策，往往由一群相信未来的人所选定。 二十世纪末，就在开发建设不久的苏州工业园区这片被一些人视为"科技文化荒漠"的土地上，一群富有 远见的开拓者，以近乎直觉的勇气与超前的规划，郑重地埋下了一粒名叫"苏州国际科技 园"（SISPARK）的"种子"。 今天，当我们回望这粒"种子"在四分之一世纪的破茧成长的轨迹，可以发现，它已不再仅仅是关于一个 产业园区的故事，而是一部关于科技创新的微缩史诗，这粒"种子"所改变的，远不只是一片土地的风 貌，而是正在深刻改写苏州这座城市的产业基因。 站在科技园的高楼上凭栏远眺，苏州工业园区早期科技产业的决策人之一、曾任园区党工委副书记的杨 建中充满感慨。他反复提及科技园这粒"种子"开启了园区科技创新产业（300832）的先河。 "这粒'种子'意义非凡，它为探索苏州工业园区培育科技创新的体制、机制闯出了一条路子，有力带动 了全区科创产业的蓬勃兴起。"杨建中说，"从苏州国际科技园的实践中，园区总结出一套'专业招商队 伍+公共技术平台+科研院所支撑+创业人才+天使投资'五位一体的科技创新发展模式，通过成 ...

Core Viewpoint - The article discusses the future of China's hard technology industry, emphasizing the transition from "single-point breakthroughs" to "ecological collaboration" and the establishment of sustainable business loops over the next five years [1]. Group 1: Chip Industry - The domestic chip industry is under scrutiny, particularly with the recent approval of NVIDIA's H200 chip for sale in China, which poses a challenge for domestic companies like Muxi Co., a successful case incubated by patient capital [3]. - Muxi's CTO, Yang Jian, highlights that the focus on supply chain security has surpassed mere technical parameters, indicating a shift in customer procurement logic from "technological superiority" to a comprehensive consideration of "safety, cost, and long-term service" [3]. - Yang believes that within 2-3 years, China can establish a complete closed loop for robot chips, which presents a critical window for domestic chips amid the competition from NVIDIA [3]. Group 2: EDA Tools - The autonomy and control of EDA tools are crucial for chip design, with a recognition of the conflict between the capital's desire for quick returns and the high investment and long cycles inherent in EDA [4]. - The vice president of Hejian Technology, Wu Xiaozhong, notes that capital investors, such as the National Big Fund, are showing greater patience, which is a positive change for the industry [4]. - The company is transitioning from single-point tool breakthroughs to a full-process layout, with a complete solution from software simulation to hardware prototype verification, particularly optimized for domestic intelligent computing chips [4]. Group 3: Robotics - Cloudy Technology's vice president, Xie Yunpeng, reports that their service robots have been deployed in nearly 40,000 enterprises, with over 500 million service instances expected in 2024 [4]. - Xie emphasizes that the challenge is not just in manufacturing but in enhancing product intelligence by integrating large model capabilities [5]. - The company is exploring an open mobile platform ecosystem, inviting partners to co-create upper-layer applications, moving beyond existing products [5]. Group 4: New Materials - The value of new materials is often overlooked, yet they are fundamental to system performance, as highlighted by Tang Xuan, secretary of the board at Nalin Weina Technology [6]. - The company has developed composite materials by nano-sizing rare metals and evenly dispersing them in plastic substrates, achieving significant energy-saving effects in sectors like aviation and high-speed rail [6]. - Tang emphasizes the shift from a "procurement relationship" to a "co-developer" model with clients, which is seen as a core innovation model for the next five years in the materials field [6]. Group 5: Industry Collaboration - The five executives agree on the importance of collaboration across different sectors, stating that the era of individual breakthroughs is over [6]. - They stress that only through upstream and downstream cooperation can the industry shorten verification cycles, co-build testing scenarios, and share innovation dividends, transforming "usable" into "well-used" and making "domestic" the preferred choice [6].

未来五年中国硬科技产业如何从"单点突破"迈向"生态协同"，并构建可持续的商业闭环。 18日，在2025第一财经资本年会上，来自机器人、芯片、EDA软件及新材料领域的五家代表性企业——云迹科技、上海开普勒机器人、沐曦股份、合见工 软与纳琳威纳米科技的高管齐聚一堂，共同探讨了未来五年中国硬科技产业如何从"单点突破"迈向"生态协同"，并构建可持续的商业闭环。 终端应用是技术价值的最终体现，机器人也是当下的热门行业。云迹科技副总裁谢云鹏分享了一组亮眼数据：公司的服务机器人已落地近4万家企业客户， 包括酒店、工厂、商超、医院等多元场景，2024全年服务次数超5亿次。他表示，目前生产制造环节已不是服务型机器人最大的挑战，而是如何在产品上叠 加大模型的通用的能力实现进一步的智能化。 谢云鹏强调，未来机器人不仅是B端降本增效的工具，更要泛在化地融入日常生活。为此，云迹正探索开放的移动平台生态，邀请合作伙伴共创上层应用。 他呼吁上游伙伴与终端厂商"双向奔赴"，共同面向未来场景研发，而非固守现有产品。 作为算力基石，芯片的国产化进程一直备受关注。刚刚在科创板上市的沐曦股份作为耐心资本孵化出的成功案例在会场上频频被"cue"，但在 ...

Core Viewpoint - The collaboration between Huada Jiutian and Haiguang Information aims to enhance the synergy between EDA technology and domestic computing platforms, which is crucial for improving chip development efficiency and strengthening the industrial chain [1]. Group 1: Collaboration and Strategic Importance - Huada Jiutian has signed a cooperation agreement with Haiguang Information to explore the integration of EDA technology with domestic computing platforms [1]. - The partnership is expected to facilitate the integration of product adaptation, solution integration, and joint research and development, thereby promoting collaborative implementation [1]. - This collaboration aligns with the "14th Five-Year Plan" and is anticipated to support the systematic development of the domestic computing ecosystem [1]. Group 2: Recent Developments and Investments - Huada Jiutian has completed an investment of 100 million yuan in Zhongwan Xincheng, acquiring a 90.9008% partnership share [2]. - The company has also acquired approximately 7.78% of Sierxin's shares, which is expected to create synergies with its existing digital simulation verification tools and enhance its market presence [2]. - The investment in Sierxin is seen as a critical step in filling gaps in Huada Jiutian's digital EDA platform and supporting the national integrated circuit industry's self-sufficiency strategy [2]. Group 3: Industry Context and Product Significance - Digital simulation verification tools are essential components of the EDA toolchain, directly impacting the stability and reliability of chips, particularly in high-end chip design [3]. - Sierxin, with 21 years of experience in this field, is recognized as a national-level specialized and innovative "little giant" enterprise [3].

12月12日，"中国EDA（电子设计自动化）第一股"概伦电子披露更新数据后的重组报告书草案，确 定于12月22日召开股东会审议本次交易。这意味着，其通过发行股份及现金收购锐成芯微、纳能微两家 半导体IP（知识产权）公司的交易又进一步。 "交易完成后，概伦电子将正式构建'EDA工具+半导体IP'双引擎发展模式，这对于提升国内EDA与 IP生态的自主可控能力，具有重要产业战略意义。"业内人士表示。 概伦电子的并购进程，正是科创板"硬科技"企业产业整合浪潮的生动缩影。在制度创新赋能、监管 机制优化、服务体系升级的多重利好驱动下，科创板并购重组市场正释放前所未有的生机与活力，以高 质量产业并购助推经济高质量发展。 上交所数据显示，自2024年6月《关于深化科创板改革 服务科技创新和新质生产力发展的八条措 施》（以下简称"科创板八条"）发布以来，科创板上市公司累计新披露并购交易156单，其中发股/可转 债类交易40单、现金重大类交易9单。今年以来，并购重组市场热度持续升温，新增披露并购交易95 单，含发股/可转债类29单、现金重大类7单，两项数据均较上年同期显著提升。从重大资产重组维度 看，2024年发布的17单交易， ...