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下周开幕!超600家国内外龙头企业云集深圳,这场半导体盛宴有哪些看点?
Mei Ri Jing Ji Xin Wen· 2025-10-10 07:48
每经记者|孔泽思 每经编辑|魏文艺 数百家国内外龙头企业将云集深圳,展现全球半导体产业最新成果。10月15日~17日,"2025湾区半导体产业生态博览会"(以下简称"湾芯展")将在深圳会 展中心举行。 《每日经济新闻》记者(以下简称每经记者)从10月10日上午深圳市政府新闻办举行的新闻发布会上获悉,今年的湾芯展将全面对标"更高规格、更广辐 射、更深融合、更优服务"的目标,展览面积超过6万平方米,参展企业超过600家。 深圳市发展和改革委员会主任郭子平在发布会上透露,2024年深圳半导体产业规模达2564亿元,同比增长26.8%。今年上半年产业规模达1424亿元,继续保 持16.9%的快速增长,展现出强劲发展势头。 在国际化方面,湾芯展吸引了来自全球20多个国家超600家龙头骨干企业及知名院校机构参展,并特邀欧洲、东南亚、日韩等地区官方机构和龙头企业代 表,将举办中国制造出海国际供需对接会等多场国际专业论坛。 在品牌化方面,湾芯展着力打造具有全球影响力的"中国半导体自主品牌第一展"。据悉,北方华创、新凯来、拓荆科技、上海微电子、华虹宏力、华润微电 子、华天科技等国内头部企业将悉数参展。 "今年3月28日,新凯来 ...
总价21.74亿元!概伦电子拟购两家公司股权
Mei Ri Jing Ji Xin Wen· 2025-10-08 13:25
9月29日晚间,"国产EDA(电子设计自动化)第一股"概伦电子(SH688206,股价42.21元,市值183.69亿 元)发布公告称,公司拟通过发行股份及支付现金的方式购买成都半导体IP(知识产权)设计企业锐成芯微 100%股权及纳能微45.64%股权,同时向不超过35名投资者募集配套资金10.5亿元,用于支付现金对价 及相关费用。 本次交易总价为21.74亿元,发行股份价格为17.48元/股。本次交易前,锐成芯微持有纳能微54.36%的股 权,纳能微是锐成芯微控股子公司;交易完成后,锐成芯微与纳能微均成为概伦电子的全资子公司。 概伦电子于9月29日召开第二届董事会第十六次会议,8名出席的董事全票通过了上述议案。公司将于12 月18日召开2025年第四次临时股东会,审议包括本次交易整体方案在内的多项议案。 此次收购将加速公司转型 标的公司有业绩下滑风险 在标的公司财务表现方面,2023年、2024年及2025年一季度,锐成芯微(不含纳能微)营收分别为3.5亿 元、2.49亿元和3560.29万元,2024年营收较2023年同比下降28.65%。锐成芯微2023年实现净利润 5506.05万元,2024年净亏 ...
EDA大厂补齐IP版图 概伦电子斥资近22亿元收购锐成芯微与纳能微
Core Viewpoint - The company Gaon Electronics plans to invest nearly 2.2 billion yuan to acquire 100% of Chengdu Ruicheng Chip Micro Technology Co., Ltd. and 45.64% of Nengneng Microelectronics (Chengdu) Co., Ltd., aiming to enhance its position in the semiconductor IP design and authorization market [1][2]. Group 1: Acquisition Details - The total transaction value is 2.174 billion yuan, comprising 989 million yuan in cash and 1.185 billion yuan in shares, with a share issuance price of 17.48 yuan per share [1]. - The company intends to raise 1.05 billion yuan from no more than 35 specific investors to cover the cash portion of the transaction and related costs [1]. - The assessed value of Ruicheng Chip's 100% equity is 1.9 billion yuan, with a value increase rate of 150.06%, while Nengneng Micro's 45.64% equity is valued at 274 million yuan, with a value increase rate of 346.34% [1][2]. Group 2: Business Impact - The acquisition is expected to allow Gaon Electronics to integrate EDA tools with IP cores, enhancing the development of EDA tools and driving optimization [3]. - The transaction will not change the company's control, with KLProTech remaining the largest shareholder, although its shareholding will decrease from 21.06% to 18.22% [3]. - The company anticipates a significant increase in total assets and operating income post-transaction, although the debt ratio will rise by 18.52 percentage points to 38.53% [4]. Group 3: Performance Projections - The performance commitments for the acquired companies project revenues of at least 121 million yuan, 143 million yuan, and 168 million yuan for Ruicheng Chip in 2025, 2026, and 2027, respectively [2]. - Nengneng Micro is expected to generate revenues of at least 73.61 million yuan, 86.85 million yuan, and 100 million yuan in the same years [2]. - Long-term profitability is expected to improve as the acquired companies develop their business and release performance [5].
华大九天(301269.SZ):与摩尔线程于2024年签署战略合作协议
Ge Long Hui· 2025-09-29 08:20
Core Viewpoint - The company Huada Jiutian (301269.SZ) has signed a strategic cooperation agreement with Moore Threads for 2024, focusing on key areas such as chip design automation and GPU technology innovation [1] Group 1: Strategic Cooperation - The strategic cooperation will involve collaboration on chip design automation, rapid iteration of digital and analog circuit design processes, and the promotion of domestic EDA tools [1] - The partnership aims to enhance the rapid evolution and innovation of GPU technology [1] - Current technical and business collaboration is progressing steadily [1]
AI革命EDA,短板在哪里?
半导体行业观察· 2025-09-28 01:05
Core Viewpoint - The article discusses the evolving role of AI in Electronic Design Automation (EDA) tools, highlighting both the potential benefits and limitations of integrating AI technologies into the EDA landscape [1][5]. Group 1: AI Integration in EDA - AI has been utilized in EDA for years, with early adopters like Solido Solutions employing machine learning techniques long before generative AI became mainstream [3][5]. - The recent advancements in AI, particularly in generative and agentic AI, have opened new possibilities for EDA tools, although the economic benefits remain uncertain [3][5]. - AI can enhance the efficiency of EDA tools by optimizing design processes and improving productivity, particularly through reinforcement learning techniques [7][8]. Group 2: Challenges and Requirements - Accuracy and verifiability are critical in EDA tools, as design failures can be costly; thus, transparency in AI decision-making is essential [7][10]. - The complexity of chip design requires AI tools to handle vast design spaces effectively, necessitating a combination of traditional algorithms and AI methods [8][11]. - Trust in AI tools is a significant concern, with the need for clear explanations of AI processes to ensure reliability in high-stakes environments like chip design [9][10]. Group 3: Data and Model Limitations - The effectiveness of AI in EDA is hindered by the lack of sufficient training data, particularly for specialized languages and contexts within the industry [11][12]. - Existing companies have a competitive advantage due to their extensive data resources, making it challenging for startups to enter the EDA tool market [8][11]. - The industry must ensure that the training datasets used for AI models are accurate and relevant to avoid producing erroneous outputs [10][11].
芯片,将如何被颠覆?
半导体芯闻· 2025-09-25 10:21
Core Viewpoint - The integration of AI into EDA tools has the potential to fundamentally change chip design processes, but true disruption will occur when the tasks being executed change rather than just improving productivity [1][5]. Group 1: AI and EDA Integration - AI is expected to disrupt the entire EDA process, but current advancements are more about productivity enhancement rather than true disruption [1]. - The introduction of AI-driven tools could lead to significant changes in chip design, particularly in areas like High-Level Synthesis (HLS), where tools can be trained on large architectures [5]. - The potential for AI to generate code from specifications could expand the user base significantly, possibly by 10 to 100 times, thereby transforming the EDA landscape [5]. Group 2: Challenges and Limitations - The complexity of chip design has increased due to the demands of Moore's Law, leading to compromises primarily in creativity [3]. - There is skepticism about whether AI can independently achieve breakthroughs in parallel processing design due to existing biases in single-processor architectures [3]. - The idea of training semiconductor AI systems on all existing data is impractical, as companies focus on specific chip types and problems, leading to entrenched biases [4]. Group 3: Future of Semiconductor Industry - Disruption in the semiconductor industry is expected to be gradual rather than sudden, with initial changes likely occurring in advanced synthesis tools [5]. - The evolution of AI in semiconductor design will require significant improvements in virtual prototyping and error detection processes [5]. - The introduction of more AI assistants in core processes will address issues like power consumption and cost over time [5].
新思科技总裁盖思新:AI智能体正重塑芯片设计范式
Core Viewpoint - The global EDA giant Synopsys is undergoing a strategic transformation amidst the AI wave and the complexities of the chip industry, focusing on the integration of AI and chip design [1][2]. Group 1: Company History and Market Development - Synopsys entered the Chinese market over 30 years ago, initially promoting EDA tools in academia, and has since grown alongside China's chip industry [1]. - The company made significant investments in China, including a donation of over one million USD worth of Design Compiler software to Tsinghua University in 1995 [1]. Group 2: Strategic Transformation - Synopsys has transitioned from a focus on "chips" to "systems" with the acquisition of Ansys, aiming to lead in the new wave of intelligent systems [2]. - The CEO emphasized that the integration of chip and system capabilities is essential to meet the demands of complex intelligent systems like robotics and autonomous vehicles [2]. Group 3: Technological Breakthroughs - Key areas of technological advancement include system-level design, chip design upgrades, and AI agents, which are reshaping chip engineering design paradigms [4]. - System-level design integrates various domains such as electrical, thermal, and mechanical insights to provide optimized solutions for intelligent systems [4]. - Chip technology upgrades involve combining EDA solutions with multi-physics analysis to address challenges in advanced processes, thereby accelerating chip development cycles [4]. Group 4: AI Integration and Future Vision - Synopsys is pioneering the use of AI as a core capability in modern chip design, developing a framework for intelligent systems that evolve from basic capabilities to advanced decision-making [5]. - The company collaborates with the industry to create differentiated intelligent systems that enhance developer productivity and innovation while addressing talent shortages [5]. - The future of engineering is envisioned as a collaborative effort between humans and intelligent agents, leading to faster, more precise, and higher-quality designs [5]. Group 5: Industry Trends - The shift towards digital twins is fundamentally transforming engineering innovation, with AI-driven systems expected to achieve self-optimization [6]. - The aerospace sector exemplifies the impact of digital twin technology, which can significantly enhance safety and reduce costs in a long-term investment environment [6]. - Semiconductor companies like Synopsys are exploring new solutions through AI and systems thinking to address the complexities and talent gaps in global chip design [7].
数字孪生+AI智能体技术突破 新思科技重塑芯片设计
Di Yi Cai Jing· 2025-09-19 03:08
Core Insights - Synopsys successfully acquired Ansys for $35 billion, marking a strategic shift from "chip" to "system" [4] - The company aims to optimize design across electronic, mechanical, and software fields through digital twin technology and AI agents [4] - Synopsys has achieved global leadership in EDA for advanced process design and multi-physics analysis technologies [6] Group 1: Strategic Developments - The acquisition of Ansys signifies a major transition in Synopsys' business model, focusing on system-level design rather than just chip design [4] - The integration of AI as a core capability in modern chip design is expected to enhance efficiency and support multi-domain optimization [4][5] - Synopsys plans to leverage EDA solutions and IP products to address complex issues in advanced processes, such as power consumption and thermal management [4] Group 2: Industry Context - The CEO of Synopsys emphasized the need for comprehensive solutions that span from chips to systems to meet the demands of complex intelligent systems like robots and autonomous vehicles [5] - TSMC's perspective on digital twins and AI highlights the dual role of supporting AI hardware and meeting customer expectations for integration and efficiency [5] - Synopsys has been active in the Chinese market for over 30 years, contributing to the growth of the semiconductor industry in the region [6]
新思科技中国30周年引领AI智能体工程师重塑芯片设计范式
半导体行业观察· 2025-09-19 01:29
以下文章来源于新思科技 Synopsys ,作者Synopsys 新思科技 Synopsys . 新思科技提供全球领先的芯片到系统设计解决方案,可充分提高客户的研发力和效能。生态合作伙伴相信 新思科技能够开拓创新技术,帮助他们在实现预期性能的前提下更快推出创新产品。 公众号记得加星标⭐️,第一时间看推送不会错过。 从芯片到系统 引领AI智能体工程师重构工程范式 盖思新先生在主题演讲中,重点阐述了新思科技在 2025 年的战略转型与未来发展方向。他指出, 2025 年是新思科技意义非凡的一年,通过完成对Ansys的收购,公司正式确立"从芯片到系统"工程 解决方案全球领导者地位。 2025年9月18日,新思科技中国30周年暨2025新思科技开发者大会在上海西岸国际会展中心隆 重举行。本次大会汇聚了全球行业精英、技术专家、跨界嘉宾及合作伙伴,见证新思科技在华 30年发展成果,共同讨论在智能系统新浪潮中,如何利用更多的数字工具,串联物理世界,再 造工程设计范式,持续引领从芯片到系统技术浪潮。 从初心到未来 引领科技创新 在本届开发者大会上,新思科技全球高级副总裁、新思科技中国区董事长兼总裁葛群回望了公司在中 国的发展 ...
新思科技盘前下跌逾20% 第三财季业绩及指引低于预期
Zheng Quan Shi Bao· 2025-09-10 12:49
Core Viewpoint - Synopsys reported disappointing Q3 earnings, attributing the decline to a slowdown in its design IP business and challenges faced by major foundry clients [1][2] Financial Performance - For Q3, Synopsys achieved a revenue of $1.74 billion, a 14% year-over-year increase, but below the expected $1.77 billion; adjusted EPS was $3.39, down from $3.43 a year ago [1] - The design automation business revenue grew by 23% year-over-year to $1.31 billion, exceeding market expectations of $1.18 billion; however, the design IP business revenue fell by 7.7% to $427.6 million, below the expected $552.1 million [1] - The adjusted operating profit for the quarter was $669.8 million [1] Future Guidance - For Q4, Synopsys expects adjusted EPS between $2.76 and $2.80, significantly lower than the market expectation of $4.50; revenue is projected to be between $2.23 billion and $2.26 billion, compared to the market expectation of $2.1 billion [2] - For the full year, the company anticipates EPS between $12.76 and $12.80, and revenue between $7.03 billion and $7.06 billion, while analysts had expected EPS of $15.13 and revenue of $6.74 billion [2] Industry Context - Synopsys, along with Cadence and Siemens EDA, constitutes the "big three" in the EDA market, collectively holding over 70% market share [2] - In May, the U.S. Department of Commerce imposed export restrictions on the big three, requiring licenses for sales to customers in mainland China, which has impacted business operations [2] - By July, the companies announced the lifting of temporary bans, allowing full access for Chinese customers to their software and technology [2]