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打造全球最强算力 华为徐直军时隔六年再谈芯片进展
Di Yi Cai Jing· 2025-09-18 08:51
Core Viewpoint - Huawei has made significant advancements in self-developed chips and AI infrastructure, showcasing its commitment to enhancing computing power for artificial intelligence applications in the coming years [1][3][5]. Group 1: Chip Development - Huawei plans to release multiple Ascend chips, including the 950PR, 950DT, and Ascend 960 and 970, with the 950PR set to launch in Q1 2026 featuring Huawei's self-developed HBM technology [1]. - The company has emphasized the importance of computing power as a key driver for artificial intelligence, particularly in the context of China's AI development [3]. Group 2: AI Infrastructure - The deployment of over 300 Cloud Matrix 384 supernodes marks a new norm in AI infrastructure, with Huawei focusing on a "supernode + cluster" computing solution to meet the growing demand for computing power [3]. - Huawei introduced the Atlas950 SuperPoD and Atlas 960 SuperPoD supernodes, supporting 8192 and 15488 Ascend cards respectively, positioning them as global leaders in key performance metrics [5]. Group 3: Technological Innovations - The launch of the TaiShan 950 SuperPoD marks Huawei's entry into general computing supernodes, aiming to replace various large and small machines as well as Exadata database systems [5]. - Huawei has overcome significant challenges in interconnecting large-scale supernodes, introducing the UnifiedBus protocol, with plans to open up the Lingqu 2.0 technology specifications in the future [5]. Group 4: Competitive Positioning - Despite facing challenges due to U.S. sanctions and limitations in chip manufacturing capabilities, Huawei leverages its extensive experience in connectivity technology to maintain a competitive edge in supernode capabilities [6].
华为徐直军时隔六年再谈芯片进展
Di Yi Cai Jing Zi Xun· 2025-09-18 05:56
Core Insights - Huawei has unveiled multiple self-developed chip advancements at the 2025 Global Connectivity Conference, including the launch timeline for the Ascend 950PR chip in Q1 2026, which utilizes Huawei's self-developed HBM technology [2] - The concept of "super nodes" has emerged as a new norm in AI infrastructure, with over 300 Cloud Matrix 384 super nodes deployed, emphasizing the critical role of computing power in the future of artificial intelligence in China [4][5] Group 1 - Huawei's newly released Atlas950 SuperPoD and Atlas 960 SuperPoD super nodes support 8,192 and 15,488 Ascend cards respectively, showcasing global leadership in key metrics such as card scale, total computing power, memory capacity, and interconnect bandwidth [7] - The company has also introduced super node clusters, Atlas950 SuperCluster and Atlas960 SuperCluster, with computing power exceeding 500,000 cards and reaching one million cards [7] - Huawei is confident in providing sustainable and ample computing power for the long-term rapid development of artificial intelligence, leveraging the strongest computing power globally through super nodes and clusters [8] Group 2 - Huawei has pioneered the introduction of super node technology into general computing, launching the world's first general computing super node, TaiShan 950 SuperPoD, which aims to replace various large and small machines as well as Exadata database integrated machines [8] - The company has overcome significant challenges in interconnect technology for large-scale super nodes, introducing the UnifiedBus interconnect protocol, with plans to open the Lingqu 2.0 technical specifications in the future [8] - Despite facing restrictions from U.S. sanctions that limit access to TSMC for chip production, Huawei emphasizes its strengths in connectivity technology, which has been developed over 30 years, enabling the achievement of super nodes with tens of thousands of cards [8]
华为徐直军谈芯片三年规划,努力打造“超节点+集群”解决方案
Di Yi Cai Jing· 2025-09-18 04:45
Core Viewpoint - Huawei expresses confidence in providing sustainable and sufficient computing power for the long-term rapid development of artificial intelligence, leveraging its supernodes and clusters with the world's strongest computing capabilities [1][6]. Group 1: Chip Development - Huawei has announced the development progress of several self-developed chips, including the Ascend 950PR, 950DT, and Ascend 960 and 970, with the 950PR set to launch in Q1 2026 [1]. - The company is focusing on creating a "supernode + cluster" computing solution to meet the continuously growing demand for computing power, based on China's available chip manufacturing processes [3]. Group 2: Supernode Infrastructure - The supernode has become a new norm in AI infrastructure construction, with over 300 Cloud Matrix 384 supernodes deployed [3]. - Huawei has released the Atlas 950 SuperPoD and Atlas 960 SuperPoD supernodes, supporting 8192 and 15488 Ascend cards respectively, showcasing global leadership in key metrics such as card scale, total computing power, memory capacity, and interconnect bandwidth [5]. Group 3: Technological Innovations - Huawei has introduced the world's first general-purpose computing supernode, TaiShan 950 SuperPoD, which, combined with the GaussDB distributed database, aims to replace various large and small machines as well as Exadata database integrated machines [6]. - The company has overcome significant challenges in large-scale supernode interconnect technology, launching the UnifiedBus interconnect protocol, with plans to open the Lingqu 2.0 technology specifications in the future [6].