Summary of Conference Call Notes Industry Overview - The conference call discusses the semiconductor and electronic materials industry, particularly focusing on the supply chain dynamics of T glass fiber cloth and CTE (Coefficient of Thermal Expansion) materials, driven by the surge in AI chip demand and competition among major tech companies like Apple, NVIDIA, and AMD [1][3][5]. Key Points and Arguments - **Supply Shortage of T Glass Fiber Cloth**: The demand for T glass fiber cloth has surged due to its applications in IC substrates and advanced packaging, particularly for AI chips and consumer electronics. This has led to a supply shortage, impacting major clients like Apple [3][4]. - **Increased Capital Expenditure by TSMC**: TSMC has raised its capital expenditure from $41 billion to nearly $56 billion, indicating a significant capacity increase expected in 2026, which will help meet high-performance computing demands [7]. - **CTP Market Imbalance**: The CTP (Carrier Tape) market is experiencing a supply-demand mismatch, with lead times for suppliers like Honghe Technology extending from 3 months to 6 months. This imbalance is expected to persist in the short term [8]. - **Future CTP Market Conditions**: The CTP cloth market is projected to remain tight in 2026, with limited incremental supply from major suppliers. Demand from sectors like servers and major tech companies is expected to continue outpacing supply, leading to ongoing shortages and price increases [9]. - **Key Suppliers in CTE Market**: Major suppliers in the CTE cloth market include Zhongtai Technology and Honghe Technology. Honghe has rapidly increased its CTE capacity, becoming a significant supplier in the aerospace sector [10]. - **Emerging Materials and Trends**: The conference highlights the anticipated growth of second-generation cloth driven by Google's VT machine solutions and Ruby architecture, with Q cloth expected to be launched on a large scale in 2027. Emerging materials like copper foil are also noted as areas of interest [2][11]. - **Price Increases in CTP Cloth**: Price increases in CTP cloth have been observed, with Japanese clients raising prices by 20% since January. This trend is likely to influence domestic manufacturers to adjust their pricing in response to strong demand and limited supply [13]. Additional Important Insights - **Competition Among Major Tech Firms**: The competition between top consumer electronics manufacturers and AI chip producers is intensifying, as companies like NVIDIA and Apple take measures to secure their supply chains [4][5]. - **Potential New Suppliers**: The entry of new suppliers into the market, such as Dongcai Technology and Honghe Technology, is being monitored to address the ongoing demand growth and supply constraints [6]. - **Future Growth Expectations for Zhongtai and Hongteng**: Zhongtai Technology is expected to enter a phase of healthy growth across its business segments, while Hongteng is projected to achieve significant production increases and profitability in the coming years [12].

缺 CTE 布吗？20260116 摘要 AI 芯片需求激增导致高端波纤布（low CTE 布）需求大幅增加，挤压了 消费电子客户的供应，AI 和消费电子在 low CTE 布方面存在竞争。 2024 年中 Blackberry 架构对材料模组和 CTE 提出更高要求，2024 年 11 月 COWOS 封装供不应求，2025 年 3 月至 4 月台积电客户和苹果均 需要大量 CTE，2025 年 7 月至 8 月下游基板交付周期被拉长，CO-OP 工艺加剧 CD1 部件需求紧张。 全球仅三家可供应 AI 芯片方向所需的 CD1 部件，中大科技是其中之一。 英伟达争取日东纺供应，苹果评估其他供应商，顶级消费电子厂家与顶 级 AI 芯片厂家争夺产能。 台积电通过台玻公司的 NV 认证，使其成为第二供应链，部分缓解紧缺。 中材科技和宏和科技被认为能够生产 CD1 部件，可能成为未来补充全球 产业链的重要力量。 台积电将资本开支从 410 亿美元增加至 560 亿美元，表明其对未来产 能扩展持积极态度，短期内将推动整个算力相关板块的发展。 Q&A T 克拉斯（CTE）主要应用在哪些领域，为什么会出现供应紧缺？ T ...