【交流纪要】 近期，PCB概念反复活跃，消息面上，AI服务器对PCB产品的性能要求日益提高，进一步推动了HDI市场需求的大幅增长。根据Prismark报告，预计在 2024至2029年间，HDI市场的年均复合增长率将达到6.4%，预计到2029年全球市场规模将增至170.37亿美元。同时，人气公司于周五盘后发布了业绩大增 的公告。生益电子(688183.SH)公告称，2025年上半年实现营业收入37.69亿元，同比增长91%；净利润5.31亿元，同比增长452%。公司拟每10股派发3元 现金红利，合计拟派发现金红利2.47亿元。 除此之外，PCB行业催化不断。此前，在近期的谷歌第二财季报告会中，公司披露其2025年Q2资本支出达224.46亿美元，环比增长30.5%，同比激增 70.2%，为历史新高。其中，约三分之二用于AI训练/推理所需的高端服务器（TPU/GPU），其余投向数据中心与全球骨干网络扩建。公司将全年资本开 支指引由此前的750亿美元上调至850亿美元，并预计2026年仍将维持高投入节奏。 国盛证券电子团队认为，随着GB200服务器下半年进入放量期，GB300出货也将接棒启动，谷歌、亚马逊与Me ...

Core Viewpoint - The PCB industry is experiencing significant growth driven by increasing demand for HDI products, particularly due to advancements in AI server technology and substantial capital investments from major tech companies [3][7]. Market Trends - The HDI market is projected to grow at a compound annual growth rate (CAGR) of 6.4% from 2024 to 2029, reaching a global market size of $17.037 billion by 2029 [3]. - Major companies like Google are increasing their capital expenditures, with a reported $22.446 billion for Q2 2025, marking a 30.5% quarter-over-quarter increase and a 70.2% year-over-year increase [3]. Company Performance - Shengyi Technology (生益电子) reported a 91% year-over-year increase in revenue for the first half of 2025, reaching 3.769 billion yuan, and a 452% increase in net profit to 531 million yuan [3]. Technological Developments - The PCB industry is evolving towards high-frequency, lightweight, and lead-free technologies, with CoWoP (Chip-on-Wafer-on-Panel) becoming a focal point for innovation [5][9]. - CoWoP technology requires Low-CTE (Coefficient of Thermal Expansion) materials to ensure compatibility with high-precision applications, leading to a focus on specialized materials and advanced manufacturing processes [9]. Key Drivers of Demand - The demand for PCBs is primarily driven by two segments: high-performance GPUs led by Nvidia and custom ASIC chips developed by cloud service providers like Google and Amazon [7][8]. - The shift towards custom ASICs is aimed at optimizing workloads and reducing reliance on external suppliers, which is expected to further increase PCB demand [8]. Advanced Packaging and Materials - CoWoP technology transforms PCBs from mere connectors to high-precision "inner substrates," necessitating advanced materials and manufacturing techniques [9]. - The introduction of HVLP (High-Voltage Low-Power) copper foil is essential for high-speed signal transmission, with surface roughness controlled to minimize signal loss [12][13]. Resin Innovations - The industry is moving away from traditional epoxy resins due to high dielectric loss, favoring advanced resin systems like PPO, PTFE, and CH, which offer better electrical performance [14].