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机构报告:Q3全球折叠屏手机出货量同比增长14%
Feng Huang Wang· 2025-12-03 05:14
值得注意的是,面对潜在的竞争变局,现有厂商正在加速探索多折叠形态。三星近期推出的Galaxy Z TriFold被定位为战略性试点产品,虽出货量有限,但其主要意图在于全面商用前验证多折叠架构的耐 用性与软件适配,以此巩固其在技术层面的护城河,为应对未来更激烈的市场竞争做足准备。 针对未来的市场走向,机构预测2025年全年折叠屏出货量将实现约16%的同比增长。行业普遍认为, 2026年将是折叠屏市场的关键爆发期,届时苹果有望携折叠屏产品入局,并在iPhone庞大用户基础的推 动下,开启新一轮高端换机周期。 凤凰网科技讯 12月3日,据市场调研机构Counterpoint Research发布的最新报告显示,2025年第三季度全 球折叠屏智能手机市场迎来显著增长,出货量同比增长14%,创下该品类历史季度新高。随着技术成熟 与高端市场渗透率提升,折叠屏手机在全球智能手机出货量中的占比已攀升至2.5%。 本季度市场的强劲表现主要得益于头部厂商的产品迭代。三星Galaxy Z7系列凭借机身减重、厚度缩减 以及铰链耐用性的提升,成为推动书本式折叠机型扩张的核心动力;华为Mate系列亦保持了稳定的增 长势头。在翻盖式折叠屏 ...
三星芯片,谋求反超
半导体行业观察· 2025-06-22 03:23
Core Insights - Samsung Electronics is focusing on enhancing its competitiveness in high bandwidth memory (HBM) and foundry services, particularly after losing its DRAM market leadership to SK Hynix for the first time in 33 years [2][4] - The company is actively pursuing strategies to regain its market position, including the production of the fifth generation HBM (HBM3E) and plans for the sixth generation HBM (HBM4) [2][4] - Samsung's DRAM production is expected to significantly improve, with a reported yield increase from less than 30% to between 50-70% for the sixth generation DRAM [4][5] Group 1: Strategic Focus - Samsung's Device Solutions (DS) division discussed HBM as a key topic during its global strategy meeting, emphasizing the importance of HBM in its recovery strategy [2] - The company is also working on improving DRAM design and production processes to enhance competitiveness [2][3] Group 2: Market Position and Competition - Samsung's DRAM market share fell to 7.7% in Q1, widening the gap with industry leader TSMC, which holds 67.6% [3] - SK Hynix has achieved an average yield of over 80% for its sixth generation DRAM, while Samsung is rapidly moving towards mass production [6] Group 3: Production and Investment - Samsung is investing in large-scale production lines to ensure immediate production post-testing, leveraging its strong cash reserves and expertise [5] - The company plans to produce DRAM for both mobile and server applications, with a focus on HBM4 production at its Pyeongtaek facilities [5]