Core Insights - TrendForce anticipates that NVIDIA will launch the GB300 chip earlier than Q2 2025, with improvements in computing performance, memory capacity, network connectivity, and power management compared to the GB200 chip [1][2] - The GB300 chip and Compute Tray are expected to begin production in May 2024, with ODMs starting initial engineering sample designs [1] - The GB300 system is projected to gradually increase shipment volumes after the third quarter of 2025 [1] Group 1: Product Specifications and Performance - The GB300 chip will feature several specification upgrades, including enhanced network design to meet higher bandwidth requirements, improving overall computing efficiency [2] - The TDP for the GB300 system is expected to rise to between 135KW and 140KW, with most companies continuing to use liquid-to-air cooling methods to ensure effective heat dissipation [2][3] - The design of cooling components will shift from integrated modules in GB200 to independent cold plates for each chip in GB300, increasing the value of cold plates in the Compute Tray [3] Group 2: Market Dynamics and Supply Chain - The demand for specialized products like the H20 has increased significantly in the Chinese market, driven by the DeepSeek effect [2] - The GB200 and GB300 Rack solutions' market performance will be influenced by factors such as AI server customers' focus on cost-effectiveness and potential shifts towards self-developed ASICs or simpler, lower-cost AI server solutions [3] - The ability of the GB200 and GB300 Rack supply chains to meet deadlines remains uncertain, with actual supply progress and customer demand changes still to be observed [3]

Core Insights - NVIDIA is expected to launch the GB300 chip ahead of schedule in Q2 2025, with improvements in computing performance, memory capacity, network connectivity, and power management compared to the GB200 chip [1] - The GB300 chip and Compute Tray are projected to begin production in May 2025, with ODMs starting initial engineering sample designs [1] - The demand for specialized products in the Chinese market has significantly increased due to the DeepSeek effect [1] Summary by Sections GB300 Specifications - The GB300 NVL72 features upgraded networking specifications to meet higher bandwidth requirements, enhancing overall computing performance [2] - The TDP for the GB300 system is expected to rise to between 135KW and 140KW, with most manufacturers continuing to use liquid cooling methods to ensure effective heat dissipation [2] Cooling Component Design - The cooling plate design for the GB300 will shift from an integrated module to individual chip installations, increasing the value of the cooling plates in the Compute Tray [3] - The change in design will lead to a significant increase in the usage of quick disconnects (QDs), with more suppliers expected to join the market for GB300 [3] Market Dynamics - The GB200 and GB300 Rack solutions' market performance will be influenced by several factors, including the ongoing impact of the DeepSeek effect and potential shifts in customer preferences towards self-developed ASICs or simpler, cost-effective AI server solutions [3]