Core Insights - The recent semiconductor technology roadmap by the Korean Society of Semiconductor Engineers (ISE) predicts advancements down to 0.2nm, indicating a shift in the competitive landscape of the semiconductor industry rather than just a focus on smaller process nodes [1][3]. Device and Process Technology Roadmap - The roadmap outlines a 15-year vision from 2025 to 2040, focusing on nine key semiconductor technology trends, including AI semiconductors, optical interconnects, and quantum computing [1][3]. - The evolution of logic devices aims to maintain performance and power efficiency while reducing size, with a shift from Design-Technology Co-Optimization (DTCO) to System-Technology Co-Optimization (STCO) [4][5]. Logic Technology Trends - Logic device nodes are projected to progress from 2nm in 2025 to 1nm by 2031, and approach 0.2nm by 2040, with key variables including gate length and 3D integration capabilities [5][12]. - The transition from FinFET to Gate-All-Around (GAA) structures is expected, with further innovations like CFET (Complementary FET) enhancing performance through 3D stacking [8][10]. Metal Interconnect Technology - Metal interconnects are becoming a critical performance bottleneck, necessitating innovations in materials and processes to achieve lower resistance and higher reliability [14][15]. - Backside Power Delivery Networks (BSPDN) are anticipated to be introduced around 2028, improving power efficiency and area utilization [14][15]. Memory Technology Trends - The semiconductor industry is shifting focus from computation to memory, with AI and HPC driving demand for high-capacity, high-bandwidth, low-latency, and low-power memory solutions [16][17]. - DRAM technology is evolving towards vertical channel transistors and stacked architectures, with significant advancements expected in the coming years [19][21]. Non-Volatile Memory (NVM) Developments - 3D NAND technology is projected to increase in layer count, reaching up to 2000 layers by 2040, while facing challenges in manufacturing processes [23][25]. - New NVM technologies like PCM and ReRAM are being explored, with PCM seen as having balanced scaling potential [26][27]. AI Semiconductor Roadmap - The AI hardware market is expected to grow significantly, with AI-related computing projected to account for about 20% of global computing demand by 2025 [29][30]. - Performance for training and inference hardware is expected to improve dramatically, with TOPS/W metrics increasing significantly by 2040 [30][31]. Optical Interconnect Technology - Optical interconnects are viewed as a key solution to the limitations of traditional copper interconnects, with applications expanding in data centers and AI-driven systems [33][36]. - The roadmap anticipates the introduction of Co-Packaged Optics (CPO) technology, which integrates optical and electronic components to enhance data transmission capabilities [42][44].