Core Insights - The recent semiconductor technology roadmap by the Korean Society of Semiconductor Engineers (ISE) predicts advancements down to 0.2nm, indicating a shift in the competitive landscape of the semiconductor industry rather than just a focus on smaller process nodes [1][3]. Device and Process Technology Roadmap - The roadmap outlines a 15-year vision from 2025 to 2040, focusing on nine key semiconductor technology trends, including AI semiconductors, optical interconnects, and quantum computing [1][3]. - The evolution of logic devices aims to maintain performance and power efficiency while reducing size, with a shift from Design-Technology Co-Optimization (DTCO) to System-Technology Co-Optimization (STCO) [4][5]. Logic Technology Trends - Logic device nodes are projected to progress from 2nm in 2025 to 1nm by 2031, and approach 0.2nm by 2040, with key variables including gate length and 3D integration capabilities [5][12]. - The transition from FinFET to Gate-All-Around (GAA) structures is expected, with further innovations like CFET (Complementary FET) enhancing performance through 3D stacking [8][10]. Metal Interconnect Technology - Metal interconnects are becoming a critical performance bottleneck, necessitating innovations in materials and processes to achieve lower resistance and higher reliability [14][15]. - Backside Power Delivery Networks (BSPDN) are anticipated to be introduced around 2028, improving power efficiency and area utilization [14][15]. Memory Technology Trends - The semiconductor industry is shifting focus from computation to memory, with AI and HPC driving demand for high-capacity, high-bandwidth, low-latency, and low-power memory solutions [16][17]. - DRAM technology is evolving towards vertical channel transistors and stacked architectures, with significant advancements expected in the coming years [19][21]. Non-Volatile Memory (NVM) Developments - 3D NAND technology is projected to increase in layer count, reaching up to 2000 layers by 2040, while facing challenges in manufacturing processes [23][25]. - New NVM technologies like PCM and ReRAM are being explored, with PCM seen as having balanced scaling potential [26][27]. AI Semiconductor Roadmap - The AI hardware market is expected to grow significantly, with AI-related computing projected to account for about 20% of global computing demand by 2025 [29][30]. - Performance for training and inference hardware is expected to improve dramatically, with TOPS/W metrics increasing significantly by 2040 [30][31]. Optical Interconnect Technology - Optical interconnects are viewed as a key solution to the limitations of traditional copper interconnects, with applications expanding in data centers and AI-driven systems [33][36]. - The roadmap anticipates the introduction of Co-Packaged Optics (CPO) technology, which integrates optical and electronic components to enhance data transmission capabilities [42][44].

Core Viewpoint - The article discusses the future development of silicon-based semiconductor technology as outlined in the "2026 Semiconductor Technology Roadmap" by the Korean Semiconductor Engineers Society, predicting advancements in semiconductor manufacturing processes over the next 15 years, with a focus on achieving below 1 nanometer wafer processes and enhancing the industry's long-term competitiveness [1][2]. Group 1: Semiconductor Technology Advancements - Samsung has recently launched the world's first 2-nanometer Gate-All-Around (GAA) chip, Exynos 2600, and plans to upgrade this technology with a third-generation 2-nanometer GAA process, SF2P+, within two years [2]. - The roadmap anticipates that by 2040, semiconductor processes will reach 0.2 nanometers, utilizing a new transistor architecture called Complementary FET (CFET) alongside a monolithic 3D chip design [2]. - Samsung aims to achieve mass production of 1-nanometer chips by 2029, which will enhance both system-on-chip (SoC) for mobile devices and memory chips, reducing DRAM process from 11 nanometers to 6 nanometers and upgrading high-bandwidth memory (HBM) from 12-layer stacking with 2TB/s bandwidth to 30-layer stacking with 128TB/s bandwidth [2]. Group 2: NAND Flash Memory and AI Chip Development - SK Hynix has developed a 321-layer stacked QLC technology in the NAND flash memory sector, with predictions of achieving 2000-layer stacking in the future [3]. - Current AI processors can reach a maximum computing power of 10 TOPS, but the roadmap forecasts that in 15 years, chips for model training will achieve 1000 TOPS, while chips for inference tasks will reach 100 TOPS [3].