(1) 共封装光学（CPO）——NVIDIA 的下一个大事（2）？ --- (1) Co-Packaged Optics (CPO) – The Next Big Thing for NVIDIA (2)? substack.com/home/post/p-186603237 Substack Disclaimer: This newsletter's content aims to provide readers with the latest technology trends and changes in the industry, and should not be construed as business or financial advice. You should always do your own research before making any investment decisions. Please see the About page for more details. 免责声明：本通讯的内容旨在向读者提供最新的技术趋势和行业变动，不应被视为商业或金融建 议。在做出任何投资决策之 ...

Core Viewpoint - The event "Networking for AI" highlighted the progress of the domestic AI computing power industry chain and emphasized the importance of collaboration among industry players to achieve a closed-loop ecosystem for AI computing power in China [1][3][6]. Group 1: Event Overview - The "Networking for AI" ecosystem salon was successfully held in Shanghai, focusing on the theme of achieving a closed-loop in the domestic AI computing power industry chain [1]. - Key industry players and technical experts from companies like China Mobile, Tencent Cloud, and others participated, showcasing advancements from computing chips to algorithm models and computing services [1][3]. Group 2: Industry Insights - The East China Branch of the China Academy of Information and Communications Technology emphasized the need for technological innovation, improved computing power scheduling systems, and deeper application integration to enhance the quality of the AI computing power industry in Shanghai [3]. - The shift from hardware procurement to ecosystem adaptation and co-construction in intelligent computing centers is crucial for overcoming domestic computing power bottlenecks [4][6]. Group 3: Technological Developments - The article discusses the significance of interconnect technology in AI infrastructure, highlighting its role in enhancing model performance and reducing costs [6][7]. - NVIDIA's advancements in interconnect technology, such as NVLink, are noted as strategic pillars for GPU communication, with high bandwidth capabilities [7][10]. Group 4: Collaborative Initiatives - The OISA (Open Intelligent Sensing Architecture) initiative aims to break traditional bandwidth and latency bottlenecks, facilitating large-scale deployment of AI computing clusters [14][15]. - Major companies like China Mobile and Xinhua San are collaborating to promote the integration of computing power and interconnect technology, with the OISA 2.0 protocol supporting up to 1024 AI chips and achieving TB/s bandwidth [14][15]. Group 5: Future Outlook - The demand for AI computing power is shifting from individual intelligence to collective intelligence, making interconnect technology increasingly vital for enhancing computing density and performance [18]. - The article concludes that the ability to effectively interconnect domestic computing power will be a key factor in winning the AI infrastructure competition in the coming years [18].