Core Viewpoint - The article discusses the current state and future potential of Co-Packaged Optics (CPO) technology in the AI infrastructure landscape, emphasizing that while CPO is seen as a next-generation technology, its widespread adoption is not imminent due to existing technological limitations and market dynamics [1][24]. Group 1: Current Industry Sentiment on CPO - Broadcom's CEO Hock Tan stated that silicon photonics will not play a significant role in data centers in the short term, indicating that CPO is not a leapfrog technology but rather a last resort when existing technologies reach their limits [1][24]. - Major industry players, including Arista, Credo, Marvell, and Lumentum, echoed similar sentiments at the Barclays Global Technology Conference, suggesting a cautious approach towards CPO adoption [1][24]. Group 2: Shift in Industry Focus - The AI industry has shifted its focus from merely increasing computing power to addressing interconnectivity and system-level architecture, as the bottleneck has moved from computational capacity to interconnect capabilities [3][4]. - Companies are now prioritizing terms like Scale-Out, Scale-Up, and Scale-Across, indicating a deeper understanding of the infrastructure bottlenecks in AI [4]. Group 3: Horizontal and Vertical Scaling - Horizontal scaling (Scale-Out) is currently dominated by pluggable optics, with CPO technology not yet widely adopted due to the existing 800G and 1.6T technologies still being the main focus [7][8]. - Vertical scaling (Scale-Up) was initially seen as a promising application for CPO, but its timeline has been pushed back, with large-scale deployment expected around 2027-2028 [9][10]. Group 4: Challenges Facing CPO - CPO faces significant challenges, including higher costs, reliability issues, and power consumption concerns, which have delayed its mass production [18][24]. - The complexity of system design and the need for a mature supply chain are also major obstacles to the widespread adoption of CPO technology [19][24]. Group 5: Alternative Solutions - Transition solutions like LPO, AEC, and ALC are increasingly being recognized as viable alternatives to CPO, with many companies focusing on these technologies to meet current demands [15][25]. - LPO technology has already seen large-scale deployment, providing cost and power advantages, while AEC and ALC are being developed to offer reliability similar to copper cables with the bandwidth of optical solutions [15][25]. Group 6: Future Outlook - Industry predictions suggest that CPO will begin to see deployment in specific high-density systems around 2028, but the current focus remains on optimizing existing technologies [26][27]. - The industry consensus is that CPO will not be the immediate solution until existing technologies reach their limits in terms of power, density, and reliability [27].

Core Viewpoint - The event "Networking for AI" highlighted the progress of the domestic AI computing power industry chain and emphasized the importance of collaboration among industry players to achieve a closed-loop ecosystem for AI computing power in China [1][3][6]. Group 1: Event Overview - The "Networking for AI" ecosystem salon was successfully held in Shanghai, focusing on the theme of achieving a closed-loop in the domestic AI computing power industry chain [1]. - Key industry players and technical experts from companies like China Mobile, Tencent Cloud, and others participated, showcasing advancements from computing chips to algorithm models and computing services [1][3]. Group 2: Industry Insights - The East China Branch of the China Academy of Information and Communications Technology emphasized the need for technological innovation, improved computing power scheduling systems, and deeper application integration to enhance the quality of the AI computing power industry in Shanghai [3]. - The shift from hardware procurement to ecosystem adaptation and co-construction in intelligent computing centers is crucial for overcoming domestic computing power bottlenecks [4][6]. Group 3: Technological Developments - The article discusses the significance of interconnect technology in AI infrastructure, highlighting its role in enhancing model performance and reducing costs [6][7]. - NVIDIA's advancements in interconnect technology, such as NVLink, are noted as strategic pillars for GPU communication, with high bandwidth capabilities [7][10]. Group 4: Collaborative Initiatives - The OISA (Open Intelligent Sensing Architecture) initiative aims to break traditional bandwidth and latency bottlenecks, facilitating large-scale deployment of AI computing clusters [14][15]. - Major companies like China Mobile and Xinhua San are collaborating to promote the integration of computing power and interconnect technology, with the OISA 2.0 protocol supporting up to 1024 AI chips and achieving TB/s bandwidth [14][15]. Group 5: Future Outlook - The demand for AI computing power is shifting from individual intelligence to collective intelligence, making interconnect technology increasingly vital for enhancing computing density and performance [18]. - The article concludes that the ability to effectively interconnect domestic computing power will be a key factor in winning the AI infrastructure competition in the coming years [18].

Core Insights - Bosch signed a memorandum of cooperation with Suzhou Industrial Park for the "Bosch Intelligent Driving Control China Regional Industrial Innovation Project," planning to invest 10 billion RMB over the next five years [1] - The collaboration will focus on deepening cooperation in intelligent assisted driving and smart cockpit areas, aiming to drive key technological innovations and industrialization [1] - This initiative marks a significant upgrade in Bosch's R&D strategy in China, with plans for local development of leading technologies in the intelligent driving sector [1] Group 1 - Bosch has a rich technological foundation in the automotive industry, with industry-leading end-to-end algorithms in intelligent assisted driving and over 100 projects in the smart cockpit field, achieving cumulative shipments of over 2.5 million units [1] - Suzhou is one of Bosch's largest R&D and manufacturing centers in China, encompassing six business divisions and employing over 9,000 staff, recognized as a "Lighthouse Factory" globally and awarded the "China Quality Award" [1] - The partnership with Suzhou has evolved since Bosch Automotive Parts (Suzhou) Co., Ltd. was established in 1999, with milestones including the establishment of the R&D center in 2005 and the launch of the Industry 4.0 project in 2014 [2] Group 2 - Bosch's business development in Suzhou reflects the company's overall growth in China, driven by profound transformations in the global economy and industry, primarily influenced by software, artificial intelligence, and connectivity technologies [3] - The company emphasizes the necessity of maintaining a leading position in China to sustain its global competitiveness, committing to continuous investment and development in Suzhou [3]