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芯海科技(688595.SH):BMS产品在笔记本电脑、无人机等领域的头部客户已实现大批量出货
Ge Long Hui· 2026-02-26 12:13
格隆汇2月26日丨芯海科技(688595.SH)在投资者互动平台表示,公司始终坚持以"模拟+MCU"双平台技 术为核心,持续推动各产品线的商业化落地。目前EC芯片已进入全球主流笔电供应链并实现大规模出 货,super IO芯片作为台式计算机的核心配套芯片,已在客户端顺利量产。针对边缘计算及服务器市场 的轻量级edge BMC管理芯片,目前已实现量产销售,正伴随边缘计算与服务器需求增长而稳步导入更 多客户。压力触控芯片、PD及BMS芯片作为公司成熟产品线,持续贡献营收,其中BMS产品在笔记本 电脑、无人机等领域的头部客户已实现大批量出货。今年核心增长点将主要来自通信与计算机相关芯片 及BMS等核心产品的持续放量。我们将继续聚焦"芯片+算法+场景+AI"的战略,稳步推进各业务线发 展。 ...
芯海科技筹划赴港上市 深化国际化战略布局
Core Viewpoint - Chipsea Technology (688595) plans to issue H-shares and list on the Hong Kong Stock Exchange to enhance its international strategy and diversify financing options [1] Group 1: Financial Performance - In 2024, Chipsea Technology achieved revenue of 702 million yuan, a year-on-year increase of 62.22%, but reported a net loss of 173 million yuan, widening the loss compared to the previous year [1] - The sales of analog signal chain chips reached 181 million yuan in 2024, growing by 137.11%, with BMS sales increasing by 319.56% [2] - The MCU chip segment generated sales of 326 million yuan, up 67.63%, with significant growth in EC and HUB products [2] - AIoT chip revenue was 182 million yuan, reflecting an 18.37% increase, driven by recovery in traditional consumer electronics [2] - International business revenue reached 27.92 million yuan, a remarkable growth of 177.54%, with a gross margin of 41.38%, up 7.38 percentage points year-on-year [2] Group 2: Product Development and Market Position - Chipsea Technology has established a horizontal product layout centered on EC, covering PD, HapticPad, USB HUB, and BMS, and a vertical layout from AI PCs to servers [3] - The company has entered Lenovo's AVL list for EC chips, indicating a move towards integration into the global supply chain [3] - The rise of AI technology in traditional terminals presents significant opportunities for the domestic integrated circuit industry, with increasing demand for high-performance computing chips and analog signal chain chips [3] - Chipsea Technology has successfully achieved domestic substitution for several chip types, including high-precision ADC chips and EC series chips [3]