以"自主创新.应用落地.生态共建"为主题的"第五届中国集成电路设计创新大会暨IC应用生态展(ICDIA创 芯展)"近日在苏州盛大举行并圆满落幕。此次展会围绕AI大算力与数据处理、光子集成电路、超异构计 算RISC-V生态、5G射频/6G半导体、AloT与边缘计算、智能汽车与自动驾驶，分享前沿技术突破与应 用场景，推动创新成果转化与产业链协同，促进芯片、应用方案与整机研发深度合作。 作为国内领先的集成电路EDA软件与晶圆级电性测试设备供应商，广立微（301095）携全线创新产品 及解决方案重磅参展，成为展会焦点。其中广立微的YAD、SemiMind等最新研发成果吸引了来自产业 链上下游的专家、学者及企业代表的广泛关注。 除了YAD这一明星产品，广立微旗下的SemiMind半导体大模型平台，是一个"知识库+智能体"驱动的AI 研发基座。它接入了DeepSeek-R1等大模型，并深度协同，构建了一个开放、灵活、可扩展的智能研发 生态系统。区别于目前通用型大语言模型平台，广立微SemiMind不仅能提供私有化知识库搭建，还可 以结合自身业务理解，落地多个半导体专业智能体，包括设计智能体–DesignRule形成及检查 ...

近日，广立微在上海成功举办了"DE User Forum暨新品发布会"，120多家芯片设计公司、制造企业共聚一 堂，共探半导体良率管理智能化新思路。 发布会上，广立微集中展示了在半导体良率数据管理分析领域的最新研发成果，产品覆盖 YMS、DFT、 Chiplet、车规芯片 等多场景专业工具链，并正式发布了广立微 基于Deepseek的专业AI平台-SemiMind ， 聚焦在良率数据的 智能诊断、精准预测与高效决策 ，为半导体 设计公司及芯片制造企业注 入智能决策新 动能。 0 1 平台全面升级，创新产品崭新亮相 本次发布会面向芯片设计公司及制造企业，广立微基于其在良率数据管理分析领域的核心优势，更新了已有产 品的多项功能，并推出了多款新产品： DE-YMS 3.0良率管理分析平台 升级多个核心功能点，包括 Chiplet多die合封模块、QuickRoot一键式低良分析模块、RMA客诉追溯模 块、SLT板级分析模块、Alarm芯片质量管理模块 等核心功能。 升级后的YMS系统不仅在良率数据分析管理层面为客户提供一站式解决方案，更是 在风险芯片逃逸、芯 片等级分类及质量管理等方面为客户提供系统化解决方案 。过 ...

Investment Rating - The report suggests a positive outlook on the industrial AI sector, highlighting potential breakthroughs in deployment, reliability, and cost-effectiveness [1]. Core Insights - The report emphasizes that the application of AI in industrial settings may progress faster than market expectations, with significant advancements in multi-modal large models and the integration of AI agents [1][6]. - It identifies three core application modes of industrial AI: recognition applications, data modeling and optimization applications, and knowledge reasoning and decision-making applications [25][26]. - The report indicates that the cost of AI token inputs has significantly decreased, while labor costs in the manufacturing sector have been rising, suggesting a potential tipping point for "machine replacement" [27][28]. Summary by Sections 1. Industrial AI - The report discusses the challenges of high data complexity, low tolerance for errors, and high cost sensitivity in industrial AI applications [6]. - It highlights the evolution of multi-modal large models, which are expected to reduce the difficulty of processing unstructured data in industrial scenarios [7][9]. - The integration of large models for guidance and small models for execution is proposed as a collaborative approach to enhance reliability in production processes [22][23]. 2. Industrial AI Middleware - The report notes that industrial AI middleware is in its early penetration phase, addressing the need for seamless iteration between model and data sides [1][2]. - It outlines the commercial progress of industrial AI middleware, with significant contracts awarded, such as a project worth 48.67 million yuan for AI middleware capabilities [39][41]. - The middleware is expected to have high construction barriers, requiring capabilities in computing power integration, model management, and industrial data governance [2][3]. 3. Industrial AI Applications - The report identifies that the maturity of AI applications in production control is leading, with over 57% of applications focused on this area [1][3]. - It highlights specific use cases, such as the AI+PCB solution by Saiyi Information, which automates the entire process from parameter analysis to cost query and quote generation [21]. - The report also mentions the emergence of vertical agent applications in various sectors, indicating a shift towards subscription-based models in industrial AI [22][39]. 4. Investment Recommendations - The report recommends focusing on key players in the industrial AI sector, such as Zhongkong Technology, Saiyi Information, and Zhongwang Software, as they are expected to benefit from the ongoing developments in industrial AI applications [1][2].