主流运作：IDM模式主导核心竞争 IDM模式（垂直整合制造）覆盖芯片设计、晶圆制造、封装测试全产业链，能实现技术协同与品质可控，成为头部企业的首选模 式，8家公司均以IDM模式为核心运作基础。 随着第三代半导体材料碳化硅（SiC）和氮化镓（GaN）在新能源汽车、数据中心、消费电子等领域的广泛应用，国内相关上市公 司在产业链中的运作模式呈现多元化发展趋势。本文基于九家A股/港股上市公司公开资料，系统梳理其在碳化硅与氮化镓领域的 业务布局与运作模式，以供参考。 其中，华润微拥有芯片设计、掩模制造、晶圆制造、封装测试全产业链能力，SiC和GaN器件聚焦新能源汽车、充电桩、数据中心 等领域。SiC JBS G3和SiC MOS G2已实现产品系列化量产，车规级SiC MOS和模块完成头部客户测试认证，12英寸先进工艺平台 为产品迭代提供支撑。 闻泰科技（维权）（安世半导体）是全球领先的IDM龙头，SiC和GaN产品覆盖汽车、工业、消费电子等场景。1200V车规级SiC MOSFET实现国内外客户量产出货，650V高压GaN HEMT技术应用于新能源汽车逆变器，汉堡工厂和上海临港12英寸晶圆厂构建 全球产能布局。 士兰 ...

Financial Performance - The company reported a revenue of 5.218 billion yuan for the first half of 2025, representing a year-on-year increase of 9.62% [2] - The net profit attributable to shareholders was 339 million yuan, up 20.85% year-on-year, while the net profit excluding non-recurring items decreased by 3.95% to 273 million yuan [2] - The gross margin for the first half of 2025 was 25.65%, a decrease of 0.75 percentage points year-on-year, while the net profit margin increased by 0.62 percentage points to 5.35% [2] R&D and Innovation - The company invested 548 million yuan in R&D during the first half of 2025, accounting for 10.50% of its revenue [3] - Significant technological breakthroughs include the completion of the first-generation automotive-grade planar gate high-performance SiC MOSFET products and the successful development of MEMS high-end three-layer structure silicon microphone sensors [3] - The company's self-developed "Buck LED Constant Current Driver QPT4115" won the "2025 Automotive Electronics Golden Chip Award" [3] Market Position and Strategy - The global power semiconductor market is experiencing steady growth, with China holding a 38.6% market share valued at 29.1 billion USD [3] - The company is deepening its AI full-scenario layout, focusing on consumer electronics and automotive smart transformation, as well as cloud AI solutions [4] - The company is accelerating its layout in automotive-grade chips, achieving full-scene coverage in cockpit, body, and autonomous driving applications [4] Production Capacity and Product Development - The company’s 12-inch power device wafer production line in Chongqing has reached full production capacity of 30,000 wafers per month [5] - The Shenzhen 12-inch specialty analog integrated circuit production line is ramping up, with multiple products in mass production on the 90nm platform [5] - Sales revenue from third-generation semiconductor SiC and GaN products has seen rapid growth, with a focus on applications in new energy vehicles, charging piles, and data center power supplies [5]