Group 1 - TSMC plans to invest $100 billion in advanced semiconductor manufacturing in the U.S. by March 2025, including three new fabs, two advanced packaging facilities, and a major R&D center [1] - TSMC is accelerating the construction of its third fab at Fab 21 in Phoenix, Arizona, with plans to build two dedicated buildings nearby for advanced packaging services [1] - The first advanced packaging facility, AP1, is set to begin construction in 2028, while the second facility, AP2, has no specific start date yet [2] Group 2 - The two advanced packaging facilities will focus on CoPoS and SoIC packaging technologies, with CoPoS utilizing a 310×310 mm rectangular panel to improve area utilization and capacity [2] - SoIC technology involves stacking memory chips beneath the processing core, validated in AMD's Ryzen X3D processor, with testing production for CoPoS planned to start in 2026 [2] - AP1 is expected to be operational by the end of 2029 or early 2030, aligning with TSMC's delivery timelines [2]