Core Insights - The three major telecom operators in China have officially launched eSIM mobile services, marking a significant advancement in the eSIM technology for smartphones and creating new growth opportunities for the eSIM industry chain [1] Industry Overview - The global eSIM chip shipment reached 446 million in 2023, covering various products including smartphones and automotive devices. By the end of 2025, the number of global eSIM smartphone connections is expected to reach 1 billion, increasing to 6.9 billion by 2030, which will account for three-quarters of total smartphone connections [1][6] - The eSIM technology is centered around the embedded Universal Integrated Circuit Card (eUICC) chip, which allows for remote SIM configuration and management, enhancing user experience and security [2] Market Dynamics - The demand for eUICC chips is anticipated to grow significantly due to the commercial launch of eSIM services by the three major telecom operators, with the number of domestic eSIM users reaching 3.62 million in 2023, 90% of which are smartwatch users [3] - Domestic companies like Unisoc and Huada Semiconductor are emerging in the eSIM chip design sector, with products widely used in global consumer electronics and IoT devices [2] Supply Chain Opportunities - The etching lead frame, a key material for eSIM chip packaging, has substantial potential for domestic substitution, with the demand for this material expected to rise as eSIM applications accelerate [4] - The WLCSP (Wafer-Level Chip Scale Package) technology is crucial for miniaturizing eSIM chips and is already adopted by major international manufacturers like Apple and Samsung [5] Strategic Positioning - Companies that proactively invest in technology development and establish strong ties with terminal manufacturers and telecom operators are likely to gain competitive advantages in the evolving eSIM industry [6]

Core Insights - The three major telecom operators in China have officially launched eSIM mobile services, marking a significant advancement in the eSIM technology for smartphones and creating new growth opportunities for the eSIM industry chain [1] Industry Overview - The global eSIM chip shipment reached 446 million in 2023, with predictions of 1 billion eSIM smartphone connections by the end of 2025 and 6.9 billion by 2030, accounting for three-quarters of total smartphone connections [1][6] - The eUICC chip is central to eSIM technology, enabling remote SIM configuration and management, which enhances user experience and positions the industry chain for growth [2] Market Dynamics - The demand for eUICC chips is expected to surge due to the commercial launch of eSIM services by telecom operators, with 3.62 million eSIM users in China as of 2023, predominantly in smartwatches [3] - The eSIM technology is anticipated to drive supply chain optimization within the telecommunications industry [1] Company Developments - New Henghui, a semiconductor packaging and testing company, has the capability to adapt its existing IoT eSIM packaging technology for smartphones and other devices, indicating a broad application potential [1][5] - Huada Electronics has developed an eSIM operating system in collaboration with a global eSIM service provider, achieving GSMA eUICC Security Assurance certification, which enhances its market position [2] Technical Advancements - The etching lead frame is a critical material for eSIM chip packaging, with significant potential for domestic substitution as eSIM applications accelerate [4] - The WLCSP (Wafer-Level Chip Scale Package) technology is crucial for miniaturizing eSIM chips and is already adopted by major international manufacturers like Apple and Samsung [5] Future Outlook - Companies that proactively invest in technology development and establish strong ties with terminal manufacturers and telecom operators are likely to gain competitive advantages in the evolving eSIM industry [6]