Top business hubs 2026 by Holafly Top business hubs 2026 by Holafly 爱尔兰都柏林, Feb. 03, 2026 (GLOBE NEWSWIRE) -- 继 2025 年出行需求迅猛回升后，企业正步入更具策略性的出行规划阶段。 时至今日，所有人都已认识到：差旅的意义不再是累积里程或填满日程，而是在正确的时间、为正确的目的、前往正确的地点，让合作水到渠成。 Holafly 数月前发布的最新全球洞察报告显示，八成专业人士预计将在 2026 年进行国际差旅，仅少数人计划完全留在本国境内。 这一趋势的启示不容忽视：商业世界已无边界可言。 但到了 2026 年，企业出行正向一批熟悉而重要的城市聚拢——在这些城市能够迅速敲定交易、高效达成合作、快节奏推进决策，只因生态系统早已在此扎根。 在《2025-2026 年全球 eSIM 与旅行报告》中，Holafly 对逾 10,000 名受访者进行了调研，2026 年的商务枢纽已清晰浮现。 欧洲首选枢纽：北美首选枢纽：南美首选枢纽：亚洲首选枢纽：非洲首选枢纽：大洋洲首选枢纽：1美国加拿大<td styl ...

通勤路上刷刷短视频、看两集电视剧，已经是很多打工人的日常生活，而这种简单的需求下，最怕的其实就是流量涨价。但低价流量套餐时代，或许真的要 一去不复返了。 近期，中国移动、中国电信、中国联通三大运营商同日发布公告，这份公告非常明确地提到一件事，那就是电信服务相关的增值税税目适用范围调整，部分 业务对应的增值税税率要从6%调整到9%。更直白地说，这次的调整会影响到公司的收入和利润。 （图源：中国移动、中国联通、中国电信） 普通用户看到这句话，第一反应肯定就是话费又要涨价了。不过，套餐资费也不是说涨就涨的，至少目前而言，整体流量资费是呈下降趋势。那么增值税税 率调整，到底有什么影响呢？ 三大运营商集体被涨税，套餐资费会涨吗？ 这次三大运营商集体发布的公告，真正引起广泛讨论的其实还是手机套餐资费到底涨不涨？公告里提到，电信服务相关业务的增值税税率，将从原来的6% 调整为9%，而且三大运营商都明确表示，这项变化"会对公司收入和利润产生影响"。如此直白的用词，涨价可能是逃不开了。 实际上，这倒也不是税率一调整，资费就马上要涨的逻辑。 首先，按照财政部、税务总局的新规定，从2026年1月1日起，运营商提供的手机流量、短信和 ...

1月25日，苹果无预警官宣iPhone Air参与「年货狂欢节」，原价7999元的256GB版本立减2000元，叠加优惠券到手5499元。官降后的iPhone Air迅速卖爆， 多个平台显示发货日期延后，付款后15天内发货。 iPhone Air之所以发售三个月就迎来官降，主要还是销量不及预期。数据显示，iPhone Air激活量仅20万左右，远不及iPhone 17系列其他三款机型。对于多数 普通消费者而言，选购这款机型最大的阻碍就是eSIM。 （图源：中国联通） 就在苹果宣布官降的同时，中国联通发布了2026年eSIM的相关计划，预计接下来的一年时间里，每个月至少有一款支持eSIM的新机上线。一边是降价后卖 爆的iPhone Air，一边是中国联通大力推进eSIM新机上市，不难看出，2026年将会是eSIM用户数量暴增的一年。 （图源：荣耀） 那么为何手机厂商选择在2026年集体拥抱eSIM呢？其实这波"新机集体开始支持 eSIM"的根本原因，是这条产业链的三个关键产业终于在同一个时间节点， 找到了新的方向。 这其中最重要的自然是运营商。比如在中国联通公开的计划里，不管是鸿蒙eSIM、安卓eSIM还是苹果 ...

NEW YORK, Jan. 29, 2026 (GLOBE NEWSWIRE) -- Society Pass Incorporated (Nasdaq: SOPA) (the “Company”), Southeast Asia’s next generation digital ecosystem, today announces a US$1.8 million minority investment in Singapore-based telecoms embedded SIM (eSIM) infrastructure and digital connectivity platform, Gorilla Networks Pte Ltd (“Gorilla”). The investment represents Society Pass’s entry into the fast-growing global eSIM market, which Straits Research projects to expand from US$11.2 billion in 2025 to US$25. ...

联通华盛总经理李立新在致辞中表示，中国联通与荣耀、京东长期以来携手并进、协同发展，形成了坚 实的合作伙伴关系。她坚信，在三方的协同赋能与深耕细作下，国内eSIM手机市场必将迎来更广阔的 发展空间。伴随产业链各方合作伙伴的同心耕耘、携手并进，整个手机行业的蓬勃生机，终将随冰雪消 融而喷薄绽放，迎来万象更新的盎然春天。 来源：环球网 2026年1月23日上午，中国联通eSIM尝鲜季2026首款eSIM手机——荣耀Magic8 Pro Air首销仪式暨媒体 答谢会在北京西单联通营业厅隆重举行。中国联通集团市场部副总经理尹少春、联通华盛总经理李立 新、荣耀中国区副总裁徐涛、北京联通副总经理秦洋、联通华盛副总经理陈丰伟、京东3C数码事业群 手机事业二部总经理卢志锋、京东3C数码事业群运营商部总经理庞誉等嘉宾共同出席，见证2026国内 首款eSIM手机正式上市，标志着中国联通与荣耀、京东三方战略合作迈入全新阶段。 荣耀此次推出的Magic8 Pro Air eSIM手机，以"两个实体卡+两个eSIM卡"四卡双待的领先配置，融合极 致轻薄设计与超大容量电池，展现了卓越的科技实力。为助力用户畅享eSIM带来的便捷体验，中国联 ...

Core Insights - The demand for Apple's iPhone Air, which emphasizes extreme thinness and features eSIM technology, is significantly lower than expected, leading to supply chain cutbacks and potential component discontinuation by the end of 2025 [1] - The eSIM technology's adoption in smartphones is hindered by user habits, manufacturer conservatism, and insufficient cooperation from telecom operators, making it a secondary feature rather than a core component [2][3] Group 1: iPhone Air and eSIM Challenges - The iPhone Air's attempt to innovate with a pure eSIM design has not resonated with mainstream consumers, as many are unwilling to pay a flagship price for a device with compromised core specifications [2] - The cumbersome processes associated with eSIM activation and switching further reduce user acceptance of this technology [2] - Current smartphone models from domestic manufacturers, such as OPPO and Huawei, have adopted eSIM but still support physical SIM cards, indicating a cautious approach to eSIM integration [3] Group 2: Shift to AR Glasses - The industry is shifting focus to AR smart glasses as a more suitable application for eSIM technology, with Thunderbird Innovation launching the "Thunderbird X3 Pro Project eSIM" at CES 2026 [4] - The investment from major telecom operators into the AR glasses sector signifies a strategic interest in integrating eSIM technology into new devices [4] - The design of AR glasses, which prioritizes extreme thinness, aligns well with eSIM's no-card feature, potentially enhancing the device's functionality and independence from smartphones [5] Group 3: Future Potential and Challenges - While eSIM technology shows promise for AR glasses, the current focus in the industry remains on improving optical display and spatial computing capabilities rather than communication features [6] - The existing limitations in AR glasses, such as display technology and battery life, need to be addressed before eSIM can become a core necessity [6] - The potential for eSIM to become a necessity in various scenarios, such as cross-border travel and IoT applications, exists but requires further technological and market developments [7]

Core Insights - The demand for Apple's iPhone Air, which emphasizes extreme thinness, is significantly lower than expected, leading to supply chain cutbacks and anticipated component discontinuation by the end of 2025 [1][3] - The iPhone Air's reliance on eSIM technology has not resonated with mainstream consumers due to compromises in battery life, heat management, and other core specifications [1][3] - The slow adoption of eSIM in mobile devices is attributed to user habits, conservative manufacturer strategies, and insufficient cooperation from telecom operators [3][4] eSIM Technology in Mobile Devices - Current mobile devices featuring eSIM, such as OPPO Find X9 Pro and Huawei Mate 80 RS, still support physical SIM cards, indicating a cautious approach from manufacturers [4] - The reluctance to fully embrace eSIM technology is influenced by concerns over user control by telecom operators and uneven global infrastructure support [4] - eSIM is currently viewed as an additional feature rather than a core necessity in mobile devices, as users are accustomed to the convenience of physical SIM cards [4] Shift to AR Smart Glasses - As eSIM faces challenges in mobile applications, the industry is exploring its potential in AR smart glasses, which align better with eSIM's capabilities [5][7] - Thunderbird Innovation's AR glasses, featuring eSIM technology, have received significant investment from Chinese telecom operators, marking a strategic entry into the AR market [6] - The design of AR glasses, which prioritizes extreme thinness, benefits from eSIM's lack of a physical card slot, allowing for more compact designs [7] Market Potential and Challenges - The integration of eSIM in AR glasses is seen as having a clearer potential for adoption compared to mobile devices, given the alignment of form factor and use cases [7][9] - However, the current focus in the AR industry remains on optical display and spatial computing capabilities, with communication technology being a secondary priority [8] - The successful scaling of eSIM in AR devices may depend on advancements in technology and market conditions, such as seamless cross-operator functionalities [9]

2025年10月，距离苹果发布iPhone Air仅一个半月之后，天风证券分析师郭明祺在社交平台发文透露，这款主打极致轻薄的新机需求远低于预期，供应链已 开始砍单，部分零部件预计在2025年底就会停产。 究其原因，iPhone Air希望借eSIM（嵌入式SIM卡）等技术发力打开轻薄细分市场，却因镜头、续航、散热等手机核心配置缩水最终没能成为主流。 这之后，eSIM在手机端的发展走得略显失意，国内华为、OPPO、荣耀等厂商虽陆续在自家旗舰机型或轻薄款上跟进这一技术，但基本采用实体卡与eSIM双 支持的方案，仅将eSIM当作实体卡之外的补充选项，且并未大力推广应用。 手机端难寻突破之际，2026年CES展上的一款产品给eSIM带来了转机——由雷鸟创新在展会现场发布的一款eSIM AR眼镜，给智能眼镜品类以新故事的同 时，也为eSIM创造了一个"上桌"的机会。 01.略显鸡肋 苹果试图用iPhone Air实现手机极致轻薄的形态创新，但市场反馈给出了明确答案：愿意为这份极致体验买单的用户终究是小众。 从实用主义出发，没有多少人愿意花费与旗舰机相近的价格，入手一款续航、屏幕、镜头等核心元器件均做出规格层面的妥协让步 ...

Group 1 - The company plans to issue shares at a price of 61.75 yuan per share to acquire 100% equity of Ruineng Semiconductor, aiming to enhance its power semiconductor industry chain and explore new business growth points [1] - The acquisition will allow the company to integrate its power semiconductor product matrix, quickly fill manufacturing gaps, and improve its semiconductor industry chain layout [1] - Post-acquisition, both parties can leverage their customer resource advantages and share sales channels, accelerating expansion in the industrial and automotive electronics sectors [1] Group 2 - The company is accelerating new product iterations, with high-performance products being delivered in bulk, and is expanding its user base in the FPGA and system-level chip sectors [2] - The aerospace market is expected to grow significantly, with the company actively advancing product development and validation, which will drive collaboration across multiple product lines [2] - The automotive electronics and eSIM businesses are anticipated to form a second growth curve for the company, with a new subsidiary established to focus on automotive electronics [2] Group 3 - The company's stock incentive plan will be implemented, with annual amortization costs projected for 2025-2029, and performance targets set for net profit growth from 2025 to 2028 [3] - The incentive plan aims to enhance employee motivation and support the company's sustained growth [3] Group 4 - Without considering the acquisition, the company expects net profits of 16.7 billion, 19.4 billion, and 24.3 billion yuan for 2025-2027, with corresponding EPS of 2.0, 2.3, and 2.9 yuan [4] - If the acquisition is included, the estimated valuation of Ruineng Semiconductor is around 2.2 billion yuan, leading to a projected total market value of approximately 79 billion yuan [4] - The company maintains a "recommended" rating, anticipating a recovery in the special industry sector and the gradual formation of the automotive electronics business as a second growth curve [4]

Core Viewpoint - The rapid development of computing power infrastructure has made cooling technology a critical factor in releasing AI server performance, with Chinese manufacturers accelerating their entry into the global computing supply chain through advancements in liquid cooling technology [2]. Group 1: Business Transformation - The company is transitioning its smart card business, which has been a cash flow source for over 20 years, to adapt to changing payment landscapes while also exploring new opportunities in eSIM and OTA technologies [3][4]. - The smart card business is shifting from a "scale-driven" model to a "quality-driven" approach, providing safety margins and growth points for the company [4]. Group 2: New Business Growth - The company has rapidly emerged in the semiconductor packaging and materials sector, with strong growth expected to continue into 2025 [5]. - The company's accumulated micro-manufacturing capabilities in smart card chip packaging have been successfully applied to the broader semiconductor packaging materials field, reducing learning costs and risks associated with cross-industry development [6]. Group 3: Liquid Cooling Business - The liquid cooling segment is positioned as a core focus for the company's future, driven by the exponential growth in AI computing demand, as traditional air cooling technologies approach physical limits [6]. - The company has established deep collaborations with leading domestic server and internet companies, producing core liquid cooling components and expanding its product line [6][7]. - The company anticipates explosive growth in its liquid cooling segment by 2026, potentially becoming a significant revenue source [7]. Group 4: Strategic Growth Drivers - The company expects its smart card, semiconductor packaging materials, and liquid cooling businesses to form a "three-horsepower" growth model, achieving synergistic effects [8]. - The company is also exploring external acquisitions to enhance its core competitiveness and sustainable development capabilities [8].