Core Viewpoint - TSMC and Samsung are set to produce the industry's most advanced 2nm chips in the second half of this year, with TSMC having a competitive edge due to higher yield rates compared to Samsung [1][2]. Group 1: TSMC's 2nm Process - TSMC has begun receiving orders for its 2nm process and plans to produce these chips at its Hsinchu and Kaohsiung facilities, utilizing GAA architecture which is expected to improve performance by 10% to 15% and reduce power consumption by 25% to 30% [1][4]. - Major clients for TSMC's 2nm chips include Apple, Nvidia, AMD, Qualcomm, and MediaTek, with MediaTek's CEO hinting at a product design completion by September [1][4]. - TSMC's 2nm defect density has reportedly surpassed that of its 5nm and even 7nm and 3nm processes, indicating a high level of technological maturity [4][5]. Group 2: Samsung's 2nm Process - Samsung aims to start producing 2nm chips in the second half of the year, likely for its Galaxy S26's Exynos 2600 processor, but faces challenges with a lower yield rate of approximately 40% compared to TSMC's 60% [2][1]. - Samsung is leveraging its previous experience with GAA architecture from its 3nm production to improve the yield of its 2nm chips [2]. Group 3: Production Capacity and Future Plans - TSMC's 2nm process is entering trial production, with plans to ramp up to a monthly capacity of 30,000 wafers by the end of 2025, and potentially expand to 120,000 to 130,000 wafers by 2027 [5]. - TSMC is investing over 1.5 trillion NTD to expand its facilities in Hsinchu and Kaohsiung, aiming to create the world's largest semiconductor manufacturing hub [5].

Core Viewpoint - The competition between TSMC and Samsung in the production of advanced 2nm chips is intensifying, with TSMC currently having a higher yield rate, which poses a challenge for Samsung in attracting orders [1][2][3]. Group 1: TSMC's 2nm Progress - TSMC has begun receiving orders for its 2nm process and is expected to start production in H2 2023 at its facilities in Hsinchu and Kaohsiung [1][3]. - The 2nm process utilizes Gate-All-Around (GAA) architecture, which is anticipated to improve performance by 10% to 15% and reduce power consumption by 25% to 30% compared to the 3nm process [1][3]. - Major clients for TSMC's 2nm chips include Apple, Nvidia, AMD, Qualcomm, and MediaTek, with MediaTek's CEO hinting at a product design completion by September 2023 [1][3]. Group 2: Samsung's 2nm Challenges - Samsung aims to start producing 2nm chips in H2 2023, likely for its upcoming Galaxy S26 flagship device, but its yield rate is reportedly around 40%, significantly lower than TSMC's 60% [2][3]. - Samsung is leveraging its previous experience with GAA architecture to improve its 2nm yield rates and attract orders from major tech companies [2]. Group 3: Production Capacity and Future Plans - TSMC's 2nm process is entering trial production, with plans to ramp up to a monthly capacity of 30,000 wafers by Q4 2025, and potentially expand to 120,000 to 130,000 wafers per month by 2027 [4]. - TSMC is investing over 1.5 trillion NTD to expand its facilities in Hsinchu and Kaohsiung, aiming to create the world's largest semiconductor manufacturing hub [4].

Core Viewpoint - TSMC's 2nm process technology is advancing rapidly, showing defect density performance comparable to the 5nm family and surpassing the 7nm and 3nm processes, indicating a high level of technological maturity and strong potential for mass production in the second half of 2025 [1][2]. Group 1: Technological Advancements - TSMC's 2nm process is expected to significantly boost revenue for supply chain partners such as Zhonghua and Shengyang [1]. - The 2nm process will utilize GAAFET architecture, replacing the long-standing FinFET technology, which enhances transistor density and efficiency while reducing leakage current and power consumption [1]. Group 2: Clientele and Market Demand - Major clients for TSMC's 2nm process include leading companies like Apple, NVIDIA, AMD, Qualcomm, MediaTek, and Broadcom [1]. - TSMC's chairman emphasized that the demand for 2nm technology is unprecedented, far exceeding that of the 3nm process [1]. Group 3: Production Capacity and Expansion Plans - TSMC's 2nm process has entered trial production, with plans to start engineering line validation at the Hsinchu Baoshan Fab 20 in Q4 2024, targeting a monthly capacity of 3,000 wafers, and aiming for mass production by Q4 2025 with a capacity of 30,000 wafers per month [2]. - By 2027, TSMC plans to expand the total monthly capacity for 2nm at Hsinchu and Kaohsiung to 120,000 to 130,000 wafers, with a potential to reach 50,000 wafers by the end of 2025 [2]. - TSMC is investing over 1.5 trillion NTD to accelerate the construction of additional fabs in Hsinchu and Kaohsiung, establishing the largest semiconductor manufacturing hub globally [2].