Investment Rating - The report recommends subscription for the company’s IPO [2][3]. Core Insights - The company is a leading fabless integrated circuit design firm, focusing on innovative, reliable, and high-efficiency interconnect solutions for cloud computing and AI infrastructure [2]. - It is projected to be the largest supplier of memory interconnect chips globally by 2024, with a market share of 36.8% [2]. - The demand for high-speed interconnect chips is increasing, particularly in AI servers, which is expected to drive market expansion [2]. - The global AI server shipment is forecasted to grow from 0.5 million units in 2020 to 2.0 million units in 2024, with a compound annual growth rate (CAGR) of 45.2% [2]. - The global high-speed interconnect chip market is expected to grow from USD 15.4 billion in 2024 to USD 49.0 billion by 2030, with a CAGR of 21.2% [2]. Financial Performance - The company recorded revenues of RMB 3,672.3 million, RMB 2,285.7 million, and RMB 3,638.9 million for the years 2022, 2023, and 2024, respectively, with corresponding gross profit margins of 46.4%, 58.9%, and 58.1% [3]. - Net profits for the same years were RMB 1,299.38 million, RMB 450.91 million, and RMB 1,411.78 million [3]. - The IPO price of HKD 106.89 per share represents 59% of the A-share closing price of RMB 162.18 on January 29, 2026, indicating a certain margin of safety in valuation [3].

Investment Rating - The report assigns a rating of 7.1 out of 10 for the IPO of the company, suggesting a recommendation for subscription [12]. Core Insights - The company is a leading fabless integrated circuit design firm focused on providing innovative and reliable interconnect solutions for cloud computing and AI infrastructure, with a significant market share in memory interconnect chips [1]. - The financial performance shows a robust recovery and rapid growth, with projected revenues increasing significantly from 22.86 billion RMB in 2023 to 40.58 billion RMB in the first three quarters of 2025, reflecting a year-on-year growth of 57.8% [2]. - The semiconductor market is expected to grow substantially, with the memory interconnect chip market projected to expand from 1.2 billion USD in 2024 to 5 billion USD by 2030, indicating a compound annual growth rate (CAGR) of 27.4% [3]. - The company leads the memory interconnect chip market with a 36.8% share and ranks second in the PCIe Retimer market, showcasing its strong position and technological advancements [1][4]. Financial Performance - Revenue figures for 2022 to the first three quarters of 2025 are as follows: 36.72 billion RMB, 22.86 billion RMB, 36.39 billion RMB, and 40.58 billion RMB, with a gross margin increasing from 46.4% in 2022 to 61.5% in 2025 [2]. - The adjusted net profit margin reached 52.0% in the first three quarters of 2025, indicating strong profitability [2]. Industry Outlook - The interconnect chip market is projected to grow at a CAGR of over 20%, driven by advancements in memory interface technology and the increasing adoption of PCIe and CXL protocols [3][5]. - The demand for high-speed, reliable interconnect chips is expected to rise significantly due to the explosive growth of the AI industry and related infrastructure [5]. Competitive Advantages - The company is a pioneer in industry standards, having led the development of several international standards related to DDR5 technology, and has a comprehensive product range from DDR2 to DDR5 [4]. - The company’s strong profitability is attributed to product structure optimization and enhanced technological competitiveness, with a gross margin of 61.5% in the first three quarters of 2025 [4]. Market Expansion Potential - The company’s product portfolio is well-positioned to capture the expanding market opportunities in high-speed interconnect chips, with significant growth expected in both memory interconnect and PCIe/CXL interconnect segments [5].

Investment Rating - The report assigns a rating of 7.1 out of 10 for the IPO, suggesting a recommendation for subscription [12] Core Insights - The company is a leading fabless integrated circuit design firm focused on providing innovative and reliable interconnect solutions for cloud computing and AI infrastructure, with a significant market share in memory interconnect chips [1] - The financial performance shows a robust recovery and rapid growth, with projected revenues increasing significantly from 22.86 billion RMB in 2023 to 40.58 billion RMB in the first three quarters of 2025, reflecting a year-on-year growth of 57.8% [2] - The market for interconnect chips is expected to grow substantially, with a compound annual growth rate (CAGR) of 21.2% from 2024 to 2030, driven by advancements in memory interface technology and the adoption of advanced interconnect protocols [3] Company Overview - The company is the largest supplier of memory interconnect chips globally, holding a market share of 36.8%, and ranks second in the PCIe Retimer market [1] - The product range includes a full series of memory interface chips from DDR2 to DDR5, as well as supporting chips for DDR5 [1] Financial Performance - Revenue figures for 2022 to 2025 show a strong upward trend, with gross margins improving from 46.4% in 2022 to 61.5% in the first three quarters of 2025 [2] - The adjusted net profit margin reached 52.0% in the first three quarters of 2025, indicating strong profitability [2] Industry Outlook - The interconnect chip market is projected to grow from $15.4 billion in 2024 to $49 billion by 2030, with memory interconnect chips expected to see a CAGR of 27.4% [3] - The increasing demand for high-performance and reliable interconnect solutions is driven by the rise of AI and cloud computing [5] Competitive Advantages - The company leads in technology and standards, having developed multiple international standards for DDR5 and maintaining a strong position in SerDes technology [4] - The product portfolio is recognized by leading industry clients, with significant revenue growth from new product launches [4] Market Opportunities - The demand for high-speed interconnect chips is expected to rise due to the explosive growth of the AI industry, which aligns with the company's product offerings [5] - The global market for high-speed interconnect chips is maintaining a growth rate of over 20%, providing ample opportunity for market share expansion [5]

Investment Rating - The report recommends subscription for the company’s IPO [2][3] Core Insights - The company is a leading fabless integrated circuit design firm focused on providing innovative, reliable, and high-efficiency interconnect solutions for cloud computing and AI infrastructure [2] - It is projected to be the largest supplier of memory interconnect chips globally in 2024, with a market share of 36.8% [2] - The demand for high-speed interconnect chips is increasing, particularly in AI servers, which is expected to drive market expansion [2] - The global AI server shipment is forecasted to grow from 0.5 million units in 2020 to 2.0 million units in 2024, with a compound annual growth rate (CAGR) of 45.2% [2] - The global high-speed interconnect chip market is expected to grow from USD 15.4 billion in 2024 to USD 49.0 billion by 2030, with a CAGR of 21.2% [2] Financial Performance - The company recorded revenues of RMB 3,672.3 million, RMB 2,285.7 million, and RMB 3,638.9 million for the years 2022, 2023, and 2024, respectively, with corresponding gross profit margins of 46.4%, 58.9%, and 58.1% [3] - Net profits for the same years were RMB 1,299.38 million, RMB 450.91 million, and RMB 1,411.78 million [3] - The IPO price of HKD 106.89 per share represents 59% of the A-share closing price of RMB 162.18 on January 29, 2026, indicating a certain margin of safety in valuation [3]

瀾起科技股份有限公司 Montage Technology Co., Ltd. （於中華人民共和國註冊成立的股份有限公司） 股份代號 : 6809 全球發售 聯席保薦人、保薦人兼整體協調人、整體協調人、 聯席全球協調人、聯席賬簿管理人及聯席牽頭經辦人 （按英文首字母排序） 整體協調人、聯席全球協調人、聯席賬簿管理人及聯席牽頭經辦人 重要提示 重要提示： 閣下如對本招股章程的內容有任何疑問，應尋求獨立專業意見。 Montage Technology Co., Ltd. 瀾起科技股份有限公司 （於中華人民共和國註冊成立的股份有限公司） 全球發售 聯席保薦人、保薦人兼整體協調人、整體協調人、聯席全球協調人、 聯席賬簿管理人及聯席牽頭經辦人 （按英文首字母排序） 整體協調人、聯席全球協調人、 聯席賬簿管理人及聯席牽頭經辦人 香港交易及結算所有限公司、香港聯合交易所有限公司及香港中央結算有限公司對本招股章程的內容概不負責，對其準確性或完整性亦 不發表任何聲明，並明確表示概不就因本招股章程全部或任何部分內容而產生或因倚賴該等內容而引致之任何損失承擔任何責任。 本招股章程連同本招股章程附錄六「送呈香港公司註冊處處長及展示文 ...

香港交易及結算所有限公司、香港聯合交易所有限公司（「香港聯交所」）及香港中央結算有限公 司（「香港結算」）對本公告的內容概不負責，對其準確性或完整性亦不發表任何聲明，並明確 表示概不就因本公告全部或任何部分內容而產生或因依賴該等內容引致的任何損失承擔任何責 任。 本公告不會直接或間接在或向美國（包括其領土及屬地、美國任何州及哥倫比亞特區）發佈、刊 發及派發。本公告並不構成或組成於美國或任何其他司法管轄區購買或認購證券的任何要約或 招攬的一部分。本公告所述證券並無亦將不會根據1933年美國證券法（經不時修訂）（「美國證券 法」）或美國任何州或其他司法管轄區的證券法登記。證券不得於美國境內提呈發售、出售、質 押或轉讓，惟根據美國證券法登記規定豁免及符合任何適用州證券法除外，或(1)僅可根據美國 證券法登記規定豁免向合資格機構買家（定義見美國證券法第144A條）及(2)根據美國證券法S規 例在美國境外提呈發售、出售、質押或轉讓。證券不會在美國公開發售。 本公告僅供參考，並不構成收購、購買或認購證券的邀請或要約。本公告並非招股章程。潛在 投資者於決定是否投資於藉此提呈發售的H股前，應細閱瀾起科技股份有限公司（「本公司 ...

香港聯合交易所有限公司與證券及期貨事務監察委員會對本聆訊後資料集的內容概不負責，對其準確性或 完整性亦不發表任何意見，並明確表示概不就因本聆訊後資料集全部或任何部分內容而產生或因倚賴該等 內容而引致的任何損失承擔任何責任。 的聆訊後資料集 警告 本聆訊後資料集乃根據香港聯合交易所有限公司（「聯交所」）與證券及期貨事務監察委員會（「證監會」）的 要求而刊發，僅用作提供資訊予香港公眾人士。 本聆訊後資料集為草擬本，其所載資料並不完整，亦可能會作出重大變動。 閣下閱覽本文件，即代 表 閣下知悉、接納並向本公司、其聯席保薦人、保薦人兼整體協調人、整體協調人、顧問或包銷團成員 表示同意： 本公司文件根據香港法例第32章《公司（清盤及雜項條文）條例》呈交香港公司註冊處處長登記前，本公司 不會向香港公眾人士提出要約或邀請。倘於適當時候向香港公眾人士提出要約或邀請，準投資者務請僅依 據呈交香港公司註冊處處長註冊的本公司文件作出投資決定；有關文本將於發售期內向公眾刊發。 Montage Technology Co., Ltd. 瀾起科技股份有限公司 （「本公司」） （於中華人民共和國註冊成立的股份有限公司） (a) 本文件僅為 ...

The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Post Hearing Information Pack, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Post Hearing Information Pack. Post Hearing Information Pack of Montage Technology Co., Ltd. 瀾起科技股份有限公司 (the "Company") (A joint stock company ...

The Stock Exchange of Hong Kong Limited and the Securities and Futures Commission take no responsibility for the contents of this Post Hearing Information Pack, make no representation as to its accuracy or completeness and expressly disclaim any liability whatsoever for any loss howsoever arising from or in reliance upon the whole or any part of the contents of this Post Hearing Information Pack. Post Hearing Information Pack of Montage Technology Co., Ltd. 瀾起科技股份有限公司 (the "Company") (A joint stock company ...

香港聯合交易所有限公司與證券及期貨事務監察委員會對本聆訊後資料集的內容概不負責，對其準確性或 完整性亦不發表任何意見，並明確表示概不就因本聆訊後資料集全部或任何部分內容而產生或因倚賴該等 內容而引致的任何損失承擔任何責任。 Montage Technology Co., Ltd. 瀾起科技股份有限公司 （「本公司」） （於中華人民共和國註冊成立的股份有限公司） 的聆訊後資料集 警告 本聆訊後資料集乃根據香港聯合交易所有限公司（「聯交所」）與證券及期貨事務監察委員會（「證監會」）的 要求而刊發，僅用作提供資訊予香港公眾人士。 本聆訊後資料集為草擬本，其所載資料並不完整，亦可能會作出重大變動。 閣下閱覽本文件，即代 表 閣下知悉、接納並向本公司、其聯席保薦人、保薦人兼整體協調人、整體協調人、顧問或包銷團成員 表示同意： 本公司招股章程根據香港法例第32章《公司（清盤及雜項條文）條例》呈交香港公司註冊處處長登記前，本 公司不會向香港公眾人士提出要約或邀請。倘於適當時候向香港公眾人士提出要約或邀請，準投資者務請 僅依據呈交香港公司註冊處處長註冊的本公司招股章程作出投資決定；有關文本將於發售期內向公眾刊 發。 (a) ...