Core Points - The company announced the completion of the cancellation of certain stock options and restricted stocks as part of its equity incentive plan [1][2] - A total of 165,000 shares of restricted stock and 145,200 stock options were subject to cancellation due to the departure of some incentive plan participants [1] - The cancellation of stock options was confirmed by the China Securities Depository and Clearing Corporation Shanghai Branch on June 17, 2025 [2] Summary by Sections - **Equity Incentive Plan**: The company held meetings on May 26, 2025, where it approved the repurchase and cancellation of certain restricted stocks and stock options as per its 2024 equity incentive plan [1] - **Details of Cancellation**: The company will repurchase and cancel 165,000 shares of restricted stock and 145,200 stock options that were granted but not yet exercised [1] - **Regulatory Compliance**: The cancellation process complies with the relevant regulations and will not affect the company's capital structure or financial performance [2] - **Management Commitment**: The management team remains committed to their responsibilities and aims to create value for shareholders despite the cancellations [2]

深圳市景旺电子股份有限公司董事会 2025 年 6 月 19 日 公司已向中国证券登记结算有限责任公司上海分公司提交了注销上述股票 期权的申请，经中国证券登记结算有限责任公司上海分公司审核确认，上述激励 计划 145,200 份股票期权的注销业务已于 2025 年 6 月 17 日办理完毕。 本次注销部分股票期权事项符合《上市公司股权激励管理办法》和《激励计 划》的相关规定，不会影响公司股本结构，不会对公司的财务状况和经营成果产 生实质性影响，也不会影响公司管理团队的勤勉尽职及稳定性。公司管理团队将 继续认真履行工作职责，努力为股东创造价值。 特此公告。 | 证券代码：603228 | 证券简称：景旺电子 | | 公告编号：2025-059 | | --- | --- | --- | --- | | 债券代码：113669 | 债券简称：景 23 | 转债 | | 深圳市景旺电子股份有限公司 关于股权激励计划部分股票期权注销完成的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 深圳市景旺电子股份有限公司（以下简称"公司" ...

| 证券代码：603228 | 证券简称：景旺电子 | | 公告编号:2025-058 | | --- | --- | --- | --- | | 债券代码：113669 | 债券简称：景 23 | 转债 | | 深圳市景旺电子股份有限公司 关于使用部分闲置募集资金进行现金管理到期赎回 的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 深圳市景旺电子股份有限公司（以下简称"公司"）于 2025 年 4 月 28 日召 开了第四届董事会第二十八次会议、第四届监事会第十八次会议，同意公司及子 公司景旺电子科技（珠海）有限公司使用不超过人民币 30,000 万元闲置募集资 金进行现金管理，其中使用"景 20 转债"闲置募集资金不超过 5,000 万元，使 用"景 23 转债"闲置募集资金不超过 25,000 万元。使用期限自董事会审议通过 之日起 12 个月内有效。在上述额度及期限内，资金可循环滚动使用。 具 体 内 容 详 见 公 司 2025 年 4 月 29 日 披 露 于 上 海 证 券 交 易 所 网 站 （www. ...

总理财额度 30,000.00 | 证券代码：603228 证券简称：景旺电子 | | | 公告编号:2025-058 | | | | | --- | --- | --- | --- | --- | --- | --- | | 债券代码：113669 债券简称：景 23 转债 | | | | | | | | 深圳市景旺电子股份有限公司 | | | | | | | | 关于使用部分闲置募集资金进行现金管理到期赎回 | | | | | | | | 的公告 | | | | | | | | 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 | | | | | | | | 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 | | | | | | | | 深圳市景旺电子股份有限公司（以下简称"公司"）于 2025 年 4 28 日召 | 月 | | | | | | | 开了第四届董事会第二十八次会议、第四届监事会第十八次会议，同意公司及子 | | | | | | | | 30,000 公司景旺电子科技（珠海）有限公司使用不超过人民币 万元闲置募集资 | | | | | | | | 金进行现 ...

Group 1 - The company announced the use of idle raised funds to temporarily supplement working capital, with a maximum amount of 200 million yuan allocated for this purpose [1][2] - The decision was approved during the 28th meeting of the 4th Board of Directors and the 18th meeting of the 4th Supervisory Board held on April 28, 2025 [1] - The company has returned the temporarily supplemented idle raised funds to the designated account and will notify the sponsor institution and representative promptly [2] Group 2 - The company will fulfill its information disclosure obligations regarding the return of the temporarily supplemented funds before the due date [2]

| 证券代码：603228 | 证券简称：景旺电子 | | | 公告编号：2025-056 | | --- | --- | --- | --- | --- | | 债券代码：113669 | 债券简称：景 | 23 | 转债 | | 深圳市景旺电子股份有限公司 关于独立董事辞职的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 二、独立董事离任对公司的影响 深圳市景旺电子股份有限公司（以下简称"公司"）董事会近日收到公司独立 董事贺强先生递交的书面辞职报告。根据《上市公司独立董事管理办法》相关规 定，独立董事连续任职不得超过六年，贺强先生自 2019 年 6 月 14 日起担任公司 独立董事至今已满六年，故申请辞去第四届董事会独立董事及专门委员会职务。 鉴于贺强先生辞职后将会导致公司董事会中独立董事人数少于董事会人数的三 分之一，相关董事会专门委员会中独立董事所占比例不符合《上市公司独立董事 管理办法》相关规定，根据《公司法》《上市公司独立董事管理办法》《上海证券 交易所上市公司自律监管指引第 1 号——规范运作》及《公司 ...

| 证券代码：603228 | 证券简称：景旺电子 | | 公告编号:2025-057 | | --- | --- | --- | --- | | 债券代码：113669 | 债券简称：景 23 | 转债 | | 深圳市景旺电子股份有限公司 关于子公司使用募集资金临时补充流动资金 提前归还的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 一、使用暂时闲置募集资金补充流动资金情况 深圳市景旺电子股份有限公司（以下简称"公司"）于 2025 年 4 月 28 日召 开了第四届董事会第二十八次会议、第四届监事会第十八次会议，审议通过了《关 于子公司使用部分闲置募集资金临时补充流动资金的议案》，同意子公司景旺电 子科技（珠海）有限公司（以下简称"珠海景旺"）根据业务发展需要和营运资 金需求，使用不超过 20,000.00 万元闲置募集资金临时补充流动资金。详见公司 于 2025 年 4 月 29 日披露的《景旺电子关于子公司使用部分闲置募集资金临时补 充流动资金的公告》（公告编号：2025-034）。 二、募集资金归还情况 20 ...

Industry Overview - Substrate-like PCB (SLP) is a new type of circuit board positioned between traditional PCBs and semiconductor packaging substrates, experiencing rapid development in recent years [1][4] - The global SLP market size is projected to reach 31.5 billion yuan in 2024, with a year-on-year growth of 6.06% [1][15] - SLP technology meets the increasing demand for miniaturization and high performance in electronic products, with line width/spacing reduced to 20/35 microns, allowing for double the component density compared to traditional HDI [1][15] Industry Development History - The SLP industry in China has gone through four stages: the initial stage (2010-2016), the startup phase (2017-2020), the scaling phase (2021-2023), and the internationalization phase (2024-present) [4][5][6] - The introduction of SLP technology by Apple in the iPhone X marked its commercial application, leading to increased demand from consumer electronics [4][5] - Chinese manufacturers like Pengding Holdings and Shenzhen Sannan Circuit began to break the technological monopoly of international firms during the startup phase [5][6] Industry Chain - The upstream of the SLP industry chain includes raw materials (copper foil, resin, glass fiber cloth, etc.) and production equipment (laser drilling machines, plating equipment, etc.) [9] - The midstream involves the manufacturing of SLP, while the downstream applications include smartphones, wearable devices, automotive electronics, data centers, and 5G communication devices [9] Market Size - The SLP market is expected to continue growing, driven by advancements in technology and increasing demand for high-density circuit boards [15][24] - The market is projected to expand further by 2030, particularly in China, due to the proliferation of 5G networks and upgrades in consumer electronics [24] Key Companies' Performance - Pengding Holdings, a leading PCB manufacturer, has achieved significant revenue growth, with SLP-related income accounting for over 45% of total revenue in 2024 [21] - Shenzhen Sannan Circuit has made advancements in SLP technology, achieving mass production of 25μm line width/spacing and continuously pushing towards 20μm [19][21] - Shenzhen Jingwang Electronics has established a strong position in the high-end PCB market, with a focus on SLP technology and significant revenue growth in 2025 [19][21] Industry Development Trends - The SLP technology is advancing towards higher density and finer lines, with line width/spacing shrinking to below 15/15 microns for applications in AR/VR and 6G communication [6][23] - The demand for high-performance PCBs is expected to drive industry expansion, with companies focusing on capacity expansion and technological upgrades to meet market needs [24][25] - Increased competition is anticipated, leading to higher market concentration, with leading companies solidifying their positions through innovation and market integration [25]

深圳市景旺电子股份有限公司 2023 年公开发行可转换公司债券 2025 年第一次临时受托管理事务报告 债券受托管理人 （中国（上海）自由贸易试验区浦明路 8 号） 股票简称：景旺电子 股票代码：603228 债券简称：景 23 转债 债券代码：113669 二〇二五年六月 重要声明 本报告依据《公司债券发行与交易管理办法》、《可转换公司债券管理办法》 等相关规定及《深圳市景旺电子股份有限公司公开发行可转换公司债券募集说明 书》（以下简称"《募集说明书》"）、《深圳市景旺电子股份有限公司 2023 年公开发行可转换公司债券之受托管理协议》（以下简称"《受托管理协议》"） 的约定，深圳市景旺电子股份有限公司（以下简称"发行人"、"景旺电子"或 "公司"）公开信息披露文件以及发行人提供的相关资料等，由本次债券受托管 理人民生证券股份有限公司（以下简称"民生证券"、"受托管理人"）编制。 本报告仅对本次债券受托管理的有关事项进行说明，不构成针对本次债券的 任何投资建议。投资者应对相关事宜做出独立判断，而不应将本报告中任何内容 据以作为受托管理人所作的承诺或声明。在任何情况下，投资者依据本报告所进 行的任何作为或不作 ...

Core Viewpoint - Shenzhen Jingwang Electronics Co., Ltd. has successfully issued convertible bonds, raising a total of RMB 1.154 billion, with the bonds set to trade on the Shanghai Stock Exchange starting May 9, 2023 [3][4]. Group 1: Bond Issuance Details - The company issued 11.54 million convertible bonds, each with a face value of RMB 100, totaling RMB 1,154 million [3][4]. - The bonds have a maturity period of 6 years, from April 4, 2023, to April 3, 2029 [4]. - The coupon rates for the bonds are structured to increase over the years, starting at 0.30% in the first year and reaching 2.00% by the sixth year [4][5]. Group 2: Conversion and Interest Payment - The initial conversion price for the bonds is set at RMB 25.71 per share, with the current conversion price adjusted to RMB 24.71 per share [6]. - Interest payments will be made annually, with the first payment occurring one year after the issuance date [5]. - The bondholders will receive a cash dividend of RMB 0.80 per share for the 2024 fiscal year, which will affect the conversion price [6][7]. Group 3: Impact of Profit Distribution - The adjustment of the conversion price to RMB 23.91 per share is due to the cash dividend distribution, effective June 11, 2025 [7]. - The profit distribution is expected to support the company's stable development and aligns with relevant regulations [8].