Core Viewpoint - Jingwang Electronics has shown significant stock performance with a year-to-date increase of 110.02%, despite a recent decline of 9.81% over the last five trading days [1] Financial Performance - For the first half of 2025, Jingwang Electronics reported revenue of 7.095 billion yuan, representing a year-on-year growth of 20.93%. However, the net profit attributable to shareholders decreased by 1.06% to 650 million yuan [2] - Cumulatively, the company has distributed 3.057 billion yuan in dividends since its A-share listing, with 1.593 billion yuan distributed over the past three years [3] Shareholder Information - As of June 30, 2025, the number of shareholders for Jingwang Electronics was 41,600, a decrease of 15.29% from the previous period. The average number of tradable shares per shareholder increased by 18.29% to 22,190 shares [2] - The top ten circulating shareholders include Hong Kong Central Clearing Limited, which holds 12.1388 million shares (a decrease of 671,000 shares), and Southern CSI 500 ETF, which increased its holdings by 2.3751 million shares to 7.2043 million shares [3] Market Activity - On October 15, 2023, Jingwang Electronics' stock price rose by 2.01% to 56.79 yuan per share, with a trading volume of 719 million yuan and a turnover rate of 1.32%. The total market capitalization reached 55.926 billion yuan [1] - The company has appeared on the "Dragon and Tiger List" six times this year, with the most recent appearance on September 12 [1]

一、"景 23 转债"发行上市情况 证券代码：603228 证券简称：景旺电子 公告编号:2025-117 深圳市景旺电子股份有限公司 关于"景 23 转债"转股及赎回结果暨股份变动公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： "景 23 转债"累计转股情况：截至赎回登记日（2025 年 9 月 30 日）， 累计已有人民币 1,153,111,000 元"景 23 转债"转换为公司 A 股股票，累计转股 数量为 48,211,988 股，占"景 23 转债"转股前公司已发行股份总额 841,872,422 股的 5.7268%。 "景 23 转债"本季度转股情况：自 2025 年 7 月 1 日至赎回登记日（2025 年 9 月 30 日），共有人民币 1,099,340,000 元"景 23 转债"转换为公司 A 股股票， 转股数量为 45,977,328 股。 "景 23 转债"赎回情况：截至赎回登记日（2025 年 9 月 30 日），尚未 转股的"景 23 转债"余额为人民币 889,000 ...

证券代码：603228 证券简称：景旺电子 公告编号：2025-116 深圳市景旺电子股份有限公司 关于 2024 年股票期权与限制性股票激励计划 2025 年第三季度自主行权结果暨股份变动公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： ● 股票期权自主行权情况：2025 年第三季度，公司 2024 年股权激励计划 首次授予股票期权激励对象通过自主行权方式已在中国证券登记结算有限责任 公司上海分公司共计登记股份数量为 2,384,396 股，占 2024 年股权激励计划首次 授予股票期权第一个可行权期总量的 97.0327%。 ● 本次行权股票上市流通时间：激励对象行权所得股票于行权日（T 日） 后的第二个交易日（T+2）日上市交易。 一、本激励计划已履行的审议程序 1、2024 年 4 月 19 日，公司召开第四届董事会第十八次会议，会议审议通 过了《2024 年股票期权与限制性股票激励计划（草案）》及其摘要、《2024 年股 票期权与限制性股票激励计划实施考核管理办法》以及《关于提请股东大会授权 董事 ...

Core Insights - The HDI board market is experiencing significant growth driven by global digital transformation and the trend towards electric and intelligent vehicles. China, as a major manufacturing and consumption market, is seeing rapid development in the HDI board industry, with a projected market size of 45.568 billion yuan in 2024, reflecting a year-on-year increase of 16.5% [1][6]. - The market is expected to continue expanding, reaching 50.908 billion yuan by 2025, with an 11.7% year-on-year growth [1][6]. Industry Overview - HDI boards, or High-Density Interconnect boards, utilize micro-blind buried hole technology and lamination processes to enhance circuit density, catering to the miniaturization and high-speed signal transmission needs of electronic products. They are primarily used in mobile phone motherboards, digital devices, and automotive electronics [3][4]. - The HDI board industry can be categorized into three types based on lamination complexity: low-end HDI (single lamination), high-end HDI (two or more laminations), and any-layer HDI (most complex) [3]. Market Size and Growth - The global HDI board market is projected to reach 12.8 billion USD in 2024, with a year-on-year increase of 15.3%, and is expected to grow to approximately 14.3 billion USD by 2025 [5][6]. Competitive Landscape - The HDI board industry is dominated by overseas and Taiwanese manufacturers, while mainland Chinese companies are rapidly catching up. Key players in mainland China include companies like Fangzheng Technology, Bomin Electronics, and Shenghong Technology, which are increasing their R&D investments and expanding high-end production capacities [7][8]. Development Trends - The HDI board market is shifting towards higher-end products, driven by the demand for advanced mobile devices and the adoption of AnyLayer HDI motherboards in Android smartphones. The trend indicates a growing need for high-layer HDI boards as high-end smartphone sales increase [9]. - The application fields for HDI boards are expanding, particularly in the rising electric vehicle sector, which requires stable and reliable circuit connections for various systems [10]. Additionally, the medical device sector is also a growing market for HDI boards due to the demand for miniaturized and intelligent devices [11]. - Environmental considerations are leading to a trend towards green manufacturing practices in the HDI board industry, with a focus on reducing harmful substances and optimizing production processes [12].

Core Viewpoint - The recent financing and expansion plans of major PCB companies are primarily driven by the increasing demand for AI technologies and high-end PCB products, indicating a significant shift in the industry towards advanced manufacturing capabilities [1][3][6]. Group 1: Company Expansion Plans - Huadian Co. disclosed a new project for high-end printed circuit boards (PCBs) with an investment of 4.3 billion yuan, which began construction in June 2023 and is expected to start trial production in the second half of 2026 [1]. - Shenghong Technology completed a fundraising round of 1.9 billion yuan, with allocations of 850 million yuan for an AI HDI project in Vietnam and 500 million yuan for a high-layer PCB project in Thailand [1]. - Eight PCB manufacturers have announced new financing and expansion plans since July 25, focusing on enhancing their capabilities in HDI, HLC, and SLP products [1][2]. Group 2: Market Demand and Trends - The demand for high-density and high-layer PCBs is expected to grow significantly due to advancements in AI, satellite communications, and automotive electronics, with the HDI market projected to reach 17.037 billion USD by 2029, reflecting a compound annual growth rate of 6.4% [6]. - The complexity of PCB production processes is increasing, necessitating higher precision and efficiency in manufacturing equipment, particularly in plating and drilling stages [6][7]. - The shift towards high-end PCB products is driving upgrades in core materials such as copper foil, electronic cloth, and resin, which are essential for meeting the demands of high-speed signal transmission [7]. Group 3: Investment Opportunities - The expansion of PCB production is anticipated to create a favorable cycle for the industry, benefiting upstream material and equipment companies as demand for high-end PCBs rises [7]. - The global market for PCB-specific equipment is expected to reach 10.765 billion USD by 2029, with a compound annual growth rate of 8.7% from 2024 to 2029 [6].

Core Viewpoint - The company has announced the early redemption of its convertible bond "Jing 23 Convertible Bond" due to the stock price meeting the conditional redemption criteria, with significant implications for investors regarding conversion and redemption options [2][4][7]. Redemption Terms - The "Jing 23 Convertible Bond" will stop trading on September 26, 2025, with the last conversion date set for September 30, 2025 [2][15]. - The redemption price is set at 100.515 CNY per bond, which includes the face value and accrued interest [9][10]. - The accrued interest is calculated based on a 1.0% annual coupon rate over 188 days, resulting in 0.515 CNY per bond [9][10]. Conditional Redemption Trigger - The bond's conditional redemption was triggered as the stock price exceeded 130% of the conversion price for 15 trading days from August 20 to September 9, 2025 [4][7]. - The company’s board decided not to exercise the early redemption right previously but has now opted to redeem the bonds due to current market conditions and financial strategy [3][4]. Redemption Process - The redemption registration date is September 30, 2025, with the redemption payment date scheduled for October 9, 2025 [4][14]. - All bonds registered by the redemption date will be frozen and redeemed at the specified price [13][14]. Tax Implications - Individual investors will be subject to a 20% tax on the interest income from the bonds, affecting the net amount received upon redemption [11][12]. - Non-resident enterprises are exempt from corporate income tax on the interest income from these bonds until December 31, 2025 [12]. Trading and Listing - The bonds will be delisted from the Shanghai Stock Exchange on October 9, 2025, following the completion of the redemption process [16].

Investment Highlights - PCB technology is evolving in materials, processes, and architecture, driving continuous value growth. The demand from AI servers, high-speed communication, and automotive electronics is pushing PCB technology upgrades across these three dimensions [2][3][9] - The upstream high-end materials are in short supply, and cost increases are being passed down to downstream PCB manufacturers. The core materials for copper-clad laminates (CCL) include copper foil, resin, and fiberglass cloth, with cost shares of 39%, 26%, and 18% respectively [4][6][46] - The PCB market is on an upward cycle, driven by AI, with both volume and price increasing across various sectors. The global PCB market is expected to reach $94.7 billion by 2029, with a CAGR of 5.2% from 2024 to 2029 [7][8] PCB Technology Evolution - The evolution of PCB technology is driven by high line density and electrical performance. PCBs serve as critical interconnects in electronic products, supporting various components and providing electrical connections [10][11] - The PCB production technology is continuously updated in materials, processes, and architecture, with significant advancements in high-density interconnects and high-performance materials [18][19][20] Upstream Materials - The core materials for CCL are copper foil, resin, and fiberglass cloth, which significantly influence signal transmission speed and loss. The CCL accounts for 40% of the total PCB cost [39][46] - The global CCL industry is highly concentrated, with a CR10 of 77% in 2024, indicating a strong oligopoly in the market [41] - The demand for high-end HVLP copper foil and ultra-thin copper foil is surging, with Japanese and Taiwanese manufacturers dominating the high-end market [60][62][63] Market Dynamics - The PCB industry is experiencing a shift towards Southeast Asia, with China's share of the global PCB market expected to be around 50% by 2029. The industry has matured, with significant competition and a fragmented market [17] - The demand for special fiberglass cloth is increasing due to AI and high-speed communication, leading to upgrades in low-dielectric and quartz cloth [66][70] Future Outlook - The PCB market is expected to benefit from the ongoing technological advancements and increasing demand from AI and high-speed communication sectors. The integration of advanced packaging technologies like CoWoP and embedded power chips is anticipated to further enhance PCB value [23][32][34]

| 证券代码：603228 | 证券简称：景旺电子 | 公告编号：2025-115 | | --- | --- | --- | | 债券代码：113669 | 债券简称：景 转债 23 | | 深圳市景旺电子股份有限公司 关于实施"景 23 转债"赎回暨摘牌的最后一次提示 性公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 自 2025 年 9 月 26 日起，"景 23 转债"停止交易。 最后转股日：2025 年 9 月 30 日 截至 2025 年 9 月 29 日收市后，距离 9 月 30 日（"景 23 转债"最后转股日， 含当日）仅剩 1 个交易日，9 月 30 日为"景 23 转债"最后一个转股日。 本次提前赎回完成后，"景 23 转债"将自 2025 年 10 月 9 日起在上海证 券交易所（以下简称"上交所"）摘牌。 投资者所持的"景 23 转债"除在规定时限内按照 23.91 元/股的转股价格 进行转股外，仅能选择以 100 元/张的票面价值加当期应计利息（即 100.515 元/ 张）被 ...

Core Viewpoint - Jingwang Electronics reported a net profit attributable to shareholders of 650 million yuan for the first half of 2025, a year-on-year decrease of 1.06%. The company is actively embracing the opportunities and challenges brought by the AI wave, achieving significant results in various downstream application fields [1]. Group 1: Financial Performance - The net profit for the first half of 2025 was 650 million yuan, reflecting a decline of 1.06% compared to the previous year [1]. Group 2: Industry Trends and Opportunities - Global cloud vendors continue to maintain high capital expenditures, leading to a surge in demand for AI servers and related innovative solutions, resulting in a shortage of high-speed materials, high-end HDI, and HLC products [1]. - The penetration rate of AI applications in automotive sectors is increasing with the accelerated implementation of advanced intelligent driving, indicating a broad growth space for the company's automotive business in the future [1]. Group 3: Strategic Investments - The company plans to invest an additional 5 billion yuan in Zhuhai Jinwan to build high-end production capacity [1]. - The company has a solid foundation in the AIPCB field, and the expansion of high-end capacity is expected to benefit from the sustained growth in downstream AI computing power [1].

Investment Rating - The report assigns a "Buy" rating for the company, marking the first coverage of the stock [1][7]. Core Insights - The company is actively embracing opportunities and challenges brought by the AI wave, achieving significant results in various downstream application areas, particularly in data centers and AI servers [3][4]. - The company has become the world's largest automotive PCB supplier in 2024, with expectations for substantial growth in the automotive business due to increasing penetration of AI applications in vehicles [3][4]. - The company is expanding its high-end PCB production capacity to meet the growing demand from AI servers and related fields, with significant investments planned for upgrading existing facilities and constructing new ones [6][7]. Summary by Sections Financial Performance - In the first half of 2025, the company achieved revenue of 7.095 billion yuan, a year-on-year increase of 20.93%, while the net profit attributable to shareholders was 650 million yuan, a slight decline of 1.06% [2]. - The forecasted revenues for 2025, 2026, and 2027 are 14.981 billion yuan, 17.705 billion yuan, and 20.893 billion yuan, respectively, with corresponding EPS of 1.57 yuan, 2.04 yuan, and 2.56 yuan [7][9]. Market Position and Strategy - The company is a core supplier of PCBs for AI servers, with competitive advantages in high-end PCB mass production capabilities and established long-term strategic partnerships with leading global clients [4][6]. - The company plans to invest 5 billion yuan in its Zhuhai Jinwan base to enhance high-end production capacity, focusing on technology upgrades and new production lines for AI server high-end HDI boards [6][7]. Growth Potential - The company is expected to benefit from the ongoing growth in AI computing demand, with a robust pipeline of orders in AI servers and high-end optical modules [3][4]. - The anticipated release of high-end production capacity across global manufacturing bases is expected to open new avenues for revenue growth in the AI server business [6][7].