深圳市景旺电子股份有限公司 内 部 控 制 审 计 报 告 天 职 业 字 [2026]2361 号 二、注册会计师的责任 目 录 内部控制审计报告 国际官方下载 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://ac.mof.gov.cn）"进行查验。 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://ac.cmo.fgov.cn）"进行查验。 T 内部控制审计报告 天职业字[2026]2361 号 深圳市景旺电子股份有限公司全体股东: 按照《企业内部控制审计指引》及中国注册会计师执业准则的相关要求,我们审计了深圳 市景旺电子股份有限公司（以下简称"景旺电子"）2025 年 12 月 31 目的财务报告内部控制的 有效性。 一、企业对内部控制的责任 按照《企业内部控制基本规范》、《企业内部控制应用指引》、《企业内部控制评价指引》的 规定,建立健全和有效实施内部控制,并评价其有效性是景旺电子董事会的责任。 我们的责任是在实施审计工作的基础上,对财务报告内部控制的有效性发表审计意见,并 对注意到的非财务报告内部控制的重大缺陷进行披露。 三、内部控制的固有局限性 内部控 ...

深圳市景旺电子股份有限公司 总经理工作细则 第一章 总则 第一条 为切实保护股东和公司的合法权益，规范深圳市景旺电子股份有限 公司（以下简称"公司"）高级管理人员的管理行为，保证高级管理人员依法行 使职权和承担义务，以确保公司日常经营管理工作的有序进行，根据《中华人民 共和国公司法》和《深圳市景旺电子股份有限公司章程》（以下简称"《公司章 程》"）有关规定，并结合公司实际运作情况，特制定本细则。 第二条 本细则所称高级管理人员，包括公司总经理、副总经理、财务总监 和董事会秘书等《公司章程》规定的人员。 第二章 聘任与解聘 第三条 公司设总经理 1 名，副总经理若干名，财务总监和董事会秘书各 1 名，由董事会聘任或者解聘。 存在《中华人民共和国公司法》第 178 条规定的情形以及被中国证监会确定 为市场禁入者、并且禁入尚未解除的人员，不得担任公司高级管理人员。 第四条 总经理任期与董事会任期一致，每届任期 3 年，连聘可以连任。 第五条 解聘总经理必须经董事会决议通过，并由董事会向总经理本人说明 解聘理由。 第六条 总经理可以在任期届满以前提出辞职。有关总经理辞职的具体程序 和办法由总经理与公司之间的劳动合同规 ...

深圳市景旺电子股份有限公司董事会审计委员会对会计师事务所 2025 年度履行监督职责情况的报告 深圳市景旺电子股份有限公司董事会审计委员会 对会计师事务所 2025 年度履行监督职责情况的报告 天职国际已取得北京市财政局颁发的执业证书，是中国首批获得证券期货相 关业务资格，获准从事特大型国有企业审计业务资格，取得金融审计资格，取得 会计司法鉴定业务资格，以及取得军工涉密业务咨询服务安全保密资质等国家实 行资质管理的最高执业资质的会计师事务所之一，并在美国 PCAOB 注册。天职 国际过去二十多年一直从事证券服务业务。 （二）聘任会计师事务所履行的程序 经公司第四届董事会审计委员会核查同意，公司于 2025 年 7 月 28 日召开第 四届董事会第三十二次会议、于 2025 年 8 月 13 日召开 2025 年第二次临时股东 大会，审议通过了《关于续聘公司 2025 年度财务报告及内部控制审计机构的议 案》。 二、2025 年年审会计师事务所履职情况 天职国际按照《审计业务约定书》，遵循《中国注册会计师审计准则》和其 他执业规范及公司 2025 年年报工作安排，对公司 2025 年度财务报告及 2025 年 ...

募集资金存 放、管 理 与实际使用情况鉴证报告- T 深圳市景旺电子股份有限公司 募 集 资 金 存 放 、 管 理 与 实 际 使 用 情 况 鉴 证 报 告 天 职 业 字 [2026]2360-1 号 录 目 募集资金 2025 年度存 放 、 管 理 与实际使用情况的专项报告- -3 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://acc.mo.f.gov.cn）" 选行查验。 您可使用手机"扫一扫"或进入"注册会计师行业统一监管平台（http://acc.mo.f.gov.cn） "进行查验。 募集资金存放、管理与实际使用情况鉴证报告 天职业字[2026]2360-1 号 深圳市景旺电子股份有限公司全体股东: 我们审核了后附的深圳市景旺电子股份有限公司(以下简称"公司、本公司、景旺电子") 《深圳市景旺电子股份有限公司关于 2025 年度募集资金存放、管理与实际使用情况的专项报 告》。 一、管理层的责任 景旺电子管理层的责任是按照中国证监会《上市公司募集资金监管规则》、上海证券交易 所颁布的《上海证券交易所上市公司自律监管指引第1 号——规范运作》及相关格式指引规定 编制《深 ...

Summary of Conference Call Records Industry Overview - The conference call focuses on the AI server and PCB (Printed Circuit Board) industry, particularly the advancements in materials and technology related to AI platforms and their components. Key Points AI Platform Upgrade - The new generation AI server architecture has shifted from "mid-board + CP board" to "switch backplane/orthogonal backplane + computing board," significantly increasing the requirements for backplane layers and material performance [1] - The Virtuoso cabinet inherits the GB300 design and upgrades materials, resulting in a 2x increase in PCB value, with each unit requiring 5 LPU cabinets and 1 CPU cabinet, all needing high-end PCBs [1] - This architectural adjustment is expected to increase PCB quantity by 2-3 times and value by 4-5 times, leading to a substantial rise in demand for copper-clad laminates (CCL) [1] Production Timeline - Core product mass production timelines are set: Rubin is expected to start mass production in Q3 2026, with PCB/CCL materials confirmed by late Q2 to early Q3; Alt in Q4 2026; and Fermi in the second half of 2027, with design completion in 2026 [1] Material Demand and Certification - M9 and M10 materials are projected to see explosive demand, with M9 CCL demand reaching millions of units by 2026 and increasing to 20-30 million units by 2027 alongside the Rubin platform [2] - M10 material certification has begun, with Nvidia requiring a loss factor (Df) of 0.0003. The competitive materials include PTFE (best electrical performance) and hydrocarbon resin + M10 filler, with PTFE outperforming M9 by 20%-30% [2] - M9 solutions have been confirmed, utilizing either "hydrocarbon resin + Q fabric" or "PTFE + fiberglass-free fabric," with a stable yield of 90% for M9 CCL, ready for mass production [2] Supply Chain and Pricing - The supply side is highly concentrated, with CTE fabric currently in severe shortage, priced at 120 RMB/kg, expected to rise further in 2026. New production capacity is anticipated to be released in the second half of 2026 [3] - Q fabric is primarily supplied by Asahi Kasei and domestic suppliers, with domestic prices 20%-30% lower than overseas [3] - Price increases for CCL are expected in 2025 due to rising costs of glass fabric and copper foil, with a projected 20%-30% increase in prices being passed down to end-users by April 2026 [3] PCB Market Dynamics - Due to the surge in PCB demand and value, existing suppliers are unable to meet capacity, prompting Nvidia to onboard new suppliers to ensure supply and reduce costs, with 2-4 suppliers per material number [4] - Key suppliers for LPU and CPU boards are identified, with a notable shift in market share towards new entrants like Jingwang Electronics and Dongshan Precision, while traditional players like Shenghong Technology see a decline in market share despite increased absolute order volumes [4] Copper Foil Specifications - Specifications for copper foil are being upgraded in line with material advancements, with M9 requiring HVP4 copper foil and M10 requiring HVP5/HVP6, with demand for HVP4 expected to reach 8,000-30,000 tons by 2027 [4] - Domestic manufacturers like Tongguan and Longdian Huaxin are accelerating the replacement of foreign suppliers due to price advantages [4] Market Potential - The market potential for CCL is significant, with GB300 cabinets requiring 50 CCLs and 60 PPs, while Rubin Ultra cabinets require 200 CCLs and 240 PPs. The value of core products is highlighted, with LPU boards valued at 20,000-30,000 RMB each and next-generation switch backplanes exceeding 800,000 RMB [5] - The global demand for M9 CCL is projected to reach 20-30 million units by 2027, corresponding to an area of over 20 million square meters, indicating a market size of several billion RMB [5] - Key beneficiaries across various segments are identified, including Shengyi Technology in CCL, Feilihua in electronic fabric, Jingwang Electronics in PCB manufacturing, and Tongguan Copper Foil in copper foil [5]

Core Viewpoint - The China Securities Regulatory Commission (CSRC) has issued supplementary material requirements for overseas listing applications for 16 companies, focusing on compliance with various regulations and governance issues [1][2][3]. Group 1: Supplementary Material Requirements - Companies such as ZHONGAN XINKE and HANGZHOU JIAYIN are required to clarify their compliance with human genetic resource management regulations [1][10]. - For JIAZHI TECHNOLOGY, the company must explain the approval status of its actual controller's establishment and control of the issuer, and the implications of any changes in control [1][12]. - QIAN DAMA needs to address the share capital situation, including the specifics of share issuance and the exit of significant shareholders [2][15]. - JINGWANG ELECTRONICS is required to provide details on the compliance of its overseas subsidiaries with foreign investment and foreign exchange registration procedures [2][20]. Group 2: Governance and Compliance Issues - BEITONG DATA must clarify the compliance of its shareholding structure and return investment processes, including the pricing and legality of past transactions [3][4]. - KEDA INTELLIGENT is asked to specify the proportion of raised funds intended for domestic versus overseas use [4][40]. - PUQI PHARMACEUTICAL needs to explain the reasons behind shareholding arrangements and the legality of past shareholding changes [4][41]. Group 3: Specific Company Requirements - WOKER FEIFAN must clarify the fairness of historical share transfer prices and the rationale behind discrepancies in share issuance prices [5][18]. - HUA YAN ROBOTICS is required to confirm whether its business scope aligns with foreign investment access policies [6][21]. - FOURIER SEMICONDUCTOR must provide details on its compliance with foreign investment regulations and the status of its overseas subsidiaries [6][26].

Core Insights - The demand for PCB is driven by scale, speed, and integration, with a focus on the progress of substrate integration, backplane development, and optical-copper fusion [3][6] - The data center PCB market is projected to grow from $12.5 billion in 2024 to $23 billion by 2030, with a CAGR of 10.7% from 2024 to 2030 [13] - Key technological advancements include substrate integration with CoWoP, backplane applications in Kyber racks, and the integration of optical systems in EOCB [18][23][34] PCB Sector - The expansion of computing clusters is leading to increased demand for high-layer, high-density, and high-speed interconnect PCBs [6][12] - The integration of complex functions through substrate and backplane technologies is enhancing PCB capabilities [6][12] - The introduction of CoWoP technology by Nvidia aims to improve signal integrity and reduce power loss, although challenges remain in mSAP process and supply chain constraints [18][19] CCL Sector - The transition to M9-M10 specifications is driven by the need for higher speed and cost-driven price increases [5][37] - The dielectric performance of CCL must be upgraded to ensure signal integrity as speeds and frequencies increase [5][37] - The main materials for CCL are expected to see significant price increases due to supply constraints and rising demand from AI applications [58][63] Key Companies - Key players in the PCB sector include Huadian Co., Shennan Circuit, Shenghong Technology, and others, with a focus on high-layer and high-density PCB production [76] - Huadian Co. is a core supplier for switches and ASIC PCBs, while Shennan Circuit leads in data communication PCBs and packaging substrates [76] - Shenghong Technology is involved in Nvidia's interconnect definitions, focusing on capacity expansion and breakthroughs in ASIC and switch technologies [76] Investment Opportunities - The report highlights the importance of monitoring the progress of high-speed CCL certification and the sustainability of price increases [3][5] - Companies like Huadian Co. and Shenghong Technology are positioned to benefit from advancements in AI and high-speed interconnect technologies [76] - The focus on high-end materials and technologies in the PCB and CCL sectors presents significant investment opportunities as demand continues to rise [58][63]

证券代码：603228 证券简称：景旺电子 公告编号：2026-007 深圳市景旺电子股份有限公司 关于为子公司提供担保的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 担保对象及基本情况 | 被担保人名称 | 本次担保金额 | 0.50 | 江西景旺精密电路有限公司 亿元 | | | | --- | --- | --- | --- | --- | --- | | 实际为其提供的担保金 | | 25.80 | 亿元（含 | 亿元共用额度） 10.00 | 担保对象一 | | 额（不含本次） | | （注 | 1） | | | | 是否在前期预计额度内 | | 是 | □否 | □不适用：_________ | | | 本次担保是否有反担保 | | □是 | 否 | □不适用：_________ | | 注 1：公司向宁波银行股份有限公司深圳分行申请了最高额度为 10.00 亿元的综合授信业务， 授信额度由公司与部分子公司共同使用，公司为前述子公司在授信额度范围内提供连带责任 担保。具体详见公司于 ...

Group 1 - The A-share market saw a collective decline in CPO concept stocks, with New Yisheng dropping by 7% [1] - Zhongji Xuchuang, Taicheng Guang, and Changxin Bochuang experienced declines exceeding 6% [1] - Zhili Fang and Dekeli fell by more than 5%, while Shijia Guangzi, Cambridge Technology, Guangku Technology, Jingwang Electronics, and Robotech dropped over 4% [1] - Lian Te Technology, Huilv Ecology, and Juguang Technology saw declines of more than 3% [1]

Core Viewpoint - The CPO concept stocks in the A-share market experienced a collective decline, with significant drops in several key stocks on February 27, indicating a bearish trend in this sector [1]. Group 1: Stock Performance - Xinyisheng (新易盛) fell by 7.02%, with a total market capitalization of 35.67 billion and a year-to-date decline of 16.72% [2]. - Zhongji Xuchuang (中际旭创) decreased by 6.40%, having a market cap of 59.51 billion and a year-to-date drop of 12.20% [2]. - Taichengguang (太辰光) saw a decline of 6.34%, with a market value of 30.6 billion and a year-to-date increase of 16.48% [2]. - Changxin Bochuang (长芯博创) dropped by 6.16%, with a market cap of 43 billion and a year-to-date increase of 3.74% [2]. - Zhili Fang (智立方) decreased by 5.54%, with a market capitalization of 10.1 billion and a year-to-date increase of 67.18% [2]. - Dekeli (德科立) fell by 5.41%, with a market cap of 25.5 billion and a year-to-date increase of 16.96% [2]. - Shijia Guangzi (仕佳光子) declined by 4.88%, with a market value of 37.8 billion and a year-to-date drop of 5.77% [2]. - Cambridge Technology (剑桥科技) decreased by 4.86%, with a market cap of 36.3 billion and a year-to-date drop of 23.31% [2]. - Guangku Technology (光库科技) fell by 4.38%, with a market value of 40.6 billion and a year-to-date increase of 10.83% [2]. - Jingwang Electronics (景旺电子) saw a decline of 4.28%, with a market cap of 65.3 billion and a year-to-date drop of 9.34% [2]. - Robot Technology (罗博特) decreased by 4.19%, with a market value of 63.7 billion and a year-to-date increase of 62.91% [2]. - Liante Technology (联特科技) fell by 3.64%, with a market cap of 23.8 billion and a year-to-date increase of 8.70% [2]. - Huilv Ecology (汇绿生态) decreased by 3.03%, with a market value of 23.4 billion and a year-to-date increase of 36.03% [2]. - Juguang Technology (炬光科技) fell by 3.01%, with a market cap of 33.2 billion and a year-to-date increase of 111.22% [2]. - Tiantong Co. (天通股份) decreased by 2.96%, with a market value of 21 billion and a year-to-date increase of 29.78% [2]. - Tianfu Communication (天孚通信) fell by 2.53%, with a market cap of 274.3 billion and a year-to-date increase of 73.80% [2]. - Changjia Technology (长甲科技) decreased by 2.32%, with a market value of 85.2 billion and a year-to-date increase of 29.39% [2].