北京市中伦律师事务所 关于锦州神工半导体股份有限公司 以简易程序向特定对象发行股票的 法律意见书 $$\Xi{\bf{\hat{O}}}\Xi{\bf{\hat{\Xi}}}{\bf{\hat{\Psi}}})\backslash\Xi$$ 北京 • 上海 • 深圳 • 广州 • 武汉 • 成都 • 重庆 • 青岛 • 杭州 • 南京 • 海口 • 东京 • 香港 • 伦敦 • 纽约 • 洛杉矶 • 旧金山 • 阿拉木图 Beijing • Shanghai • Shenzhen • Guangzhou • Wuhan • Chengdu • Chongqing • Qingdao • Hangzhou • Nanjing • Haikou • Tokyo • Hong Kong • London • New York • Los Angeles • San Francisco • Almaty | 一、 | 本次向特定对象发行的批准和授权 3 | | --- | --- | | 二、 | 发行人本次向特定对象发行的主体资格 8 | | 三、 | 本次向特定对象发行的实质条件 9 | | 四、 | 发行人的设 ...

国泰君安证券股份有限公司 关于锦州神工半导体股份有限公司 以简易程序向特定对象发行股票 之 上市保荐书 保荐人（主承销商） （中国（上海）自由贸易试验区商城路 618 号） 二〇二三年八月 3-2-1 国泰君安证券股份有限公司 关于锦州神工半导体股份有限公司 以简易程序向特定对象发行股票之上市保荐书 上海证券交易所： 国泰君安证券股份有限公司（以下简称"国泰君安"或"保荐机构"、"保 荐人"）接受锦州神工半导体股份有限公司（以下简称"神工股份"、"发行人" 或"公司"）委托，担任神工股份本次以简易程序向特定对象发行股票（以下简 称"本次发行"）的保荐人。 | 一、发行人基本情况 4 | | --- | | 二、发行人本次发行情况 22 | | 三、本次证券发行上市的保荐代表人、项目协办人及其他项目组成员 25 | | 四、保荐人与发行人之间不存在可能影响公正履行保荐职责情形的说明 26 | | 五、保荐人承诺事项 27 | | 六、本次证券发行上市履行的决策程序 28 | | 七、保荐人对发行人符合以简易程序向特定对象发行股票并上市条件的说明.29 | | 八、保荐人关于本次募集资金投向属于科技创新领域的专项 ...

国泰君安证券股份有限公司 关于锦州神工半导体股份有限公司 以简易程序向特定对象发行股票 之 发行保荐书 保荐机构（主承销商） 二〇二三年八月 关于锦州神工半导体股份有限公司以简易程序向特定对象发行股票之发行保荐书 国泰君安证券股份有限公司 关于锦州神工半导体股份有限公司 以简易程序向特定对象发行股票 之 国泰君安证券股份有限公司（以下简称"国泰君安"或"保荐机构"、"保 荐人"）接受锦州神工半导体股份有限公司（以下简称"神工股份"、"发行人" 或"公司"）委托，担任神工股份本次以简易程序向特定对象发行股票（以下 简称"本次发行"）的保荐机构。 根据《中华人民共和国公司法》（以下简称"《公司法》"）、《中华人民共 和国证券法》（以下简称"《证券法》"）、《证券发行上市保荐业务管理办法》 （以下简称"《保荐管理办法》"）、《上市公司证券发行注册管理办法》（以下 简称"《注册管理办法》"）、《发行证券的公司信息披露内容与格式准则第 27 号 ——发行保荐书和发行保荐工作报告》、《保荐人尽职调查工作准则》等法律法 规和中国证券监督管理委员会（以下简称"中国证监会"）、上海证券交易所（以 下简称"上交所"）的有关规定， ...

容诚审字[2023]110Z0019 号 6-1-1 审计报告 锦州神工半导体股份有限公司 容诚会计师事务所(特殊普通合伙) 中国·北京 目 录 | 序号 | 内 容 | 页码 | | --- | --- | --- | | 1 | 审计报告 | 1-5 | | 2 | 合并资产负债表 | 1 | | 3 | 合并利润表 | 2 | | 4 | 合并现金流量表 | 3 | | 5 | 合并所有者权益变动表 | 4-5 | | 6 | 母公司资产负债表 | 6 | | 7 | 母公司利润表 | 7 | | 8 | 母公司现金流量表 | 8 | | 9 | 母公司所有者权益变动表 | 9-10 | | 10 | 财务报表附注 | 11-115 | 6-1-2 容诚会计师事务所(特殊普通合伙) 容诚审字[2023]110Z0019 号 外经贸大厦 15 层/922-926(10037) TEL: 010-6600 1391 FAX: 010-6600 1392 E-mail:bj@rsmchina.com.cn https//WWW.rsm.global/china/ 锦州神工半导体股份有限公司全体股东： 一、审计 ...

锦州神工半导体股份有限公司（以下简称"公司"）已于 2023 年 3 月 18 日 发布公司 2022 年度报告，为便于广大投资者更全面深入地了解公司 2022 年度 经营成果、财务状况、发展理念，公司参与了由上交所主办的 2022 年度半导体 行业集体业绩说明会，此次活动将采用视频和网络文字互动的方式举行，投资 者可登录上海证券交易所上证路演中心（http://roadshow.sseinfo.com/）参与线上 互动交流。 一、说明会类型 证券代码：688233 证券简称：神工股份 公告编号：2023-035 锦州神工半导体股份有限公司 关于参加 2022 年度半导体行业集体业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： （http://roadshow.sseinfo.com/） 投资者可于 2023 年 5 月 12 日(星期五)16:00 前通过邮件、电话、传真等 形式将需要了解和关注的问题提前提供给公司。公司将在文字互动环节对投资 者普遍关注的问题进行回答。 四、联系人及咨询 ...

Financial Performance - The company's operating revenue for Q1 2023 was ¥52,135,489.56, representing a decrease of 63.18% compared to the same period last year[5] - The net profit attributable to shareholders was a loss of ¥12,083,269.44, a decline of 124.22% year-over-year[5] - The net profit attributable to shareholders after deducting non-recurring gains and losses was a loss of ¥13,146,914.57, down 126.41% from the previous year[5] - The basic and diluted earnings per share were both -¥0.08, reflecting a decrease of 125.81% year-over-year[6] - Total revenue for Q1 2023 was ¥52,135,489.56, a decrease of 63.2% compared to ¥141,597,369.93 in Q1 2022[20] - Net profit for Q1 2023 was a loss of ¥11,887,126.43, compared to a profit of ¥49,899,295.57 in Q1 2022, representing a decline of 123.8%[21] - Total comprehensive income for Q1 2023 was a loss of ¥12,547,682.00, compared to a profit of ¥49,916,571.08 in Q1 2022[21] Cash Flow and Liquidity - The net cash flow from operating activities was ¥36,567,034.61, an increase of 21.42% compared to the same period last year[5] - Cash flow from operating activities for Q1 2023 was ¥36,567,034.61, an increase of 21.5% compared to ¥30,116,484.55 in Q1 2022[23] - The net cash flow from investment activities was -37,144,854.51, compared to 39,045,937.67 in the previous year, indicating a significant decline[24] - The net increase in cash and cash equivalents was -1,843,646.63, contrasting with an increase of 66,524,532.76 in the previous year[24] - The ending balance of cash and cash equivalents was 546,585,645.07, compared to 496,729,744.51 at the end of the previous year[24] - The company's cash and cash equivalents increased to CNY 660,240,387.22 from CNY 624,348,293.82, reflecting a growth of approximately 5.5%[16] Expenses and Costs - Research and development expenses totaled ¥5,438,969.18, a decrease of 71.70% year-over-year, accounting for 10.43% of operating revenue, down 3.14 percentage points[6] - Total operating costs for Q1 2023 were ¥50,442,201.62, down 43% from ¥88,362,816.19 in Q1 2022[20] - Sales expenses increased to ¥1,044,362.33 in Q1 2023, up 13.2% from ¥922,437.43 in Q1 2022[20] - Management expenses rose to ¥9,652,620.47 in Q1 2023, an increase of 7.7% compared to ¥8,968,680.12 in Q1 2022[20] - Other income for Q1 2023 was ¥1,294,763.53, compared to ¥269,560.85 in Q1 2022, reflecting a growth of 380.5%[20] Assets and Liabilities - The total assets at the end of the reporting period were ¥1,719,621,834.19, a decrease of 2.28% from the end of the previous year[6] - As of March 31, 2023, the total assets of Jinzhou Shengong Semiconductor Co., Ltd. amounted to CNY 1,719,621,834.19, a decrease from CNY 1,759,658,594.62 at the end of 2022[16] - The total current liabilities decreased to CNY 85,622,390.33 from CNY 115,662,395.63, indicating a reduction of about 26%[18] - The total non-current liabilities slightly increased to CNY 31,326,345.22 from CNY 30,336,209.39, showing a growth of approximately 3.3%[18] - The company's total equity decreased to CNY 1,602,673,098.65 from CNY 1,613,659,989.60, a decline of about 0.5%[18] - The company's inventory decreased to CNY 162,421,730.48 from CNY 186,340,041.48, reflecting a decline of approximately 12.8%[16] - The accounts receivable decreased to CNY 76,477,629.55 from CNY 98,344,198.54, indicating a reduction of about 22.3%[16] Market Conditions and Strategy - The company experienced a significant decline in orders due to weakened customer demand amid an industry downturn[10] - The company has not disclosed any new product developments or market expansion strategies in the provided content[14] - The company did not implement new accounting standards or interpretations for the first quarter of 2023[25] Return on Investment - The weighted average return on net assets was -0.77%, a decrease of 4.24 percentage points compared to the previous year[6]

Financial Performance - The company's revenue reached RMB 539.24 million in 2022, representing a year-on-year growth of 7.09%[9] - The net profit attributable to shareholders decreased by 28.44% to RMB 158.14 million, with a gross margin decline of 17.17 percentage points[12] - The company reported a total revenue of RMB 1.2 billion for the fiscal year 2022, representing a year-over-year increase of 15%[36] - The gross profit margin improved to 35%, up from 30% in the previous year, indicating enhanced operational efficiency[36] - The basic earnings per share (EPS) decreased by 28.26% to CNY 0.99, while diluted EPS also fell by the same percentage[38] - The net cash flow from operating activities decreased by 31.19% to CNY 130.15 million, primarily due to rising raw material costs[40] - The company's total assets increased by 17.75% to CNY 1.76 billion at the end of 2022[40] - The company's net assets attributable to shareholders rose by 10.94% to CNY 1.57 billion[40] - The company achieved operating revenue of CNY 539.24 million in 2022, representing a year-on-year increase of 7.09%[40] - The company's cash flow from operating activities decreased by 31.19% to 130.15 million RMB, mainly due to increased procurement costs[130] Market Position and Strategy - Revenue from large-diameter silicon materials was RMB 476.11 million, with a production capacity of 500 tons per year, maintaining a global leading position[10] - The company plans to distribute a cash dividend of RMB 1.00 per share, totaling RMB 16 million, which accounts for 10.12% of the net profit attributable to shareholders[19] - The company is positioned to benefit from the rise of domestic semiconductor equipment manufacturers and integrated circuit manufacturers, providing growth opportunities for silicon component products[12] - The company plans to expand its market presence in Southeast Asia, targeting a 25% market share by 2025[36] - The company is exploring potential acquisitions to enhance its technology portfolio and market reach[36] - The company is focused on achieving high yield rates while expanding production capacity for large-size silicon wafers, with ongoing installation and debugging of new equipment[172] - The company aims to expand its domestic sales network and increase market share in the semiconductor industry by deepening relationships with key customers[168] Research and Development - The company has allocated RMB 200 million for research and development in 2023, a 30% increase compared to 2022[36] - R&D expenses for the year amounted to 39.38 million RMB, focusing on meeting client certification requirements[54] - The company achieved 7 core technology advancements and obtained 1 invention patent and 16 utility model patents during the reporting period[55] - The company has developed multiple core technologies for silicon wafer surface flatness, leading to continuous improvement in flatness indicators and yield rates to meet downstream customer demands[81] - The company has developed specialized tools for stable processing of installation holes in silicon components, enhancing product quality[108] - The company has developed high-resistance silicon wafers and ultra-flat silicon wafers, with progress in evaluation and certification, indicating potential to supply high-quality silicon wafers to domestic integrated circuit manufacturers[117] Production and Operations - The construction of the 8-inch semiconductor-grade silicon single crystal polishing wafer project has been delayed until February 2024 due to various restrictions[12] - The overall yield rate for semiconductor production improved to 90%, up from 85% in the previous year[36] - The company has completed the procurement of production equipment needed for an annual output of 1.8 million 8-inch silicon wafers, with the first phase of 50,000 pieces per month already in mass production[66] - The company has optimized multiple crystal growth processes to improve production efficiency and yield rates for large-diameter single crystal silicon materials[90] - The company has implemented advanced technologies to reduce production costs while maintaining high yield rates and consistency in product parameters[76] Risks and Challenges - The company faces customer concentration risk, as its main clients are primarily located in Japan, South Korea, and the United States, which could impact revenue if these clients reduce purchases[119] - The company relies on a limited number of suppliers for high-purity raw materials, creating a risk of supply instability if these suppliers face delivery issues[119] - The cost of raw materials, which constitutes a significant portion of the company's operating costs, poses a risk to profitability if prices increase without a corresponding rise in product sales prices[119] - The company faces business volatility risks due to the cyclical nature of the semiconductor industry and potential customer procurement plan adjustments[121] - The semiconductor industry is currently in an inventory adjustment phase, leading to a decline in overall demand and industry sentiment[123] Corporate Governance and Management - The company has a total of 12 directors and senior management personnel listed, with a combined pre-tax compensation of 5.50 million CNY[179] - The company has established specialized committees under the board, including audit, nomination, remuneration, and strategic committees[194] - The audit committee held 4 meetings during the reporting period, discussing key financial reports and budget proposals[195] - The company continues to maintain a stable management structure with no significant changes in personnel[180] - The leadership structure indicates a focus on long-term strategic planning and operational efficiency across different business units[183]

Financial Performance - The company's revenue reached RMB 539.24 million in 2022, representing a year-on-year growth of 7.09%[9] - The net profit attributable to shareholders decreased by 28.44% to RMB 158.14 million, with a gross margin decline of 17.17 percentage points[12] - The company reported a total revenue of RMB 1.2 billion for the fiscal year 2022, representing a year-over-year growth of 15%[27] - The gross profit margin improved to 35%, up from 30% in the previous year, indicating better cost management and pricing strategies[27] - The net cash flow from operating activities decreased by 31.19% to CNY 130.15 million, attributed to increased procurement costs[39] - Basic and diluted earnings per share were both CNY 0.99, down 28.26% year-on-year[37] - The weighted average return on equity decreased by 5.96 percentage points to 10.84%[37] - The overall operating expenses were reduced by 5% compared to the previous year, reflecting improved operational efficiency[27] - The company achieved operating revenue of CNY 539.24 million in 2022, representing a year-on-year increase of 7.09%[39] - The global semiconductor market size in 2022 was 573.5 billion USD, showing a year-on-year growth of 3.2%[49] Market and Industry Outlook - The semiconductor industry is expected to see a recovery in demand driven by digitalization and low-carbon transformation, with major players maintaining high capital expenditure levels[13] - The global semiconductor market sales in Q4 2022 totaled 130.2 billion USD, reflecting a year-on-year decline of 14.7%[49] - The semiconductor market is experiencing structural changes in end-user demand, with strong new demand in industrial and automotive sectors, while smartphone and consumer electronics demand is declining[83] - The semiconductor industry is cyclical, with demand influenced by global economic conditions and geopolitical conflicts, leading to uncertainty in future performance[122] - The company is expanding its market presence in Southeast Asia, targeting a 25% increase in market share by 2025[27] Production and Capacity - Revenue from large-diameter silicon materials was RMB 476.11 million, with a production capacity of 500 tons per year, maintaining a global leading position[10] - The company aims to expand its production capacity for large-diameter silicon materials and enhance its global competitive advantage during the current industry downturn[13] - The production capacity for 8-inch silicon wafers is set to reach 1.8 million pieces annually, with the first phase of 50,000 pieces per month already in mass production[56] - The company is expanding production capacity in two locations to ensure timely delivery of future customer orders, following a successful equity financing round[63] - The company is focused on achieving high yield rates and stable product quality while expanding production capacity for large-diameter silicon wafers[171] Research and Development - The company has allocated RMB 200 million for research and development in advanced manufacturing technologies for the upcoming fiscal year[27] - The company achieved a yield rate of 95% for its semiconductor products, indicating high production quality and consistency[27] - The company has developed multiple core technologies for silicon wafer surface flatness, leading to continuous improvement in flatness indicators and yield rates[80] - The company has developed high-precision equipment for chemical mechanical polishing (CMP) and replaced costly grinding processes with precision grinding techniques[77] - The company has developed a micro-control technology for crystal lattice arrangement during the growth of polycrystalline silicon, improving crystal quality and yield[98] Challenges and Risks - The significant increase in the price of raw materials, particularly polysilicon, has impacted production costs and profitability[39] - The company faces customer concentration risk, as its main clients are overseas companies like Mitsubishi Materials and SK Chemicals, which could impact revenue if their purchasing behavior changes[118] - The company is exposed to supplier concentration risk, relying heavily on specific suppliers for high-purity polysilicon and quartz crucibles, which could affect production stability if these suppliers face issues[118] - Future production and operational performance may be affected by ongoing trade tensions and geopolitical issues, which could impact competitiveness[124] Corporate Governance and Management - The total pre-tax compensation for the board members and senior management during the reporting period amounted to 5.50 million CNY[178] - The company has maintained its current board structure since August 2021, with terms set to end in August 2024[178] - The company has not reported any stock increases or decreases for its directors and senior management during the reporting period[178] - The company has a total of 11 directors and senior management members listed, with a combined pre-tax compensation of 5.50 million CNY[178] Strategic Initiatives - The company plans to distribute a cash dividend of RMB 1.00 per 10 shares, totaling RMB 16 million, which accounts for 10.12% of the net profit attributable to shareholders[18] - The company is exploring potential mergers and acquisitions to enhance its technology portfolio and market reach[27] - The company is focused on improving production management efficiency and increasing R&D investment to maintain its leading position in the semiconductor silicon materials field[169] - The company is committed to optimizing the technical parameters of 12-inch silicon wafers and aims to achieve trial production soon[171]

编号：2022-003 证券代码：688233 证券简称：神工股份 锦州神工半导体股份有限公司投资者关系活动记录表 | --- | --- | --- | |----------|---------------------------|-----------------------------| | | √特定对象调研 □分析师会议 | | | 投资者关 | □媒体采访 □业绩说明会 | | | 系活动类 | □新闻发布会 □路演活动 | | | 别 | □现场参观 □一对一沟通 | | | | √其他 （电话会议） | | | | 杨绍辉-中银证券 | 饶晓鹏 - 海富通基金 | | | 马良 - 安信证券 | 谢泽林-嘉实基金 | | | 曾鹏-博时基金 | 陈磊 - 金鹰基金 | | | 洪琪-财通资管 | 陈甲诚-民生证券 | | | 邹晨-翀云投资 | 王卫铭 - 摩根士丹利华鑫基金 | | | 王先伟-创金合信基金 | 王忧草-诺德基金 | | | 吴若宗-醇厚基金 | 王威 - 鹏华基金 | | | 王晔-德邦证券 | 张佳林-鹏扬基金 | | | 武芃睿 - 东北证券 | 尹秀资 - 平安资管 ...

编号：2022-005 证券代码：688233 证券简称：神工股份 锦州神工半导体股份有限公司投资者关系活动记录表 | --- | --- | --- | |----------|---------------------------|-----------------------| | | √特定对象调研 □分析师会议 | | | 投资者关 | □媒体采访 □业绩说明会 | | | 系活动类 | □新闻发布会 | □路演活动 | | 别 | □现场参观 □一对一沟通 | | | | √其他 （电话会议） | | | | 李浩-国开泰富基金 | 王佩麟-兴业证券 | | | 边悠-明亚基金 | 李双亮 - 兴业证券 | | | 梁忻-东方基金 | 邱泓瑞-群益证券 | | | 阮文俊-太平资产 | 黄磊-中信建投 | | | 史文琪-华泰证券 | 周阳 - 华安基金 | | | 陆从珍-华泰柏瑞基金 | 冯杰波-上海域秀资管 | | | 黄进 - 生命保险资产 | 茅珈凯-上海从容资管 | | | 黄磊-中信建投 | 孟庆峰-上海磐厚资管 | | 参与单位 | 王亦琛-东海基金 | 赵炯-恒越基金 | | 及 ...