本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 昆山东威科技股份有限公司（以下简称"公司"）于 2025 年 8 月 26 日召开 第三届董事会第二次会议，审议通过了《关于 2025 年半年度计提资产减值准备 的议案》。现将相关情况公告如下： 证券代码：688700 证券简称：东威科技 公告编号：2025-039 昆山东威科技股份有限公司 关于 2025 年半年度计提资产减值准备的公告 一、计提信用及资产减值概述 根据《企业会计准则第 8 号——资产减值》《企业会计准则第 22 号——金 融工具确认和计量》及相关会计政策、会计估计的相关规定，为了真实、准确地 反映公司截至 2025 年 6 月 30 日的财务状况及 2025 年半年度的经营成果，本着 谨慎性原则，公司 2025 年半年度确认资产减值损失和信用减值损失共计 17,001,782.74 元，明细如下： | 项目 | 本年发生额 | | --- | --- | | | （单位：人民币 元） | | 一、信用减值损失 | -13,560,954.01 | | 应收票据 ...

昆山东威科技股份有限公司 关于 2025 年度"提质增效重回报"行动方案的半年 度评估报告 为了落实以投资者为本的理念，推动昆山东威科技股份有限公司（以下简称 "东威科技"或"公司"）持续优化经营、规范治理和积极回报投资者，大力提 高公司质量，助力信心提振、资本市场稳定和经济高质量发展，公司制定了《2024 年度"提质增效重回报"行动方案评估报告暨 2025 年"提质增效重回报"行动 方案》（以下简称《行动方案》），并于 2025 年 4 月 26 日正式对外披露。 为进一步落实有关工作安排，切实维护全体股东利益，公司对《行动方案》 在报告期内的执行情况进行全面评估并编制本报告，具体内容如下： 一、持续聚焦电镀领域，提升公司核心竞争优势 公司在电镀设备市场保持专注、持续创新，现已发展成为全球领先的电镀设 备企业。公司的垂直连续电镀设备，客户认可度高、市场竞争力强，广泛应用于 高效能计算机、服务器、大数据中心、高端通讯设备、人工智能、云储存等领域。 根据 Prismark 预测，2025 年全球 PCB 市场的产值将同比增长 7.6%，达 791 亿美金。AI 服务器和相关设备的持续强劲需求推动了市场增长，18 ...

一、GDR 募集资金基本情况 2022 年 12 月 12 日，公司召开第二届董事会第七次会议，并于 2022 年 12 月 28 日召开 2022 年第一次临时股东大会，审议通过《关于公司发行 GDR 并在瑞 士证券交易所上市及转为境外募集股份有限公司的议案》等本次发行上市相关议 案。 公司于 2023 年 2 月 2 日取得了瑞士证券交易所监管局关于公司发行 GDR 并 在瑞士证券交易所上市的附条件批准。2023 年 3 月 21 日收到中国证券监督管理 委员会（以下简称"中国证监会"）出具的《关于核准昆山东威科技股份有限公 司首次公开发行全球存托凭证并在瑞士证券交易所上市的批复》（证监许可 [2023]608 号）。根据该批复，中国证监会核准公司发行全球存托凭证（Global Depositary Receipts，以下简称"GDR"）所对应的新增 A 股基础股票不超过 11,776,000 股，按照公司确定的转换比例计算，对应的 GDR 发行数量不超过 5,888,000 份。 2023 年 6 月 13 日（瑞士时间），公司实际发行 GDR 数量为 5,888,000 份， 所代表的新增基础证券 A ...

Core Viewpoint - The report from Minsheng Securities highlights "speed" and "power" as the two core contradictions in current AI development, with PCB (Printed Circuit Board) being a crucial component in the AI industry chain, benefiting significantly from the ongoing advancements in PCB technology and processes [1] Group 1: PCB Industry Trends - The PCB industry is experiencing rapid development in advanced packaging and high-density interconnect technologies, transitioning from traditional HDI and substrate technologies to mSAP processes capable of sub-10μm line widths to meet the demands of high-speed signal transmission and large-scale integration [1] - New technologies such as CoWoP (Chip-on-Wafer-on-Panel) are changing the form of packaging substrates by using large-size PCBs to carry multiple chips, thereby reducing costs and enhancing interconnect density [1] Group 2: Upstream Material Demand - Driven by AI demand, leading PCB manufacturers like Shenghong Technology, Huitian Technology, and Pengding Holdings are actively expanding production, creating a resonance between material upgrades and capacity expansion [2] - Key upstream materials for PCBs include copper foil, electronic cloth, and resin, with upgrades in these materials to meet the requirements of high-speed signal transmission and lightweight designs [2] Group 3: Equipment Supply and Domestic Substitution - The core processes of PCB manufacturing, including drilling, electroplating, and etching, are critical for determining interconnect density, signal integrity, and production yield, with increasing demands for precision and reliability in these processes [3] - Domestic equipment manufacturers such as Dazhu CNC, Dingtai High-Tech, and Dongwei Technology are accelerating their layouts in advanced process equipment for high-layer boards, HDI, and mSAP, reflecting the industry's shift towards domestic substitution [3] Group 4: Investment Recommendations - Recommended PCB leading manufacturers include Shenghong Technology (300476.SZ), Pengding Holdings (002938.SZ), Huitian Technology (002463.SZ), Shenzhen South Circuit (002916.SZ), Guanghe Technology (001389.SZ), and Jingwang Electronics (603228.SH) [4] - In the materials sector, companies with core technologies and customer resources such as Honghe Technology (603256.SH), Zhongcai Technology (002080.SZ), Feilihua (300395.SZ), Defu Technology (301511.SZ), Longyang Electronics (301389.SZ), and Meilian New Materials (300586.SZ) are recommended [4] - For equipment, focus on domestic substitution in core segments with companies like Dazhu CNC (301200.SZ), Xinqi Microelectronics (688630.SH), Dingtai High-Tech (301377.SZ), and Dongwei Technology (688700.SH) [4]

Group 1 - The global server market is entering a new growth cycle starting in 2024, driven by the increasing demand for AI computing power, with an expected CAGR of 18.8% from 2024 to 2029 [2] - The PCB industry is recovering from a phase of adjustment due to weak consumer electronics and inventory cycles, with emerging demands from AI servers and high-performance infrastructure expected to drive growth from 2024 [2][3] - Domestic PCB manufacturers are actively expanding production and increasing capital expenditures, focusing on high-end products such as HDI and multi-layer boards [2][3] Group 2 - The global PCB equipment market is projected to reach 51 billion yuan in 2024, with a year-on-year growth of 9.0%, and a CAGR of 4.9% from 2020 to 2024 [3] - The demand for PCB equipment is significantly boosted by AI computing infrastructure, with the market expected to grow to 77.5 billion yuan by 2029, reflecting a CAGR of 8.7% from 2024 to 2029 [3] - Drilling, exposure, and testing equipment represent the highest value segments in the PCB equipment market, accounting for 20.75%, 16.99%, and 15.00% respectively in 2024 [3] Group 3 - The drilling equipment segment is expected to benefit from increased demand for high-end HDI, with both mechanical and laser drilling seeing growth due to the rising complexity of HDI designs [3] - The exposure equipment market is currently dominated by foreign brands, with low domestic penetration, particularly in LDI technology which is more suited for HDI [4] - The demand for plating equipment is increasing due to the higher number of plating cycles required for advanced HDI, alongside quality control pressures [5] Group 4 - Major equipment manufacturers are showing a clear upward trend, with expectations for accelerated performance in the future [6] - Key players in the drilling segment include Dazhu CNC (301200), while the exposure segment is led by Xinqi Micro (688630) and Tianzhun Technology (688003) [7] - The plating segment is highlighted by Dongwei Technology (688700), with Keg Precision (301338) noted for its role in the solder paste printing segment [7]

Company Overview - Dongwei Technology Co., Ltd. is located in Kunshan, Jiangsu Province, established on December 29, 2005, and listed on June 15, 2021. The company primarily engages in the research, design, production, and sales of high-end precision electroplating equipment and its supporting devices [1] - The main products include vertical continuous electroplating equipment for PCB electroplating, horizontal surface treatment equipment, gantry electroplating equipment, and rolling electroplating devices [1] Revenue Composition - The revenue composition of Dongwei Technology is as follows: vertical continuous electroplating equipment accounts for 62.68%, gantry electroplating equipment 13.14%, other products 9.73%, rolling horizontal film electroplating equipment 6.14%, hardware continuous electroplating equipment 3.82%, horizontal surface treatment equipment 2.78%, other (supplementary) 0.99%, photovoltaic copper plating equipment 0.40%, and magnetron sputtering winding coating equipment 0.33% [1] Fund Holdings - According to data, one fund under Jiashi Fund holds Dongwei Technology as a top ten heavy stock. The Jiashi SSE STAR Market Industrial Machinery ETF (588850) held 10,100 shares in the second quarter, accounting for 2.54% of the fund's net value, ranking as the tenth largest heavy stock [2] - The Jiashi SSE STAR Market Industrial Machinery ETF (588850) was established on April 16, 2025, with a latest scale of 15.6942 million. Since its inception, it has achieved a return of 28.12% [2]

Core Insights - Guande Dongwei Technology Co., Ltd. has obtained a patent for a "clamping device and conveying system," with the authorization announcement number CN113428569B, applied on July 2021 [1] - The company was established in 2013 and is located in Xuancheng City, primarily engaged in the manufacturing of electrical machinery and equipment [1] - The registered capital of Guande Dongwei Technology Co., Ltd. is 180 million RMB [1] Company Activities - The company has participated in six bidding projects [1] - It holds three trademark registrations and has 151 patent records [1] - Additionally, the company possesses 24 administrative licenses [1]

Investment Rating - The report maintains a "Recommended" rating for leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd. [4][5] Core Viewpoints - The PCB industry is experiencing rapid advancements in packaging and high-density interconnect technologies, with traditional HDI and substrate technologies evolving into mSAP processes to meet the demands of high-speed signal transmission and large-scale integration [1][2] - The demand for PCB is driven by AI applications, leading to significant expansions in production capacity among leading companies, with total investments exceeding 30 billion RMB [2][20] - The core materials for PCB, including copper foil, electronic cloth, and resin, are undergoing upgrades to meet the high-frequency and high-speed requirements of AI applications [2][20][26] Summary by Sections 1. CoWoP and mSAP as Core Technologies - CoWoP (Chip-on-Wafer-on-PCB) is emerging as a future packaging route, enhancing interconnect density and reducing costs by directly using large-size PCBs [1][11] - mSAP (Modified Semi-Additive Process) is becoming the core process for achieving sub-10 µm line capabilities, essential for high-performance applications [1][14] 2. PCB Capacity Expansion and Material Upgrades - Leading PCB manufacturers are actively expanding production capacity, with significant investments announced by companies like Huadian Co., Ltd. and Shenghong Technology [2][20] - The upgrade of core materials includes the transition of copper foil from HVLP1 to HVLP5, electronic cloth to third-generation low-dielectric cloth, and resin to hydrocarbon and PTFE types [2][20][28] 3. Tight Supply of Core Equipment and Acceleration of Domestic Substitution - The supply of core PCB equipment, including drilling, plating, and etching imaging, is tight, with domestic manufacturers accelerating their layouts in advanced process equipment [2][49] - Companies like Dazhu CNC and Ding Tai High-Tech are focusing on high-layer boards and HDI equipment to meet the increasing demands of the industry [2][49] 4. Investment Recommendations - The report suggests focusing on leading PCB manufacturers such as Shenghong Technology, Pengding Holdings, and Huadian Co., Ltd., as well as material companies with core technologies like Honghe Technology and Zhongcai Technology [3][4] - Equipment manufacturers involved in domestic substitution, such as Dazhu CNC and Xinqi Microelectronics, are also highlighted as potential investment opportunities [3][4]

Core Viewpoint - Dongwei Technology's stock price has shown significant growth this year, with a year-to-date increase of 56.68%, despite a recent decline in the last five trading days [2]. Group 1: Stock Performance - As of August 22, Dongwei Technology's stock price reached 46.00 CNY per share, with a market capitalization of 13.726 billion CNY [1]. - The stock has experienced a 2.15% decline over the last five trading days, but a 20.10% increase over the last 20 days and a 37.15% increase over the last 60 days [2]. - The company has appeared on the "Dragon and Tiger List" once this year, with a net buy of 262 million CNY on March 10 [2]. Group 2: Financial Performance - For the first quarter of 2025, Dongwei Technology reported revenue of 211 million CNY, reflecting a year-on-year growth of 7.08% [2]. - The company has distributed a total of 240 million CNY in dividends since its A-share listing, with 152 million CNY distributed over the past three years [2]. Group 3: Shareholder Information - As of March 31, 2025, the number of shareholders for Dongwei Technology was 8,403, a decrease of 15.33% from the previous period [2]. - The average number of circulating shares per shareholder increased by 18.10% to 35,511 shares [2]. - Among the top ten circulating shareholders, China Europe Alpha Mixed A (009776) is the eighth largest, holding 4.68 million shares as a new shareholder [3]. Group 4: Company Overview - Dongwei Technology, established on December 29, 2005, is located in Kunshan, Jiangsu Province, and was listed on June 15, 2021 [2]. - The company specializes in high-end precision electroplating equipment and is categorized under the machinery and equipment industry, specifically in specialized equipment [2].

Investment Rating - The report maintains an "Accumulate" rating for Dongwei Technology (688700) [1] Core Views - The demand for high-end electroplating equipment is expected to increase due to the CoWoP technology combined with HDI, positioning the company to benefit significantly [7] - The company is well-positioned to capitalize on the growth in HDI electroplating equipment demand, supported by its advanced technology and product offerings [7] Financial Forecasts - Projected total revenue (in million RMB) for 2023A is 909.23, with a decline of 10.13% year-on-year, and is expected to rise to 1,266.38 by 2027E, reflecting a growth of 11.45% [1] - The forecasted net profit attributable to the parent company (in million RMB) is 151.43 for 2023A, with a significant drop of 29.01% year-on-year, expected to recover to 224.36 by 2027E, showing a growth of 21.48% [1] - The latest diluted EPS is projected to be 0.51 for 2023A, increasing to 0.75 by 2027E [1] - The current price-to-earnings ratio (P/E) is 94.25, with future projections of 206.03 for 2024A, decreasing to 63.61 by 2027E [1] Market Data - The closing price of the stock is 47.83 RMB, with a market capitalization of 14,272.54 million RMB [5] - The stock has a price-to-book ratio of 8.15 and a one-year price range of 16.95 to 51.00 RMB [5] Key Technologies and Market Trends - The CoWoP process is emerging as a mainstream packaging technology, simplifying processes and reducing transmission losses, which is crucial for the PCB industry [7] - The MSAP and SAP processes are identified as key technologies for achieving HDI, driving the demand for high-value electroplating equipment [7] - The company’s horizontal electroplating equipment is validated by leading customers, indicating a promising domestic replacement trend [7]