Group 1: Company Overview - The main business of Tongfu Microelectronics is integrated circuit packaging and testing [2] - After the restructuring, the top three shareholders will be Huada Microelectronics, Fujitsu (China), and the National Integrated Circuit Industry Investment Fund, with the fund holding approximately 14.65% [3] - The company has seen significant growth in market share, particularly in high-end products like BGA, FC, WLP, and SiP, with FC and WLP products growing over 100% in 2016 [3] Group 2: Client Base and Competitive Advantage - The company has high-end clients including AMD, TI, MTK, and ST, with five of the top ten global fabless IC design companies as customers [3] - The stability of customer relationships is a core competitive advantage, as once certified and in mass production, clients tend to remain loyal [3] - Since 2014, the company has leveraged industry growth to increase asset and revenue scale, becoming the seventh-largest packaging and testing company globally [4] Group 3: Joint Ventures and Production Capacity - Post-restructuring, the company holds 85% of the shares in its Suzhou and Penang joint ventures, which focus on high-end packaging technologies [4] - These factories are transitioning to serve high-end clients and have begun producing 14nm and 16nm process products, with 7nm technology under development [4] - The joint ventures have secured a significant portion of AMD's packaging orders, enhancing their strategic customer base [4] Group 4: Fundraising and Future Prospects - The fundraising plan aims to raise up to 969 million RMB, with a base price of 11.74 RMB per share, primarily for integrated circuit packaging and testing projects [5] - The growth of the integrated circuit industry in China is supported by government policies, with over 40% of new wafer fabs expected to be established in mainland China in the next three years [5] - The introduction of the National Integrated Circuit Industry Investment Fund as a strategic investor is expected to enhance the company's market position and resource acquisition [6]

证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2017-001 | --- | --- | --- | |----------------|-----------------------|---------------------------------------------------| | | | | | 投资者关系活动 | □ | 特定对象调研 □分析师会议 | | 类别 | □ | 媒体采访 □业绩说明会 | | | □新闻发布会 √路演活动 | | | | √ 现场参观 | | | | □ | 其他 （请文字说明其他活动内容） | | 参与单位名称及 | | 国信证券：唐泓骥；中国对外经济贸易信托有限公司： | | 人员姓名 | | 邓心怡、丁盛；上海彤源投资发展有限公司：段方庆； | | | | 中兵投资管理有限责任公司：赵军华；华商基金：郑军 | | | | 浙银资本：何婷；汇垠天星：李露；架桥资本：江维康 | | | | 虎甲投资：尤盛；申万宏源证券：武斌；财通证券：赵 | | | | 成、邱凯；浙商证券：徐岩；财通基金：颜平、刘佳 | | | ...

Company Overview - Tongfu Microelectronics Co., Ltd. specializes in integrated circuit packaging and testing, with major shareholders holding a combined 50.07% stake [1] - The company has established a strong customer base, including over 50% of the world's top 20 semiconductor companies [2] Customer and Market Position - Key clients include AMD, MTK, ST, TI, NXP, Infineon, Broadcom, Toshiba, and others, highlighting the company's competitive advantage in customer resources [2] - In 2018, the company ranked sixth among the world's top ten packaging and testing companies, up from seventh in 2017 [2] Joint Ventures and Acquisitions - In 2016, the company, in collaboration with the National Integrated Circuit Industry Investment Fund, acquired high-end packaging factories in Suzhou and Penang, with an 85% ownership stake [2][3] - The acquisition of FABTRONIC SDN BHD was completed in May 2019 for a maximum amount of 13.3 million MYR [3] Industry Trends and Company Outlook - The integrated circuit industry in China is experiencing rapid growth, driven by government policies and funding support [3][4] - Despite a decline in market demand in the first half of 2019, a gradual recovery is anticipated, particularly with the introduction of 5G and AI products [4] - The company is well-positioned to benefit from the expected growth in the industry, especially as domestic chip design and manufacturing needs increase [4] Production Facilities - The company operates multiple factories, including locations in Chongqing, Suzhou, Hefei, and Penang, with significant capacity expansion [5] - Each facility focuses on different product types, such as high-density packaging and specific applications in mobile devices and AI [5]