Core Viewpoint - Tongfu Microelectronics (002156) is actively monitoring policies and industry trends related to self-control, domestic substitution, and the localization of equipment and materials to seize opportunities and create value for shareholders [1] Group 1 - The company is focused on the importance of domestic substitution and localization in its operations [1] - The company plans to disclose details about its top five suppliers in the upcoming 2025 Annual Report [1]

Core Viewpoint - The semiconductor packaging and testing company Tongfu Microelectronics is experiencing significant growth driven by strong demand for AI and storage chips, leading to increased stock prices and plans for further capacity expansion through fundraising efforts [1][25]. Group 1: Company Performance - Tongfu Microelectronics' stock price has increased nearly 20% since January 14, 2026, and over 100% since the low in April 2025, largely due to robust performance and demand from key client AMD [1]. - The company forecasts a net profit of 1.1 billion to 1.35 billion yuan for 2025, representing a growth of 62.34% to 99.24% year-on-year [1]. - For the first three quarters of 2025, Tongfu Microelectronics reported revenue of 20.116 billion yuan, a year-on-year increase of 17.77%, and a net profit of 860 million yuan, up 55.74% [4]. Group 2: Client Relationships - Tongfu Microelectronics has a deep partnership with AMD, which has significantly contributed to its revenue growth, with income from AMD rising from 4.08 billion yuan in 2019 to 12.03 billion yuan in 2024 [3]. - AMD's data center business, which includes GPU sales, has been a major driver of revenue growth, with AMD reporting a 36% increase in revenue to 9.246 billion USD in the latest quarter [3]. Group 3: Capacity Expansion and Financing - The company plans to raise 4.4 billion yuan through a private placement to expand its semiconductor packaging capacity [1]. - Since its listing, Tongfu Microelectronics has raised a total of 28.911 billion yuan, with significant portions coming from bank loans, totaling 18.154 billion yuan [10]. - The company's fixed assets have grown rapidly, reaching 20.28 billion yuan by September 30, 2025, compared to 7.439 billion yuan at the end of 2019 [10]. Group 4: Market Trends and Pricing - The semiconductor packaging industry is experiencing a price increase of nearly 30% due to high demand for AI and storage chips, with expectations for further price hikes [4]. - The company is positioned to benefit from the ongoing AI boom and the increasing demand for advanced packaging technologies [6][25]. Group 5: Shareholder Dynamics - Despite strong performance, the company has maintained a low dividend payout ratio, with cumulative dividends since 2007 totaling only 454 million yuan, reflecting a dividend rate of approximately 9.68% [12]. - The controlling shareholder has recently reduced their stake, cashing out over 840 million yuan, which raises questions about future shareholder returns [18][24].

Group 1 - The core point of the article highlights the performance of the Zhongzheng 500 Growth ETF (562340), which experienced a decline of 1.80% to 1.367 yuan with a trading volume of 1.51 million yuan as of the midday close [1] - Major holdings in the Zhongzheng 500 Growth ETF showed significant declines, including Giant Network down 0.75%, Western Mining down 5.24%, and Jerry Holdings down 8.91% [1] - The fund's performance benchmark is the Zhongzheng 500 Quality Growth Index return multiplied by 100%, managed by Yinhua Fund Management Co., Ltd., with a return of 39.55% since its establishment on April 25, 2024, and an 8.79% return over the past month [1]

Core Viewpoint - The company is positioned as one of the few domestic packaging and testing enterprises with capabilities in HBM packaging and CPO silicon photonic packaging, highlighting its competitive edge in the AI computing packaging sector [1] Group 1: Technology and Innovation - The company has achieved significant breakthroughs in the field of optical-electrical co-packaging (CPO) by 2025, with related products passing initial reliability tests [1] - The self-developed thermal management technology addresses high-end computing power challenges, enhancing the company's technological advantage [1] Group 2: Market Position and Client Considerations - The technological advantages in CPO are becoming a core consideration for leading computing power clients in their collaboration decisions [1] - Future developments will be assessed based on customer and market demands, indicating a responsive approach to market needs [1]

2016年1月，受AI需求驱动，下游存储芯片、AI芯片等产品需求大增，导致下游封测厂商产能紧张。因此，国际封测厂商巨头正在酝酿涨价。 在涨价预期带动下，半导体封测企业股价轮番大涨，国内芯片封测巨头通富微电也不例外，自2026年1月14日以来，公司股价累计涨幅近20%。 事实上，自2025年4月低点以来，通富微电股价涨超100%。公司股价持续上涨，与其火爆的业绩有很大关系。 在AI需求驱动下，2025年通富微电业绩大增。伴随下游持续旺盛，通富微电还计划定增募资44亿元，扩大半导体封测产能。 图 / AMD官网 该财季，AMD实现营业收入92.46亿美元，同比增长36%，实现毛利润47.8亿美元，同比增长40%。 AMD业绩增长主要是旗下数据中心业务收入快速上升，同期，公司数据中心业务营收43.41亿美元，同比增长22%。 AMD数据中心业务主要以GPU为主，2025年AMD旗下Instinct MI350系列GPU放量以及服务器市场份额的增长，推动了公司数据中心业务收入快速上升。 作为AMD芯片的核心封测厂商，通富微电与AMD合作最早可追溯至2016年。彼时通富微电耗资3.71亿美元收购AMD位于中国苏州、马来 ...

从基金十大重仓股角度 数据显示，广发基金旗下1只基金重仓通富微电。广发中证500指数增强A（009608）四季度持有股数 6.67万股，占基金净值比例为1.34%，位居第五大重仓股。根据测算，今日浮亏损失约17.01万元。 2月4日，通富微电跌5.01%，截至发稿，报48.34元/股，成交29.32亿元，换手率3.93%，总市值733.61亿 元。 资料显示，通富微电子股份有限公司位于江苏省南通市崇川开发区崇川路288号，成立日期1994年2月4 日，上市日期2007年8月16日，公司主营业务涉及集成电路的封装和测试。主营业务收入构成为：集成 电路封装测试96.98%，模具及材料销售等3.02%。 广发中证500指数增强A（009608）成立日期2020年10月15日，最新规模1.42亿。今年以来收益 10.52%，同类排名739/5562；近一年收益49.39%，同类排名1296/4285；成立以来收益48.45%。 截至发稿，赵杰累计任职时间7年223天，现任基金资产总规模10.59亿元，任职期间最佳基金回报 77.9%， 任职期间最差基金回报-27.07%。 声明：市场有风险，投资需谨慎。 本文基于第三 ...

Group 1 - The advanced packaging index declined by 2% on February 4, with most constituent stocks experiencing a drop [1] - Taiji Industry fell by 4.53%, Shenzhen Technology decreased by 4.05%, Tongfu Microelectronics dropped by 3.36%, Fuman Micro fell by 2.82%, and Huatian Technology declined by 2.72% [1]

Group 1 - The GPU index declined by 2%, with most constituent stocks experiencing a downturn [1] - Companies such as Cambricon Technologies (寒武纪-U) and Tongfu Microelectronics (通富微电) fell over 3%, while Longxin Technology (龙芯中科), Beijing Junzheng (北京君正), and Huatian Technology (华天科技) dropped more than 2% [1]

Group 1 - Northern Huachuang is a leading domestic semiconductor equipment manufacturer, covering core process equipment such as etching machines, thin film deposition equipment, and cleaning machines, which are essential for memory chip manufacturing [1] - The company is expected to benefit from the growth in equipment orders driven by the expansion and technological upgrades of domestic memory manufacturers during the memory chip price increase cycle [1] - Northern Huachuang has made breakthroughs in advanced process equipment for 3D NAND and HBM, establishing a core competitive advantage in the global memory equipment market [1] Group 2 - Hua Hong Semiconductor is a leading domestic specialty process manufacturer with mature memory chip foundry capabilities, focusing on NOR Flash, eMMC, and SPI NAND [2] - The company is expected to benefit from the rising demand for memory chip foundry services as domestic memory manufacturers expand production [2] - Hua Hong's layout in automotive-grade memory chip foundry will further enhance its resilience against economic cycles [2] Group 3 - Zhongwei Company is a core supplier of etching equipment, with its 5nm etching machine already integrated into the supply chain of memory manufacturers [3] - The demand for high-end equipment is expected to grow due to the trend of upgrading memory chips to advanced processes like 3D NAND and HBM [3] - Zhongwei's layout in thin film deposition equipment enhances its service capabilities for memory manufacturers [3] Group 4 - Lanke Technology is a global leader in memory interface chips, with its products widely used in servers and PCs, holding a leading share in the DDR5 interface chip market [4] - The demand for DDR5 interface chips is expected to surge due to the explosion in AI server and high-end PC demand during the memory chip price increase cycle [4] - Lanke's breakthroughs in HBM interface chips will further open up growth opportunities [4] Group 5 - GigaDevice is a leading domestic memory chip design company, focusing on NOR Flash while also expanding into NAND Flash and DRAM [5] - The company is expected to benefit from the price increase of NOR Flash products driven by the recovery of consumer electronics and AI terminal demand [5] - GigaDevice's layout in automotive-grade memory chips will further expand its downstream application space [5] Group 6 - Shengyi Technology is a leading domestic copper-clad laminate manufacturer, with its products being core raw materials for memory chip packaging [6][7] - The growth in demand for copper-clad laminates is expected to be driven by the expansion of memory manufacturers and the increase in packaging needs during the memory chip price increase cycle [6][7] - Shengyi's breakthroughs in high-frequency and high-speed copper-clad laminates will adapt to the upgrade demands of memory chips [6][7] Group 7 - Shenzhen South Circuit is a leading domestic PCB manufacturer, with its high-end PCB products being core carriers for storage servers and modules [8] - The demand for high-end PCBs is expected to grow due to the explosion in AI server demand and the expansion of memory manufacturers during the memory chip price increase cycle [8] - Shenzhen South Circuit's layout in storage packaging substrates further enhances its position in the memory industry chain [8] Group 8 - Jiangbolong is a leading domestic storage module manufacturer, focusing on the development and manufacturing of storage modules for various applications [9] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [9] - Jiangbolong's layout in automotive-grade storage modules will further open up downstream application spaces [9] Group 9 - Xi'an Yicai is a core enterprise in semiconductor materials, focusing on silicon-based materials essential for memory chip manufacturing [10] - The demand for silicon-based materials is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [10] - Xi'an Yicai's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [10] Group 10 - Tuojing Technology is a leading domestic thin film deposition equipment manufacturer, with its PECVD and ALD equipment being core process equipment for memory chip manufacturing [11] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of 3D NAND technology during the memory chip price increase cycle [11] - Tuojing's layout in HBM-related equipment will further adapt to the upgrade demands driven by AI [11] Group 11 - Maiwei Co. is a core domestic semiconductor equipment enterprise, with its equipment already integrated into the supply chain of leading domestic memory manufacturers [12] - The growth in equipment orders is expected to be driven by the expansion of memory manufacturers and the increase in advanced packaging demand during the memory chip price increase cycle [12] - Maiwei's breakthroughs in HBM packaging equipment will adapt to the upgrade demands driven by AI [12] Group 12 - Shengmei Shanghai is a leading domestic semiconductor cleaning equipment manufacturer, with its single-wafer cleaning equipment integrated into the supply chain of leading memory manufacturers [13] - The demand for cleaning equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [13] - Shengmei's breakthroughs in 3D NAND cleaning technology will adapt to the technical iteration needs of memory chips [13] Group 13 - Changdian Technology is a leading domestic packaging and testing enterprise, covering the packaging and testing of various memory chip types [14] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [14] - Changdian's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [14] Group 14 - Changchuan Technology is a leading domestic semiconductor testing equipment manufacturer, with its testing equipment covering memory and logic chips [15] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [15] - Changchuan's breakthroughs in DDR5 and HBM testing technologies will adapt to the upgrade demands driven by AI [15] Group 15 - Baiwei Storage is a leading domestic storage chip design and module manufacturer, focusing on various storage modules for different applications [16] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [16] - Baiwei's layout in automotive-grade storage will further open up downstream application spaces [16] Group 16 - China Resources Microelectronics is a leading domestic power semiconductor and storage chip manufacturer, focusing on NOR Flash and eMMC [17] - The company is expected to benefit from the recovery in consumer electronics and industrial control demand during the memory chip price increase cycle [17] - China Resources' layout in automotive-grade storage chips will enhance its resilience against economic cycles [17] Group 17 - Tongfu Microelectronics is a core domestic packaging enterprise, covering the packaging of various memory chip types [18] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [18] - Tongfu's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [18] Group 18 - Yitang Co. is a core domestic semiconductor equipment enterprise, focusing on thin film deposition and rapid thermal processing equipment [19] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [19] - Yitang's breakthroughs in 3D NAND-related equipment will adapt to the technical iteration needs of memory chips [19] Group 19 - Jingsheng Mechanical and Electrical is a leading domestic semiconductor silicon wafer equipment manufacturer, with its equipment integrated into the supply chain of leading memory manufacturers [20] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the increase in silicon wafer demand during the memory chip price increase cycle [20] - Jingsheng's breakthroughs in 300mm large silicon wafer equipment will adapt to the advanced process needs of domestic storage [20] Group 20 - Xichuang Data is a leading domestic storage module and smart terminal manufacturer, focusing on various storage modules for different applications [21] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [21] - Xichuang's layout in automotive-grade storage will further open up downstream application spaces [21] Group 21 - Shannon Chip is a leading domestic storage chip distribution and solution provider, focusing on distribution and technical services for storage chips [22] - The growth in distribution revenue is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [22] - Shannon's layout in storage module solutions will enhance customer stickiness [22] Group 22 - Hushi Silicon Industry is a leading domestic semiconductor silicon wafer manufacturer, covering various specifications essential for memory chip manufacturing [23] - The demand for silicon wafers is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [23] - Hushi's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [23] Group 23 - Unisoc is a leading domestic security chip and storage chip manufacturer, focusing on eMMC and UFS [24] - The company is expected to benefit from the recovery in consumer electronics and the growth in security storage demand during the memory chip price increase cycle [24] - Unisoc's layout in automotive-grade storage chips will enhance its resilience against economic cycles [24] Group 24 - Fudan Microelectronics is a leading domestic FPGA and storage chip manufacturer, covering various storage chip types [25] - The growth in demand for storage products is expected to be driven by the increase in industrial control demand and the acceleration of domestic substitution during the memory chip price increase cycle [25] - Fudan's layout in automotive-grade storage chips will further open up downstream application spaces [25] Group 25 - Zhongke Feicai is a leading domestic semiconductor testing equipment manufacturer, covering testing equipment for memory and logic chips [26] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [26] - Zhongke's breakthroughs in 3D NAND testing technology will adapt to the technical iteration needs of memory chips [26] Group 26 - Huahai Qingke is a leading domestic chemical mechanical polishing (CMP) equipment manufacturer, with its CMP equipment integrated into the supply chain of leading memory manufacturers [27] - The demand for CMP equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [27] - Huahai's breakthroughs in 3D NAND polishing technology will adapt to the technical iteration needs of memory chips [27]

Core Insights - The semiconductor industry is experiencing a surge in demand for AI chips, leading to price increases of 5-20% by companies like ASE, while Taiwanese firms such as Powertech and Nan Ya are also raising prices by up to 30% due to full order books and near-capacity production [1][3] - TSMC has significantly raised its capital expenditure guidance for 2026 to between $52 billion and $56 billion, a 36.9% increase from 2025, with 10-20% allocated to advanced packaging and testing [2] - The demand for advanced packaging is expected to grow, with major companies like Changdian Technology and Tongfu Microelectronics actively expanding their production capacities to meet this demand [2][3] Industry Developments - The semiconductor packaging industry is seeing structural demand growth, particularly for AI and storage chips, which is tightening the capacity for standard storage chip packaging [3] - Rising prices of raw materials such as gold, silver, and copper are contributing to increased packaging costs, prompting packaging companies to raise prices to maintain profitability [3] - Companies are focusing on high-margin businesses and optimizing product structures in response to the favorable market conditions [3] Investment Recommendations - Investors are advised to focus on domestic companies actively investing in high-end advanced packaging, such as Changdian Technology and Tongfu Microelectronics, as well as the IPO progress of Shenghe Microelectronics [4] - Beneficiary stocks include Yongxi Electronics, Huatian Technology, Shenzhen Technology, and Huicheng Co., among others [4] - Equipment and materials beneficiaries include companies like Changchuan Technology, Jingzhida, and ASMPT, which are positioned to gain from the industry's growth [4]