Financial Performance - The company's revenue for Q3 2024 reached ¥6,001,193,345.64, representing a slight increase of 0.04% year-over-year[2] - Net profit attributable to shareholders was ¥229,851,814.45, marking an impressive increase of 85.32% compared to the same period last year[2] - The net profit after deducting non-recurring gains and losses was ¥224,956,802.54, reflecting a significant growth of 121.20% year-over-year[2] - The basic earnings per share for Q3 2024 was ¥0.1515, an increase of 84.31% year-over-year[2] - The company reported a total profit of ¥742,307,840.18, recovering from a loss of ¥142,535,858.19 in the previous period[19] - Net profit for the current period was ¥625,183,053.82, a significant recovery from a net loss of ¥66,149,704.85 in the previous period[19] - The total comprehensive income for the current period was ¥588,272,156.54, compared to a loss of ¥73,572,179.01 in the previous period[20] Assets and Liabilities - The total assets at the end of the reporting period amounted to ¥38,072,072,071.90, which is a 9.16% increase from the end of the previous year[2] - The total liabilities of the company reached CNY 22,636,310,206.86, compared to CNY 20,183,867,942.87 in the previous quarter, which is an increase of about 12.2%[16] - The equity attributable to shareholders of the parent company increased to CNY 14,466,687,306.30 from CNY 13,917,141,774.57, showing a growth of approximately 3.9%[17] - The company’s long-term borrowings increased to CNY 7,419,743,639.39 from CNY 6,002,589,015.81, indicating a rise of approximately 23.5%[16] Cash Flow - The company's cash flow from operating activities for the year-to-date reached ¥3,077,313,805.57, showing a 15.76% increase compared to the same period last year[2] - Cash flow from operating activities generated a net amount of ¥3,077,313,805.57, an increase from ¥2,658,469,191.81 in the previous period[21] - The net increase in cash and cash equivalents for the period was ¥545,418,514.84, with an EBITDA of ¥3.545 billion, a 21.78% increase compared to the previous period[9] - Cash received from financing activities increased significantly by 2048.37% to ¥432,030,386.28 from ¥20,109,693.00 in the previous period[8] - The ending balance of cash and cash equivalents was CNY 4,832,757,953.35, compared to CNY 4,107,184,684.56 at the end of the previous period[22] Investment Activities - The total cash inflow from investment activities was ¥597,598,648.83, down 78.03% from ¥2,720,073,570.16 in the previous period[8] - The cash outflow for investment activities decreased by 38.70% to ¥4,054,806,978.74 from ¥6,614,389,298.05 in the previous period[8] - Cash outflow from investment activities totaled CNY 4,054,806,978.74, a decrease of 38.5% compared to CNY 6,614,389,298.05 in the previous period[22] - Net cash flow from investment activities was -CNY 3,457,208,329.91, improving from -CNY 3,894,315,727.89 year-over-year[22] Shareholder Information - The total number of ordinary shareholders at the end of the reporting period was 231,749[10] - The largest shareholder, Nantong Huada Microelectronics Group Co., Ltd., holds 19.90% of the shares, totaling 301,941,893 shares[10] - The second-largest shareholder, National Integrated Circuit Industry Investment Fund, holds 11.26% with 170,817,547 shares[10] Research and Development - Research and development expenses totaled ¥956,679,190.47, up from ¥862,277,940.97, indicating a focus on innovation[18] Other Financial Metrics - The company reported a significant reduction in financial expenses by 49.14% year-over-year, amounting to ¥375,475,540.25[6] - The company’s interest income increased by 81.70% year-over-year, reaching ¥65,890,679.78 due to improved fund management[6] - Other income increased to ¥140,220,236.93 from ¥85,290,813.50, showing improved financial performance[18] - The cash received from tax refunds increased to ¥533,647,829.83, a 200.73% increase compared to ¥177,448,551.14 in the previous period[8] - The cash paid for various taxes decreased by 51.57% to ¥56,805,028.74 from ¥117,299,650.97 in the previous period[8]

通富微电子股份有限公司章程 通富微电子股份有限公司 章 程 （2024 年 10 月修改版） 1 | 第一章 | 总则 | 3 | | --- | --- | --- | | 第二章 | 经营宗旨和范围 | 4 | | 第三章 | 股份 | 4 | | | 第一节 股份发行 | 4 | | | 第二节 股份增减和回购 | 5 | | | 第三节 股份转让 | 7 | | 第四章 | 股东和股东大会 | 8 | | | 第一节 股东 | 8 | | | 第二节 股东大会的一般规定 | 11 | | | 第三节 股东大会的召集 | 15 | | | 第四节 股东大会的提案与通知 | 16 | | | 第五节 股东大会的召开 | 18 | | | 第六节 股东大会的表决和决议 | 22 | | 第五章 | 董事会 | 27 | | | 第一节 董事 | 27 | | | 第二节 董事会 | 31 | | 第六章 | 总裁及其他高级管理人员 | 37 | | 第七章 | 监事会 | 39 | | | 第一节 监事 | 39 | | | 第二节 监事会 | 40 | | 第八章 | 财务会计制度、利润分配和审计 | 4 ...

证券代码：002156 证券简称：通富微电 公告编号：2024-066 二、 修订公司章程情况 公司增加注册资本后，根据《中华人民共和国公司法》《中华人民共和国证券法》 《上市公司章程指引》《上市公司股东大会规则》《深圳证券交易所股票上市规则》 等相关法律、法规、规章和规范性文件的最新规定，结合公司实际情况，董事会对 《公司章程》做出修订, 提请股东大会授权董事会及具体经办人全权办理本次修改 《公司章程》的相关变更登记手续以及其他涉及的相关业务。《公司章程》主要修订 前后对照表如下。 除上述条款修订外，《公司章程》其他内容不变。 通富微电子股份有限公司 关于变更公司注册资本并修订《公司章程》的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假记 载、误导性陈述或重大遗漏。 2024 年 10 月 29 日，通富微电子股份有限公司（以下简称"公司"或"通富微 电"）召开了第八届董事会第七次会议，审议通过了《关于变更公司注册资本并修 订<公司章程>的议案》，该议案尚需提交股东大会审议。现将有关详情公告如下： 一、公司增加注册资本情况 通富微电于 2023 年 5 月 30 日召开第七届董事会 ...

证券代码：002156 证券简称：通富微电 公告编号：2024-064 通富微电子股份有限公司 第八届董事会第七次会议决议公告 通富微电子股份有限公司（以下简称"公司"）第八届董事会第七次会议， 于 2024 年 10 月 18 日以邮件等方式发出会议通知，各位董事已知悉与所议事项 相关的必要信息，公司第八届董事会第七次会议于 2024 年 10 月 29 日以通讯表 决方式召开。公司全体 8 名董事均行使了表决权，会议实际有效表决票 8 票。会 议召开符合有关法律、行政法规、部门规章、规范性文件和公司章程的规定。 二、 董事会会议审议情况 1、审议通过了《公司 2024 年第三季度报告》 本议案已经第八届董事会审计委员会第五次会议审议通过，并提交董事会审 议。 具体内容详见巨潮资讯网（http://www.cninfo.com.cn）披露的《2024 年第 三季度报告》。 2、审议通过了《关于修订<风险投资内部控制制度>的议案》 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚假 记载、误导性陈述或重大遗漏。 一、 董事会会议召开情况 表决结果：8 票同意；0 票反对；0 票弃权。 具体内容 ...

第一条 为加强与规范通富微电子股份有限公司（以下简称"公司"或"本公 司"）风险投资业务的管理，强化风险控制，有效防范投资风险，维护公司及股东利 益，依据《证券法》《深圳证券交易所股票上市规则》（以下简称"《股票上市规则》"） 《深圳证券交易所上市公司自律监管指引第 1 号—主板上市公司规范运作》《深圳 证券交易所上市公司自律监管指引第 7 号——交易与关联交易》等法律、法规、规 范性文件以及《通富微电子股份有限公司章程》（以下简称"《公司章程》"）的有 关规定，结合公司的实际情况，特制定本制度。 第二条 本制度所称风险投资，主要是指包括证券投资、委托理财、期货交易、 衍生品交易以及深圳证券交易所（以下简称"交易所"）认定的其他投资行为。 证券投资包括新股配售或者申购、证券回购、股票及存托凭证投资、债券投资 以及深圳证券交易所认定的其他投资行为。 委托理财是指公司委托银行、信托、证券、基金、期货、保险资产管理机构、 金融资产投资公司、私募基金管理人等专业理财机构对其财产进行投资和管理或者 购买相关理财产品的行为。 通富微电子股份有限公司风险投资内部控制制度 通富微电子股份有限公司 风险投资内部控制制度 第一章 ...

证券代码：002156 证券简称：通富微电 公告编号：2024-063 通富微电子股份有限公司 关于与专业投资机构共同投资合伙企业的进展公告 本公司及董事会全体成员保证信息披露内容的真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 重要内容提示： 通富微电子股份有限公司（以下简称"公司"或"通富微电"）出资2亿 元受让深圳市领先半导体发展有限公司（以下简称"领先半导体"）持有的滁州 广泰半导体产业发展基金（有限合伙）（以下简称"滁州广泰"或"基金"） 146,722,355.58元出资额（占滁州广泰合伙份额的31.90%）（以下简称"本次投 资 " ） ， 以 间 接 持 有 引 线 框 架 供 应 商 Advanced Assembly Materials International Limited（以下简称"AAMI"、"目标公司"）股权。 深圳至正高分子材料股份有限公司（股票简称：至正股份，股票代码： 603991）拟收购AAMI控制权，至正股份将向公司发行股份收购公司持有的滁州广 泰全部财产份额和相关权益（以下简称"本次交易"）。至正股份收购AAMI交易 涉及向上海证券交易所（以下简称"上交所 ...

证券代码：002156 证券简称：通富微电 公告编号：2024-062 通富微电子股份有限公司 关于与专业投资机构共同投资合伙企业的公告 本公司及董事会全体成员保证信息披露内容的真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 重要内容提示： 通富微电子股份有限公司（以下简称"公司"或"通富微电"）拟出资2 亿元受让深圳市领先半导体发展有限公司（以下简称"领先半导体"）持有的滁 州广泰半导体产业发展基金（有限合伙）（以下简称"滁州广泰"或"基金"） 146,722,355.58元出资额（占滁州广泰合伙份额的31.90%）（以下简称"本次投 资 "），以 间 接 持 有 引线框架供应商 Advanced Assembly Materials International Limited股权（以下简称"AAMI"、"目标公司"）。 本次投资不构成关联交易，也不构成《上市公司重大资产重组管理办法》 规定的重大资产重组，本次投资完成后，不会构成同业竞争。根据《深圳证券交 易所股票上市规则》和《公司章程》等相关规定，本次投资金额未达到董事会审 批权限、无需提交董事会审议。 本次公司与领先半导体签署的协议为初步协议 ...

证券代码：002156 证券简称：通富微电 公告编号：2024-061 通富微电子股份有限公司 大股东减持股份预披露公告 持股 5%以上的股东国家集成电路产业投资基金股份有限公司保证向本公司 提供的信息内容真实、准确、完整，没有虚假记载、误导性陈述或重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 特别提示： （二）股东持股情况：截至本公告披露日，首期基金持有公司股份 170,817,547 股，占公司总股本的 11.26%，均为无限售条件流通股。 二、本次减持计划的主要内容 1、减持原因：自身经营管理需要。 2、股份来源：非公开发行股票方式取得的股份，公司于 2018 年 1 月 22 日 披露了《通富微电发行股份购买资产并募集配套资金暨关联交易之实施情况暨新 增股份上市报告书》；协议转让股份，产业基金已于 2018 年 2 月 27 日披露《简 式权益变动公告书》。 3、拟减持股份数量及比例：以集中竞价或大宗交易方式减持本公司股份不 超过 45,527,907 股（即不超过公司股份总数的 3%）。其中，通过大宗交易方式 减持公司股份不超过 30,351,938 股（即不超过公 ...

Investment Rating - The report maintains a "Buy-A" rating for Tongfu Microelectronics (002156 SZ) [1] Core Views - Tongfu Microelectronics' Memory Phase II project has achieved significant progress, with the first equipment installed and a new cleanroom area of 8,000 square meters added, capable of producing 150,000 wafers per month [1] - The company's advanced packaging base project has commenced, focusing on multi-layer stacking, flip-chip, wafer-level, and panel-level packaging, with a total investment of 7 5 billion yuan [1] - The global memory market is expected to grow by 64% in 2024, driven by AI investments and supply adjustments, with NAND Flash and DRAM markets projected to grow by 70 6% and 58 1% respectively [1] - Tongfu Microelectronics is expected to achieve significant revenue growth, with projected revenues of 25 28 billion yuan in 2024, 29 23 billion yuan in 2025, and 34 56 billion yuan in 2026 [3] Financial Performance and Valuation - The company's revenue is forecasted to grow at a CAGR of 15 6% from 2024 to 2026, with net profit margins improving from 3 8% in 2024 to 4 7% in 2026 [4] - EPS is expected to increase from 0 63 yuan in 2024 to 1 06 yuan in 2026, with P/E ratios declining from 28 9x in 2024 to 17 2x in 2026 [4] - ROE is projected to improve significantly, from 7 0% in 2024 to 10 0% in 2026, reflecting stronger profitability and operational efficiency [4] Industry and Market Trends - The memory market is experiencing strong growth due to AI-driven demand, with NAND Flash and DRAM markets expected to reach 680 billion USD and 808 billion USD respectively in 2024 [1] - Smartphone applications are expected to consume 37% of NAND Flash capacity in 2024, while enterprise-level applications, particularly in AI and server upgrades, are driving demand for high-performance memory products [1] Technological Advancements - Tongfu Microelectronics has made significant progress in advanced packaging technologies, including 16-layer chip stacking and WB cavity shielding, with high yield rates [3] - The company is developing FCBGA chip packaging technology using glass substrates and glass interposers, targeting high-performance applications in photonic communication, consumer electronics, and AI [3] - Tongfu Microelectronics has also completed the development of the Easy3B module, which is entering small-scale production, offering improved thermal resistance and power consumption compared to traditional modules [3]

Investment Rating - The report assigns a "Buy" rating (首次) to the company, with a target price of 24.29 yuan based on a 2.5x PB multiple for 2024 [4][9][57] Core Views - The company is a leading semiconductor packaging and testing provider in China, ranking 4th globally and 2nd in mainland China in 2023 [2][7] - As AMD's largest packaging and testing supplier, accounting for over 80% of AMD's orders, the company is well-positioned to benefit from the rapid growth of AI and computing industries [2][5][7] - The company has a comprehensive layout in advanced packaging technologies, including 2D+, 3D stacking, and Chiplet, with several technologies already verified and mass-produced [5][14] - Revenue is expected to grow at a CAGR of 17.59% from 2024 to 2026, with net profit projected to increase significantly due to the company's leadership in advanced packaging and strong customer relationships [5][9] Industry Overview - The global advanced packaging market is expected to grow from $37.4 billion in 2021 to $65 billion by 2027, driven by the increasing difficulty and cost of improving chip performance through process advancements [5][22] - Chiplet technology, which allows for modular chip design, is becoming increasingly important for cost reduction and performance improvement, with the market expected to reach $57 billion by 2035 [25][26][28] - The semiconductor packaging and testing market is dominated by Taiwanese and mainland Chinese companies, with the company holding a 7.9% global market share in 2023 [29] Company Analysis - The company has seven major production bases and plans to acquire a 26% stake in Jinglong Technology to further enhance its industrial layout [36][37] - Revenue from the company's largest customer (AMD) has grown from 42.97% in 2018 to 59.38% in 2023, reflecting a strong and growing partnership [5][34] - The company has made significant progress in areas such as memory, display drivers, and power semiconductors, with several products entering mass production [14][44] - R&D investment has been consistently high, with the company holding over 1,500 patents, more than 60% of which are related to advanced packaging technologies [46][47] Financial Projections - Revenue is forecasted to reach 25.85 billion yuan in 2024, 30.66 billion yuan in 2025, and 36.06 billion yuan in 2026, with a CAGR of 17.59% [5][9] - Net profit is expected to grow significantly, with a projected CAGR of 115.91% from 2024 to 2026, driven by the company's leadership in advanced packaging and strong customer relationships [5][9] - The company's valuation is supported by a FCFE model, which estimates a fair value of 23.16 yuan per share, and a PB multiple of 1.9x, which is below the industry average [52][55][57]