证券代码：002156 证券简称：通富微电 公告编号：2025-050 通富微电子股份有限公司 2025 年第二次临时股东会决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 特别提示： 本次股东会未出现增加、否决或变更提案的情形，也未涉及变更前次股东会 决议的情形。 一、会议召开和出席情况 （一）会议召开情况 1、召开时间： 现场会议召开时间：2025 年 12 月 15 日下午 14：30； 网络投票时间：2025 年 12 月 15 日。通过深圳证券交易所交易系统进行网 络投票的时间为 2025 年 12 月 15 日的交易时间，即上午 9:15-9:25、9:30-11:30 和下午 13:00-15:00；通过深圳证券交易所互联网投票系统投票的时间为 2025 年 12 月 15 日上午 9:15-下午 15:00 期间的任意时间。 2、召开地点：通富微电子股份有限公司会议室（江苏省南通市崇川路 288 号） 3、召开方式：现场会议和网络投票相结合方式 4、会议召集人：公司董事会 5、会议主持人：公司董事长石磊先生 6、本次临时股东会的召集、召 ...

北 京 大 成 （ 南 通 ） 律 师 事 务 所 关 于 通 富 微 电 子 股 份 有 限 公 司 2025 年 第 二 次 临 时 股 东 会 的 法 律 意 见 书 大成证字[2025]第 107 号 北 京 大 成 (南 通 )律 师 事 务 所 江苏省南通市工农南路155号印象城写字楼20楼（226004） 20F, Incity Office Tower, 155 South Gongnong Road, Nantong, Jiangsu Tel: 0513-85119000 Fax: 0513-85119001 法律意见书——通富微电子股份有限公司 2025 年第二次临时股东会 北京大成（南通）律师事务所 关于通富微电子股份有限公司 2025 年第二次临时股东会的法律意见书 大成证字[2025]第 107 号 致：通富微电子股份有限公司 根据《中华人民共和国证券法》（以下简称"《证券法》"）、《中华人民 共和国公司法》（以下简称"《公司法》"）和中国证券监督管理委员会《上市 公司股东会规则》（以下简称"《股东会规则》"）等法律、法规和其他有关规 范性文件的要求，北京大成（南通）律师事务所（以下 ...

Core Viewpoint - The article emphasizes the enduring entrepreneurial spirit of Zhang Jian, a patriotic industrialist from Nantong, and its influence on modern enterprises in the region, showcasing a legacy of innovation, education, and social responsibility that continues to inspire contemporary business practices [6][9][24]. Group 1: Historical Context and Legacy - Zhang Jian's contributions to Nantong include establishing China's first private cotton mill and the first museum run by Chinese nationals, which laid the foundation for a city that integrates industry, education, and culture [6]. - Over a century, Nantong has evolved into a "trillion-yuan city," with Zhang Jian's spirit becoming increasingly prominent through the efforts of modern entrepreneurs who continue to innovate and uphold his values [7][8]. Group 2: Entrepreneurial Spirit and Modern Practices - The essence of Zhang Jian's entrepreneurial spirit is characterized by patriotism, which drives contemporary business leaders to pursue industrial strength and innovation [9][10]. - Modern enterprises in Nantong, such as Tongfu Microelectronics and Zhongtian Technology, embody this spirit by focusing on technological advancements and contributing to national strategic goals, with Zhongtian Technology achieving over 100 billion yuan in revenue by 2024 [13][14][15]. Group 3: Social Responsibility and Community Impact - The commitment to social responsibility has evolved from Zhang Jian's individual efforts to a collective responsibility among modern entrepreneurs, emphasizing the importance of benefiting the community and promoting shared prosperity [24][25]. - Companies like Zhongtian Technology have significantly increased their charitable contributions, reflecting a long-term commitment to social welfare and community development [26][27]. Group 4: Globalization and Open Economy - The spirit of openness initiated by Zhang Jian continues to thrive, with Nantong's business community actively engaging in global markets, evidenced by the international expansion of companies like Tongfu Microelectronics [22][23]. - Nantong's strategic initiatives, such as the "Eight Dragons Crossing the River" plan, aim to enhance connectivity and foster economic growth, further solidifying its position in the global economy [22].

◎记者 黄淑慧 南通市地区生产总值 2020年迈上万亿元台阶 2024年达到1.24万亿元，同比增长6.2% 沪苏通大桥 航拍云雾缭绕的狼山古刹与现代都市 弄潮江海风正劲——解码万亿南通产业升级路 "遨游半在江湖里，始觉今朝眼界开。"站在江苏南通狼山之巅极目远眺，江水浩荡，奔流向海，气势磅 礴。 南通，这片江海相拥的土地，曾是中国近代民族工业的重要发祥地之一，以敢为人先的实践点燃了实业 救国的星火，留下了"近代第一城"的历史印迹；曾作为首批14个沿海开放城市之一，以"纺织之乡""建 筑铁军"等名片，在改革开放的春风里激流勇进。如今，站在"十四五"收官与"十五五"启航的历史交汇 点，面对多重战略机遇叠加的天时，"左右逢源""南通好通"的地利，南通正在加快打造江苏高质量发展 重要增长极，建设长三角北翼中心城市，书写跨江向海、通向未来的新篇章。 南通，始终是江海大地上勇立涛头的弄潮儿。 今年前三季度9788.9亿元，同比增长5.4% 南通市海岸线 长达276公里，约占江苏的1/3 百年实业 薪火相传 源远流长，生生不息。南通的底蕴深藏在"近代第一城"的历史遗存和张謇精神的代代相传中。 南通唐闸大生纱厂的老厂区内，地 ...

Group 1 - The company Tongfu Microelectronics (002156) responded to investor inquiries on December 5, indicating that shareholders wishing to access the shareholder register must provide proof of their shareholding and valid identification for verification by the company [1]

Core Viewpoint - Tongfu Microelectronics has stable supply channels for its main raw materials required for packaging and testing, including lead frames, substrates, bonding wires, and encapsulation materials [2] Group 1 - The company sources its main raw materials both domestically and internationally [2] - The company is attentive to policies and industry trends regarding self-sufficiency, domestic substitution, and localization of equipment and materials [2] - The company aims to seize opportunities from these trends to create value for its shareholders [2]

（文章来源：证券日报） 证券日报网讯 12月5日，通富微电在互动平台回答投资者提问时表示，目前，TPU是谷歌委托ASIC芯片 公司设计和运营的芯片，封测端没有可以发布或分享的信息。 ...

Core Insights - The semiconductor packaging and testing industry is experiencing significant growth driven by emerging fields such as 5G, AI, IoT, and automotive electronics, with the global market expected to reach $82.1 billion in 2024, a 5% increase year-on-year [1] - Domestic packaging and testing market in China is projected to reach 314.6 billion yuan in 2024, reflecting a 7.14% growth compared to 2023, and is expected to exceed 330.33 billion yuan in 2025 [1] - Major domestic companies like Huada Technology, Changdian Technology, and Tongfu Microelectronics are showing positive financial performance, indicating a strong alignment between domestic advanced packaging technology breakthroughs and market demand upgrades [1] Financial Performance of Leading Companies - Huada Technology reported a total revenue of 12.38 billion yuan for the first three quarters, a year-on-year increase of 17.55%, with a net profit of 543 million yuan, up 51.98% [2] - Changdian Technology achieved a revenue of 28.67 billion yuan, a 14.78% increase year-on-year, but its net profit decreased by 11.39% to 950 million yuan [3] - Tongfu Microelectronics saw a revenue of 20.12 billion yuan, a 17.77% increase, and a net profit of 860 million yuan, reflecting a 55.74% growth [3] Growth Drivers - Huada Technology's growth is attributed to technological breakthroughs in DDR5 DRAM packaging and strategic acquisitions, enhancing its market position in high-value segments like automotive electronics [4] - Changdian Technology is optimizing its product structure and responding to market demand changes, with significant revenue increases in sectors like automotive electronics, which grew by 31.3% [5] - Tongfu Microelectronics is benefiting from increased revenue in mid-to-high-end products, particularly from major clients like AMD, indicating successful strategic positioning in the advanced packaging sector [6] Competitive Landscape - The high-end packaging market is becoming increasingly competitive, with both international giants and domestic leaders intensifying their R&D and capacity expansion efforts, particularly in AI chips and automotive electronics [7] - Changdian Technology has developed a comprehensive advanced packaging technology matrix, applicable across various critical sectors, including AI and automotive electronics [8] - Huada Technology is investing in advanced packaging technologies and has initiated collaborations with AI companies, positioning itself to capture emerging market opportunities [10] Industry Outlook - The domestic advanced packaging industry is transitioning to a phase of high-quality development characterized by technology-driven growth and structural upgrades [11] - Continued demand from AI and automotive electronics sectors, along with advancements in domestic packaging materials and equipment, will enable domestic companies to narrow the gap with international competitors [11] - Companies with strong R&D capabilities and a focus on high-margin products are expected to lead the market and benefit from the overall growth of the semiconductor industry [11]

Core Insights - On December 2, 2023, brokerage firms provided target prices for listed companies, with notable increases for Xianhui Technology, Kweichow Moutai, and Delong股份, showing target price increases of 42.61%, 42.06%, and 36.94% respectively, across the battery, liquor, and automotive parts industries [1][2]. Target Price Increases - The companies with the highest target price increases are: - Xianhui Technology (688155) with a target price of 84.00 and an increase of 42.61% [2] - Kweichow Moutai (600519) with a target price of 2040.00 and an increase of 42.06% [2] - Delong股份 (300473) with a target price of 38.59 and an increase of 36.94% [2] - A total of 15 listed companies received brokerage recommendations on December 2, with Mengbaihe, Aladdin, and Jiuzhou Pharmaceutical each receiving one recommendation [2]. Rating Adjustments - On December 2, one company had its rating upgraded, specifically China Resources Sanjiu (0009999), which was upgraded from "Hold" to "Buy" by Western Securities [3][4]. First-Time Coverage - Nine companies received first-time coverage from brokerages on December 2, including: - Mengbaihe (603313) rated "Hold" by Industrial Securities [5] - Jiuzhou Pharmaceutical (603456) rated "Buy" by Xiangcai Securities [5] - Delong股份 (300473) rated "Buy" by Northeast Securities [5] - Others include Minshida, Tongfu Microelectronics, Xianhui Technology, Rongqi Technology, Tianyue Advanced, and Beifang Huachuang, all receiving various ratings [5].

Investment Rating - The industry investment rating is "Outperform the Market" (maintained) [3] Core Viewpoints - The report highlights that AI is driving advanced packaging demand, with significant growth in storage-related businesses [2][4] - The semiconductor packaging sector experienced a slight decline in gross margin in Q3 2025, but year-on-year comparisons show growth [11][12] - The report emphasizes the importance of advanced packaging technologies in enhancing chip performance and integration, particularly with the ongoing development of Chiplet packaging concepts [4][5] Summary by Sections Overview - In Q3 2025, the semiconductor packaging sector's gross margin slightly decreased, with a gross margin of 21.09%, which is higher than the average of 15.79% for leading packaging companies [11][12] OSAT (Outsourced Semiconductor Assembly and Test) - AI is significantly boosting demand for advanced packaging, with notable growth in the storage sector [17] - Major companies like ASE achieved revenues of 22.63 billion RMB in Q3 2025, reflecting an 8.34% quarter-on-quarter increase and a 16.90% year-on-year increase [18][19] - Advanced packaging services are expected to continue driving growth, particularly in AI-related applications [19][20] Testing - AI-related business growth is notable, with companies like Jingyuan Electronics reporting a revenue increase of 31.99% year-on-year in Q3 2025 [5][41] - Wei Ce Technology's revenue for the first three quarters of 2025 reached 10.83 billion RMB, a 46.22% year-on-year increase, driven by strong demand in computing and automotive electronics [5][41] Equipment - The report indicates that AI growth is leading to a continuous increase in orders, with companies like Besi reporting a 36.5% quarter-on-quarter increase in new orders [5][41] - ASMPT's revenue in Q3 2025 was 33.13 billion RMB, a 7.6% quarter-on-quarter increase, driven by growth in SMT business [5][41] Investment Recommendations - The report suggests focusing on companies benefiting from AI-driven demand, including packaging companies like ASE, Tongfu Microelectronics, and Changdian Technology, as well as testing companies like Jingyuan Electronics and Wei Ce Technology [5][41]