Core Insights - On December 2, 2023, brokerage firms provided target prices for listed companies, with notable increases for Xianhui Technology, Kweichow Moutai, and Delong股份, showing target price increases of 42.61%, 42.06%, and 36.94% respectively, across the battery, liquor, and automotive parts industries [1][2]. Target Price Increases - The companies with the highest target price increases are: - Xianhui Technology (688155) with a target price of 84.00 and an increase of 42.61% [2] - Kweichow Moutai (600519) with a target price of 2040.00 and an increase of 42.06% [2] - Delong股份 (300473) with a target price of 38.59 and an increase of 36.94% [2] - A total of 15 listed companies received brokerage recommendations on December 2, with Mengbaihe, Aladdin, and Jiuzhou Pharmaceutical each receiving one recommendation [2]. Rating Adjustments - On December 2, one company had its rating upgraded, specifically China Resources Sanjiu (0009999), which was upgraded from "Hold" to "Buy" by Western Securities [3][4]. First-Time Coverage - Nine companies received first-time coverage from brokerages on December 2, including: - Mengbaihe (603313) rated "Hold" by Industrial Securities [5] - Jiuzhou Pharmaceutical (603456) rated "Buy" by Xiangcai Securities [5] - Delong股份 (300473) rated "Buy" by Northeast Securities [5] - Others include Minshida, Tongfu Microelectronics, Xianhui Technology, Rongqi Technology, Tianyue Advanced, and Beifang Huachuang, all receiving various ratings [5].

Investment Rating - The industry investment rating is "Outperform the Market" (maintained) [3] Core Viewpoints - The report highlights that AI is driving advanced packaging demand, with significant growth in storage-related businesses [2][4] - The semiconductor packaging sector experienced a slight decline in gross margin in Q3 2025, but year-on-year comparisons show growth [11][12] - The report emphasizes the importance of advanced packaging technologies in enhancing chip performance and integration, particularly with the ongoing development of Chiplet packaging concepts [4][5] Summary by Sections Overview - In Q3 2025, the semiconductor packaging sector's gross margin slightly decreased, with a gross margin of 21.09%, which is higher than the average of 15.79% for leading packaging companies [11][12] OSAT (Outsourced Semiconductor Assembly and Test) - AI is significantly boosting demand for advanced packaging, with notable growth in the storage sector [17] - Major companies like ASE achieved revenues of 22.63 billion RMB in Q3 2025, reflecting an 8.34% quarter-on-quarter increase and a 16.90% year-on-year increase [18][19] - Advanced packaging services are expected to continue driving growth, particularly in AI-related applications [19][20] Testing - AI-related business growth is notable, with companies like Jingyuan Electronics reporting a revenue increase of 31.99% year-on-year in Q3 2025 [5][41] - Wei Ce Technology's revenue for the first three quarters of 2025 reached 10.83 billion RMB, a 46.22% year-on-year increase, driven by strong demand in computing and automotive electronics [5][41] Equipment - The report indicates that AI growth is leading to a continuous increase in orders, with companies like Besi reporting a 36.5% quarter-on-quarter increase in new orders [5][41] - ASMPT's revenue in Q3 2025 was 33.13 billion RMB, a 7.6% quarter-on-quarter increase, driven by growth in SMT business [5][41] Investment Recommendations - The report suggests focusing on companies benefiting from AI-driven demand, including packaging companies like ASE, Tongfu Microelectronics, and Changdian Technology, as well as testing companies like Jingyuan Electronics and Wei Ce Technology [5][41]

Core Viewpoint - Jin Haitong (603061.SH) announced an adjustment to its related party transaction limits, increasing the total amount for 2025 with Tongfu Microelectronics Co., Ltd. and its subsidiaries from 95.4 million yuan to 110.4 million yuan [1] Summary by Categories Transaction Adjustments - The sales limit to Tongfu Microelectronics is increased by up to 10 million yuan to 37 million yuan, while the sales limit to Tongfu Tongke Microelectronics (Nantong) Co., Ltd. is increased by up to 5 million yuan to 31 million yuan [1] - For the period from January to October 2025, the actual sales amount to related parties reached 70.4512 million yuan [1] Future Projections - The estimated total related party transactions for 2026 with the Tongfu Microelectronics system is expected to not exceed 160 million yuan [1] - Including the approved leasing amount of 14.4 million yuan to Shanghai Xinpeng Industrial Co., Ltd., the total expected related party transactions for 2026 is projected to be no more than 174.4 million yuan [1] Strategic Importance - The Tongfu Microelectronics system is a significant customer for Jin Haitong, and this adjustment in transaction limits supports the ongoing expansion of core businesses such as semiconductor testing and sorting machines [1]

Core Viewpoint - Tongfu Microelectronics Co., Ltd. plans to issue non-financial corporate debt financing instruments in the interbank bond market, with a total amount not exceeding RMB 3 billion to optimize its debt structure and broaden financing channels [1] Group 1 - The company convened the 15th meeting of the 8th Board of Directors on November 28, 2025, to review the proposal for the issuance of debt financing tools [1] - The planned issuance includes short-term financing bonds and medium-term notes, with the specific registration scale subject to approval by the trading association [1] - The initiative aims to meet the operational development needs of the company [1]

Core Viewpoint - The company plans to issue non-financial corporate debt financing instruments in the interbank bond market to optimize its debt structure and broaden financing channels, with a total amount not exceeding RMB 3 billion [1] Group 1: Company Actions - The company convened the 15th meeting of the 8th Board of Directors on November 28, 2025, to review the proposal for issuing debt financing tools [1] - The planned issuance includes short-term financing bonds and medium-term notes, with the specific registration scale subject to approval by the trading association [1]

Group 1 - The company Tongfu Microelectronics (SZ 002156) announced that its 15th meeting of the 8th board of directors was held via telecommunication on November 28, 2025, to review the proposal for amending the "Board Meeting Rules" [1] - For the first half of 2025, the company's revenue composition was 96.98% from integrated circuit packaging and testing, and 3.02% from the sales of molds and materials [1] - As of the report, Tongfu Microelectronics has a market capitalization of 55.6 billion yuan [1]

证券代码：002156 证券简称：通富微电 公告编号：2025-048 3、发行期限：本次超短期融资券的发行期限不超过 270 天（含），中期票据 发行期限不超过 5 年（含），具体发行期限将根据相关法律、法规的规定及发行 时的市场情况确定； 4、发行方式及发行时间：由发行人聘请合格的金融机构承销商，通过簿记 建档、集中配售方式，在注册有效期内根据资金需求和发行时市场情况，择机发 行； 5、发行对象：本次发行对象为全国银行间债券市场的机构投资者（国家法 律、法规禁止的购买者除外）； 通富微电子股份有限公司 关于拟注册发行银行间债券市场非金融企业债务融资工具 的公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 为满足通富微电子股份有限公司（以下简称"公司"）经营发展需要，优化 债务结构，拓宽融资渠道，公司于 2025 年 11 月 28 日召开第八届董事会第十五 次会议，审议通过了《关于拟注册发行银行间债券市场非金融企业债务融资工具 的议案》，公司计划向中国银行间市场交易商协会（以下简称"交易商协会"）申 请注册发行总额不超过人民币 30 亿元（含）的银行间 ...

通富微电子股份有限公司董事和高级管理人员所持本公司股份及其变动管理制度 通富微电子股份有限公司 董事和高级管理人员所持本公司股份 及其变动管理制度 第一章 总 则 第一条 为加强对通富微电子股份有限公司（以下简称公司或本公司）董事和 高级管理人员所持本公司股份及其变动的管理，进一步明确办理程序，根据《中华 人民共和国公司法》（以下简称《公司法》）《中华人民共和国证券法》（以下简 称《证券法》）《上市公司董事和高级管理人员所持本公司股份及其变动管理规则》 《深圳证券交易所上市公司自律监管指引第 10 号——股份变动管理》等法律法规的 有关规定，特制定《通富微电子股份有限公司董事和高级管理人员所持本公司股份 及其变动管理制度》（以下简称本制度）。 第二条 本制度适用于公司的董事和高级管理人员所持本公司股份及其变动的 管理。 第三条 公司董事和高级管理人员所持本公司股份，是指登记在其名下和利用 他人账户持有的所有本公司股份。公司董事和高级管理人员从事融资融券交易的， 其所持本公司股份还包括记载在其信用账户内的本公司股份。 第四条 公司董事和高级管理人员在买卖本公司股票及其衍生品种前，应知悉 《公司法》《证券法》等法 ...

通富微电子股份有限公司董事会专门委员会议事规则 通富微电子股份有限公司 董事会专门委员会议事规则 董事会战略委员会议事规则 第一章 总 则 第一条 为适应通富微电子股份有限公司（以下简称"公司"或"本公司"）战 略发展需要，增强公司核心竞争力，确定公司发展规划，健全投资决策程序，加强 决策科学性，提高重大投资决策的效益和决策的质量，完善公司的治理结构，根据 《公司法》《上市公司治理准则》《公司章程》及其他有关规定，公司特设立董事 会战略委员会，并制定本规则。 第二条 董事会战略委员会是董事会设立的专门工作机构，主要负责对公司长期 发展战略和重大投资决策进行研究并提出建议。 第二章 人员组成 第三条 战略委员会成员由七名董事组成。 第四条 战略委员会委员由董事长、二分之一以上独立董事或者全体董事的三分 之一提名，并由董事会选举产生。 第五条 战略委员会设召集人一名，负责主持战略委员会工作。召集人由董事 长担任。 第六条 战略委员会任期与每一届董事会任期一致，委员任期届满，连选可以 连任。委员在任职期间，如有不再担任公司董事职务情形时，自动失去委员资格， 并根据本规则第三条至第五条的规定予以补足人数。 第三章 职 ...

通富微电子股份有限公司独立董事工作制度 通富微电子股份有限公司 独立董事工作制度 第一章 总则 第一条 为进一步完善公司治理结构，促进公司规范运作，根据《中华人民 共和国公司法》、中国证券监督管理委员会《上市公司独立董事管理办法》（以下 简称《管理办法》）和通富微电子股份有限公司（以下简称"公司"或"本公 司"）章程的有关规定，特制定本制度。 第二章 独立董事 第二条 公司独立董事是指不在公司担任除董事外的其他职务，并与其所受 聘的公司及其主要股东、实际控制人不存在直接或者间接利害关系，或者其他 可能影响其进行独立客观判断关系的董事。 独立董事应当独立履行职责，不受公司及主要股东、实际控制人等单位或 者个人的影响。 第三条 独立董事对公司及全体股东负有忠实与勤勉义务。独立董事应当按 照相关法律法规、《管理办法》和公司章程的规定，认真履行职责，在董事会中发 挥参与决策、监督制衡、专业咨询作用，维护公司整体利益，保护中小股东合法权 益。独立董事原则上最多在3家境内上市公司担任独立董事，并应当确保有足够 的时间和精力有效的履行其独立董事的职责。公司独立董事占董事会成员的比 例不得低于三分之一，且至少包括一名会计专业 ...