长电科技（600584）2025年12月宣布公司旗下车规级芯片封测工厂（JSAC）如期实现通线。京隆科技 2026年1月5日高阶半导体测试项目新厂投产，总投资40亿元，涵盖人工智能、车规级、工业级等高阶芯 片测试领域。通富微电（002156）2026年1月9日披露定增预案，拟定增募资不超44亿元用于存储芯片、 汽车等新兴应用领域、晶圆级封测、高性能计算机通信领域封测产能提升。甬矽电子2026年1月12日公 告拟投资不超过21亿元在马来西亚建设封测基地。此外，日本半导体公司Rapidus计划2026年春季在北 海道启动半导体后道（封测）试产线；海力士2026年1月13日宣布投资19万亿韩元（现汇折算约910亿人 民币）建设清州先进封装工厂P&T7，应对HBM等AI内存需求。 封测涨价：核心推手是结构性需求旺盛与成本传导 据工商时报，日月光因AI芯片需求增长及原材料成本上涨，预计调涨价格5-20%，中国台湾力成、南茂 等封测厂订单饱满，产能接近满载，已启动首轮涨价，涨幅高达30%。结构上看，AI芯片与存储芯片需 求持续高景气，海外存储厂商将资源向先进封装（如HBM）倾斜，可能导致标准型存储芯片的封测产 能趋紧。同 ...

上证报中国证券网讯（刘禹希 记者 徐蔚）截至1月16日，A股两融余额为27315.37亿元，较上一交易日增加127.86亿元，占A股流通市值比例为1.65%。当日 两融交易额为3364.9亿元，较上一交易日增加184.47亿元，占A股成交额的10.99%。 | 序号 | | | | | --- | --- | --- | --- | | | 证券代码 ◆ | 证券简称 ◆ | 交易日期 ◆ | | 1 | 601318.SH | 中国平安 | 2026-01-16 | | 2 | 600089.SH | 特变电工 | 2026-01-16 | | 3 | 600519.SH | 贵州茅台 | 2026-01-16 | | ব | 688525.SH | 佰维存储 | 2026-01-16 | | 5 | 300475.SZ | 香农芯创 | 2026-01-16 | | 6 | 603179.SH | 新泉股份 | 2026-01-16 | | 7 | 688012.SH | 中微公司 | 2026-01-16 | | 8 | 603986.SH | 兆易创新 | 2026-01-16 | | ರಿ | 00 ...

人民财讯1月19日电，通富微电（002156）1月19日在互动平台表示，存储芯片作为信息基础设施的"底 座"，已成为半导体领域国产替代的重点方向之一。公司将在原有存储芯片封测能力的基础上，加快建 设和提升面向存储芯片的本土封测产能与技术。 ...

人民财讯1月19日电，通富微电（002156）1月19日在互动平台表示，随着国产存储芯片技术的日趋成 熟，公司布局多年的存储器产线已稳步进入量产阶段并显著提升了公司在相关领域的市场份额。公司存 储芯片封测能力伴随中国存储半导体产业自主发展同步成长，以晶圆减薄与高堆叠封装能力为核心技 术，业务范围已全面覆盖FLASH、DRAM中高端产品封测，能够满足大容量、高速度、高堆叠、高可 靠性等多维度要求，并与领军企业建立了长期稳定合作关系，形成了完备的量产验证和产业化经验。 ...

半导体 半导体 2026 年 01 月 18 日 投资评级：看好（维持） 行业走势图 数据来源：聚源 -19% 0% 19% 38% 58% 77% 2025-01 2025-05 2025-09 半导体 沪深300 相关研究报告 《AI 算力自主可控的全景蓝图与投资 机遇—行业投资策略》-2026.1.8 《供应链安全事件催化，半导体材料/ 设备自主可控有望提速—行业点评报 告》-2026.1.8 《半导体释放涨价信号，晶圆厂、存 储、模拟有望进入价格上行期—行业 点评报告》-2025.12.25 先进封装龙头积极抢滩布局，产业进入"扩产+提价" 新阶段 ——行业点评报告 陈蓉芳（分析师） 祁海超（联系人） chenrongfang@kysec.cn 证书编号：S0790524120002 qihaichao@kysec.cn 证书编号：S0790125070022 台积电：2026 年资本开支超预期，先进封装持续规模化投入 2026 年 1 月 15 日，台积电召开 2025Q4 交流会，对 2026 年的资本开支指引为 520-560 亿美元（2025 年 409 亿，显著上修至多 36.9%），其中先 ...

Core Viewpoint - The article discusses the significant investment and strategic shifts in the semiconductor packaging industry, particularly focusing on advanced packaging technologies driven by the AI wave and the structural changes in the storage industry [1][2]. Group 1: Investment and Market Trends - SK Hynix announced a 19 trillion KRW (approximately 12.9 billion USD) investment to build an advanced chip packaging factory in Cheongju, South Korea, reflecting the structural changes in the storage industry due to AI [1]. - The global advanced chip packaging market is projected to grow from 50.38 billion USD in 2025 to 79.85 billion USD by 2032, with a compound annual growth rate (CAGR) of 6.8% [2]. - By early 2026, leading packaging and testing companies are expected to ramp up advanced packaging capacity, indicating a competitive landscape focused on advanced packaging capabilities [2]. Group 2: TSMC's Dominance - TSMC is recognized as the leader in advanced packaging, holding over 60% market share in semiconductor manufacturing and establishing significant competitive barriers in advanced packaging technologies [2][3]. - TSMC has developed three branches of CoWoS technology: CoWoS-S for medium-sized chips, CoWoS-R for greater design flexibility, and CoWoS-L for large AI chips [3]. - TSMC's SoIC technology, based on CoWoS and wafer-on-wafer stacking, offers higher interconnect density and improved performance compared to traditional 2.5D packaging [3]. Group 3: Capacity Expansion and Technological Advancements - TSMC's CoWoS capacity is projected to increase 6-8 times from 2023 to 2026, with a CAGR exceeding 60% [5]. - TSMC's new advanced packaging facilities, including the flagship AP6 plant in Zhunan, are designed for full automation and are expected to handle significant orders from major clients like NVIDIA and AMD [5][6]. - TSMC is also expanding its advanced packaging capabilities in the U.S. with plans for two new facilities in Arizona, focusing on SoIC and CoPoS technologies [6]. Group 4: Competitors' Strategies - ASE, as the largest packaging and testing foundry, is benefiting from the advanced packaging trend, with over 60% of its ATM business expected to come from advanced packaging by 2025 [9]. - ASE is developing its own 2.5D packaging platform, FOCoS, and is expanding its production capacity across multiple sites, including a new K28 plant aimed at meeting the demand for AI and GPU chips [10][11]. - Amkor is enhancing its market position through partnerships, such as its collaboration with Intel on EMIB technology, and expanding its facilities in the U.S. to meet advanced packaging demands [15][16]. Group 5: Mainland China's Participation - Mainland Chinese companies are actively investing in advanced packaging technologies and capacity, with firms like Yongxi Electronics and Changjiang Electronics focusing on high-density packaging and automotive electronics [20][22]. - Yongxi Electronics is establishing a new production base in Malaysia to enhance its overseas strategy, while Changjiang Electronics is expanding its automotive electronics packaging capabilities [21][22]. - Tongfu Microelectronics is also increasing its advanced packaging capacity, particularly in automotive and high-performance computing sectors, to meet growing market demands [23][24]. Group 6: Future Outlook - The article concludes that while TSMC's dominance in advanced packaging is unlikely to be challenged in the short term, other specialized packaging firms are seeking to differentiate themselves through flexible capacity and innovative technologies [25][27]. - The collective expansion of packaging firms represents a significant industry bet on the demand for AI-driven computing power, with the potential for winners to emerge as the market stabilizes and technology paths clarify [27].

机构专用席位净买入金额最多的是雪人集团，该股今日收盘跌停，全天换手率为30.52%，成交额为44.65亿元。因日换手率达30.40%、日跌幅偏离 值达-9.87%上榜龙虎榜，前五大买卖营业部中有3家机构专用席位，为买一、买三、买五，合计净买入23406.96万元。同时上榜的还有深股通专用 席位，净买入665.56万元，营业部席位合计净卖出4.26亿元。资金流向方面，该股全天资金净流出5.67亿元。 通宇通讯，今日收盘下跌8.75%，全天换手率为34.05%，成交额为61.10亿元。因日换手率达34.05%上榜龙虎榜，前五大买卖营业部中有3家机构专 用席位，为买二、买三、买四，合计净买入21050.80万元。同时上榜的还有深股通专用席位，净买入2.18亿元，营业部席位合计净卖出8215.95万 元。资金流向方面，该股全天资金净流入2.60亿元。 红相股份，今日收盘上涨11.33%，全天换手率为40.36%，成交额为31.87亿元。因日换手率达40.36%上榜龙虎榜，前五大买卖营业部中有5家机构 专用席位，为买一、买二、买三、卖一、卖二，合计净买入20166.59万元。资金流向方面，该股全天资金净流入8997.2 ...

证券日报网1月16日讯，通富微电（002156）在接受调研者提问时表示，公司是集成电路封装测试服务 提供商，为全球客户提供从设计仿真到封装测试的一站式服务。公司的产品、技术、服务全方位覆盖了 人工智能、高性能计算、大数据存储、显示驱动、5G等网络通讯、信息终端、消费终端、物联网、汽 车电子、工业控制等多个领域，满足了客户的多样化需求。公司紧紧抓住市场发展机遇，面向未来高附 加值产品以及市场热点方向，立足长远，大力开发扇出型、圆片级、倒装焊等封装技术并扩充其产能； 此外，积极布局Chiplet、2D+等顶尖封装技术，形成了差异化竞争优势。 ...

A股三大指数今日（1月16日）集体小幅回调，沪指险守4100点关口。截至收盘，沪指跌0.26%，报4101.91点；深证成指跌0.18%，创业板指跌0.20%。沪深 京三市成交额达到30568亿元，较昨日放量1180亿元。 盘面上，电子板块逆市领涨，荟聚电子板块核心龙头的电子ETF（515260）全天红盘活跃，场内价格最终收涨2.7%，重仓电子、计算机等行业的智能制造 ETF（516800）场内收涨2.42%；新能源、新材料板块部分个股表现亮眼，新材料ETF（516360）、智能电动车ETF（516380）场内价格双双收涨超1%。 一、台积电业绩远超预期！半导体逆市狂飙，电子ETF（515260）翘尾收涨2.7%，尾盘溢价飙升！兆易创新等4股涨停 电子板块逆市领涨A股所有行业，荟聚电子板块核心龙头的电子ETF（515260）全天红盘活跃，场内价格最终收涨2.7%，斩获日线3连阳！尾盘溢价飙升， 收盘溢价率高达0.93%，显示买盘资金更为强势！ 下跌方面，AI医疗概念继续"降温"，全市场规模最大医疗ETF（512170）下挫2.6%；AI应用概念股全线回调，双线布局"算力+AI应用"的创业板人工智能 ETF（1 ...

Core Viewpoint - The electronic sector is leading the A-share market, with the electronic ETF (515260) showing strong performance, closing up 2.7% and achieving a premium rate of 0.93% at the end of the trading day, indicating strong buying interest [1] Group 1: Market Performance - The electronic sector received a net inflow of 30.511 billion, ranking first among all 31 Shenwan primary industries [2][3] - Major stocks in the electronic ETF, including Zhaoyi Innovation and Changdian Technology, attracted 4.538 billion and 3.181 billion respectively, topping the A-share inflow rankings [2][3] - Semiconductor leaders such as Changdian Technology, Zhaoyi Innovation, and Tongfu Microelectronics hit the daily limit, while Huazhong Microelectronics rose over 13% [4] Group 2: Industry Trends - TSMC's recent earnings report for Q4 2025 exceeded expectations, marking the seventh consecutive quarter of double-digit growth, and raised its 2026 capital expenditure guidance to 52-56 billion USD, reflecting strong and sustainable demand in the AI industry chain [5] - The U.S. government's recent imposition of a 25% tariff on specific semiconductors may create a stronger "accelerated replacement" window for domestic equipment amid increasing supply chain uncertainties [5] - The trend of "self-control and AI resonance" is expected to strengthen further in 2026, with a focus on domestic computing power and semiconductor equipment [5] Group 3: Investment Tools - The electronic ETF (515260) and its linked funds are designed to passively track the electronic 50 index, heavily investing in semiconductor and consumer electronics sectors, including AI chips, automotive electronics, and PCB [5] - The ETF serves as an efficient tool for investors to gain exposure to core assets in the electronic sector [5]