Group 1 - The HBM index rose by 2% during intraday trading on January 28 [1] - Among the constituent stocks, Deep Technology surged by 7% [1] - Taiji Industry increased by 6%, while stocks like Tongfu Microelectronics, Guoxin Technology, and Yake Technology also experienced gains [1]

Group 1 - The report emphasizes that advanced packaging is crucial for enhancing chip performance and reliability, especially in the context of the AI wave driving demand for higher integration and performance in semiconductors [8][21][25] - The semiconductor packaging and testing industry in China is expected to grow significantly, with the market size projected to reach 438.98 billion yuan by 2029, reflecting a compound annual growth rate (CAGR) of 5.8% from 2024 to 2029 [28][29] - Advanced packaging is anticipated to account for 50% of the semiconductor packaging market by 2029, with a CAGR of 10.6%, outpacing traditional packaging growth [28][29] Group 2 - The report highlights the rise of independent third-party testing services in the semiconductor industry, driven by the increasing number of IC design companies and the growing demand for testing services [42][43] - The competitive landscape for wafer testing is relatively concentrated due to high technical and investment barriers, with fewer participants compared to finished chip testing [42][43] - The report notes that independent third-party testing firms often collaborate with integrated packaging and testing companies, outsourcing wafer testing while also competing in finished chip testing [42][43]

Investment Rating - The report suggests a focus on companies in the advanced packaging industry and highlights potential investment opportunities in CPU manufacturers like AMD and Intel [3][4]. Core Insights - Intel's recent earnings report confirms a shortage of CPUs, with a revenue of $13.67 billion for Q4 2025, a year-on-year decline of 4.1% but a quarter-on-quarter increase of 3%. The client computing group (CCG) revenue was $8.19 billion, down 6.6% year-on-year, while the data center and AI (DCAI) segment saw a revenue increase of 8.9% to $4.74 billion [2]. - The report emphasizes the rising importance of CPU performance in the Agentic AI era, suggesting that CPU shortages could significantly enhance the profitability of related companies [3]. - The advanced packaging supply chain is experiencing increased demand due to AI investments, with companies like TSMC facing capacity constraints and price increases expected in the packaging sector [4]. - Domestic packaging companies are anticipated to benefit from strong overseas demand and a surge in local demand for advanced packaging processes in 2026 [4]. - The report highlights the emergence of domestic computing power solutions, with significant investments from major internet companies expected in 2026, indicating a growing market for domestic computing power [5][6]. Summary by Sections Intel's Financial Performance - Intel's Q4 2025 revenue was $13.67 billion, with a decline in CCG revenue and growth in DCAI revenue. The guidance for Q1 2026 is between $11.7 billion and $12.7 billion, lower than expected due to capacity constraints [2]. Advanced Packaging Industry - The advanced packaging sector is experiencing a boom, with companies like ASE and Amkor expected to raise prices by 5-20% due to high demand and limited supply [4]. Domestic Computing Power - The report identifies a strong opportunity for domestic computing power solutions, with significant investments from companies like ByteDance and Alibaba expected to drive demand in 2026 [6]. IC Substrate Supply Chain - The IC substrate supply chain is facing shortages due to limited supply of glass fiber, with domestic companies likely to benefit from price increases in the market [7]. Global Computing Power Demand - The report anticipates sustained high growth in computing power demand driven by AI applications, with companies like Google planning to double their computing power every six months [8]. Stock Recommendations - The report recommends several stocks, including domestic computing power companies like Cambricon and SMIC, as well as companies in the advanced packaging and IC substrate sectors [10].

公司于2025年10月17日披露了《大股东减持股份预披露公告》(公告编号：2025-043)，公司控股股东南 通华达微电子集团股份有限公司(简称"华达集团")计划在减持计划公告发布之日起15个交易日后的3个 月内(即2025年11月10日至2026年2月7日)，以集中竞价方式减持持有的公司股份不超过15,175,969股(即 不超过公司股份总数的1%) 通富微电2026年1月9日晚间披露的2026年度向特定对象发行A股股票预案显示，本次向特定对象发行股 票募集资金总额不超过440,000.00万元(含本数)，扣除发行费用后拟全部用于以下项目：存储芯片封测 产能提升项目、汽车等新兴应用领域封测产能提升项目、晶圆级封测产能提升项目、高性能计算及通信 领域封测产能提升项目、补充流动资金及偿还银行贷款。 现公司收到华达集团出具的《关于通富微电子股份有限公司持股5%以上股东股份变动比例触及1%整数 倍暨减持计划提前终止的告知函》，截至2026年1月23日，本次减持计划已减持公司股份15,000,000股， 占公司当前总股本的0.99%，持股比例从19.79%下降至18.80%，华达集团决定提前终止本次减持计划。 通富微 ...

Core Viewpoint - The major shareholder of Tongfu Microelectronics, Nantong Huada Microelectronics Group, has terminated its share reduction plan after reducing its holdings by 15 million shares, representing 0.99% of the company's total shares, and decreasing its ownership from 19.79% to 18.80% [1] Group 1 - Nantong Huada Microelectronics Group planned to reduce its holdings by up to 15,175,969 shares from November 10, 2025, to February 7, 2026, but has now completed a reduction of 15 million shares by January 23, 2026 [1] - The average price at which the shares were sold was 56.04 yuan, resulting in a total cash inflow of approximately 841 million yuan [1] - Since November 29, 2019, Huada Group has cumulatively reduced its holdings by 28.7 million shares, realizing approximately 507 million yuan in cash [2] Group 2 - Tongfu Microelectronics plans to raise up to 440 million yuan through a private placement of A-shares, with the funds allocated for various projects including enhancing storage chip testing capacity and supporting new applications in the automotive sector [2] - Over the past six years, Tongfu Microelectronics has raised a total of 5.965 billion yuan [5]

Group 1 - The A-share market saw a significant rise in CPO concept stocks, with notable increases in several companies' stock prices [1] - Key performers included Juguang Technology, which rose by 10.42%, and Kecuan Technology, which hit the daily limit with a 10% increase [2] - Other companies such as Tianfu Communication and Huilv Ecology also experienced substantial gains, with increases of 8.81% and 6.23% respectively [1][2] Group 2 - The total market capitalization for Juguang Technology is 18.8 billion, while Kecuan Technology has a market cap of 10.6 billion [2] - Year-to-date performance shows Kecuan Technology leading with a 78.86% increase, followed by Juguang Technology at 19.27% [2] - Other companies like Luobotek and Huatians Technology also reported strong year-to-date gains of 51.54% and 28.08% respectively [2]

Performance Reports - Company Kexin New Energy (300731.SZ) expects a net profit of 30 million to 40 million yuan in 2025, representing a year-on-year growth of 73.62% to 131.49% due to the promotion of new battery applications [2] - Company AVIC Chengfei (302132.SZ) anticipates a net profit of 3.4 billion to 3.6 billion yuan in 2025, reflecting a growth of 5.47% to 11.67% compared to the previous year [2] - Company ST Jinggu (600265.SH) projects a revenue of 175 million to 205 million yuan in 2025, with a net loss of 265 million to 215 million yuan, potentially triggering delisting risk [2] - Company Yijiahe (603666.SH) expects a net loss of 35 million to 24 million yuan in 2025, an improvement from a loss of 218 million yuan in the previous year [3] - Company Guoke Micro (300672.SZ) forecasts a net loss of 180 million to 250 million yuan in 2025, a significant decline from a profit of 97.15 million yuan in the previous year [3] - Company Xinbeiyang (002376.SZ) anticipates a net profit of 70 million to 80 million yuan in 2025, a year-on-year increase of 44% to 65% driven by growth in smart logistics equipment [3] - Company Tianyue Advanced (688234.SH) expects a net loss of 185 million to 225 million yuan in 2025 due to increased costs and decreased market prices [4] - Company Jieshun Technology (002609.SZ) projects a net profit of 55 million to 75 million yuan in 2025, representing a growth of 75.23% to 138.96% [4] - Company Lante Optics (688127.SH) expects a net profit of 375 million to 400 million yuan in 2025, a growth of 70.04% to 81.38% [5] - Company Duofuduo (002407.SZ) anticipates a net profit of 200 million to 280 million yuan in 2025, recovering from a loss of 30.8 million yuan in the previous year [5] - Company Efort (688165.SH) expects a net loss of 450 million to 550 million yuan in 2025, with losses expected to widen significantly [5] - Company Pulit (002324.SZ) forecasts a net profit of 361 million to 416 million yuan in 2025, a year-on-year increase of 155.76% to 194.73% [6] - Company Jinchun Co. (300877.SZ) expects a net profit of 82 million to 88 million yuan in 2025, a growth of 165.04% to 184.43% [6] - Company Huahai Pharmaceutical (600521.SH) anticipates a net profit of 224 million to 335 million yuan in 2025, a decline of 70% to 80% [6] Orders and Investments - Company Dinglong Co. (300054.SZ) plans to acquire 70% of Shenzhen Haofei New Materials Co. for 630 million yuan, with a total valuation of 900 million yuan [7] - Company Chuanhuan Technology (300547.SZ) intends to invest approximately 1.1 billion yuan to establish a manufacturing headquarters in Anhui [7] - Company Mongcao Ecological (300355.SZ) has terminated a PPP project agreement, with a total project cost of 83.87 million yuan [7] - Company Fengfan Co. (601700.SH) plans to acquire 51% of Beijing Yanling Jiaye Intelligent Technology Co. for 383 million yuan [8] - Company Haowei Group (603501.SH) intends to invest up to 50 million USD in AI chip supplier Aixin Yuanzhi [8] - Company Chengda Bio (688739.SH) plans to establish a wholly-owned subsidiary with an investment of 1 billion yuan focused on innovative drug development [8] - Company Chengda Bio (688739.SH) is also setting up a pharmaceutical investment fund with a total scale of up to 1 billion yuan [9] - Company Efort (688165.SH) is planning to acquire shares of Shanghai Shengpu Fluid Equipment Co. through a combination of cash and stock [9] Major Shareholder Changes - Company Tongfu Microelectronics (002156.SZ) reports that its controlling shareholder has reduced its stake by 15 million shares, decreasing its holding from 19.79% to 18.80% [10] Listing on Beijing Stock Exchange - Company Xiamen Tungsten (600549.SH) announces that its subsidiary Jinlong Rare Earth is applying for public stock issuance and listing on the Beijing Stock Exchange [11]

通富微电子股份有限公司 关于持股 5%以上股东股份变动比例触及 1%整数倍 暨减持计划提前终止的公告 通富微电子股份有限公司（以下简称"公司"）于 2025 年 10 月 17 日在指定 信息披露媒体《证券时报》和巨潮资讯网（http://www.cninfo.com.cn）披露了 《大股东减持股份预披露公告》（公告编号：2025-043），公司控股股东南通华达 微电子集团股份有限公司（以下简称"华达集团"）计划在本减持计划公告发布 之日起 15 个交易日后的 3 个月内（即 2025 年 11 月 10 日至 2026 年 2 月 7 日）， 以集中竞价方式减持持有的公司股份不超过 15,175,969 股（即不超过公司股份 总数的 1%）。 现公司收到华达集团出具的《关于通富微电子股份有限公司持股 5%以上股 东股份变动比例触及 1%整数倍暨减持计划提前终止的告知函》，截至 2026 年 1 月 23 日，本次减持计划已减持公司股份 15,000,000 股，占公司当前总股本的 0.99%，持股比例从 19.79%下降至 18.80%，华达集团决定提前终止本次减持计划。 具体减持及权益变动情况如下： 证券 ...

证券代码：002156 证券简称：通富微电 公告编号：2026-012 通富微电子股份有限公司 2026 年第一次临时股东会决议公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 特别提示： 本次股东会未出现增加、否决或变更提案的情形，也未涉及变更前次股东会 决议的情形。 网络投票时间：通过深圳证券交易所交易系统进行网络投票的时间为 2026 年 1 月 26 日的交易时间，即上午 9:15-9:25、9:30-11:30 和下午 13:00-15:00； 通过深圳证券交易所互联网投票系统投票的时间为 2026 年 1 月 26 日上午 9:15- 下午 15:00 期间的任意时间。 2、召开地点：通富微电子股份有限公司会议室（江苏省南通市崇川路 288 号） 3、召开方式：现场会议和网络投票相结合方式 4、会议召集人：公司董事会 5、会议主持人：公司董事长石磊先生 6、本次临时股东会的召集、召开与表决程序符合《公司法》《上市公司股东 会规则》《深圳证券交易所股票上市规则》及公司章程等法律、法规及规范性文 件的规定。 （二）会议出席情况 出席本次临时股东会现 ...

北 京 大 成 （ 南 通 ） 律 师 事 务 所 关 于 通 富 微 电 子 股 份 有 限 公 司 2026 年 第 一 次 临 时 股 东 会 的 法 律 意 见 书 大成证字[2026]第 15 号 北 京 大 成 (南 通 )律 师 事 务 所 江苏省南通市工农南路155号印象城写字楼20楼（226004） 20F, Incity Office Tower, 155 South Gongnong Road, Nantong, Jiangsu Tel: 0513-85119000 Fax: 0513-85119001 法律意见书——通富微电子股份有限公司 2026 年第一次临时股东会 北京大成（南通）律师事务所 关于通富微电子股份有限公司 2026 年第一次临时股东会的法律意见书 大成证字[2026]第 15 号 致：通富微电子股份有限公司 根据《中华人民共和国证券法》（以下简称"《证券法》"）、《中华人民 共和国公司法》（以下简称"《公司法》"）和中国证券监督管理委员会《上市 公司股东会规则》（以下简称"《股东会规则》"）等法律、法规和其他有关规 范性文件的要求，北京大成（南通）律师事务所（以下简称 ...