Core Viewpoint - The 22nd China International Semiconductor Expo (IC China 2025) will be held from November 23 to 25, 2025, at the National Convention Center in Beijing, showcasing advancements in the semiconductor industry, particularly in AI chips and advanced manufacturing processes [2][3]. Industry Overview - IC China has been a significant event in the semiconductor industry since 2003, establishing itself as a top-tier industry brand and benchmark [3]. - The expo will focus on the entire integrated circuit industry chain, highlighting the latest technologies, products, and applications, with a theme of "Gathering Strength in Chips, Driving the Future" [4]. Exhibition Details - The expo will feature seven major exhibition areas, including IC design, industry chain, innovative applications, and components, with over 600 exhibitors expected [5]. - Notable companies participating include Yangtze Memory Technologies, Huada Jiutian, and Tongfu Microelectronics, among others [5]. Market Trends - China's semiconductor industry is projected to exceed $180 billion in sales by 2024, with a significant portion of this growth driven by domestic innovation and reduced reliance on imports [6]. - In the first ten months of this year, China's integrated circuit exports reached approximately $161.7 billion, indicating a year-on-year increase of over 23% [6][7]. Growth Projections - The semiconductor industry is expected to experience a dual breakthrough in technology and scale, with a compound annual growth rate (CAGR) of 19.6% in chip design from 2006 to 2025 [13]. - By 2026, the semiconductor industry is anticipated to maintain a CAGR of over 10% [14]. R&D Investments - A-share semiconductor companies are projected to invest over $80 billion in R&D in 2024, with a research intensity exceeding 13% [15]. - The highest growth in revenue from 2021 to 2024 is expected in semiconductor equipment, integrated circuit manufacturing, and discrete devices [15]. Investment Insights - The National Integrated Circuit Industry Investment Fund has significant holdings in 32 companies within the semiconductor industry, with many experiencing substantial increases in financing [17]. - Companies like Shengke Communication and Jiangbolong have seen financing balances increase by over 400% and 350%, respectively, indicating strong investor interest [18]. Stock Performance - Among the 32 companies with National Fund holdings, 12 have seen stock price increases of less than 30% this year, despite significant increases in financing [19]. - Notable companies include Hu Silicon Industry and Tai Ling Microelectronics, with financing balances increasing by over 85% and 187%, respectively [19][20].

Group 1 - The core viewpoint of the article emphasizes the transition of the integrated circuit industry from traditional transistor scaling to system-level integration and architecture innovation, particularly highlighting the importance of advanced packaging and testing in enhancing chip performance and optimizing system power consumption [2][4][9]. Group 2 - The integrated circuit manufacturing industry consists of three main segments: chip design, wafer manufacturing, and packaging testing, with packaging testing further divided into packaging and testing processes [4][6]. - Advanced packaging is a critical aspect of modern integrated circuit manufacturing, focusing on enhancing functionality density and system-level optimization, distinguishing itself from traditional packaging methods [9][11]. Group 3 - The global integrated circuit packaging and testing industry has shifted from its early development in Europe and the United States to emerging markets in Asia, with Taiwan, mainland China, and the United States forming a triad in the current market landscape [14][16]. - The market size of the global integrated circuit packaging and testing industry is projected to grow from $55.46 billion in 2019 to $101.47 billion in 2024, with a compound annual growth rate (CAGR) of 12.8% [16]. - The advanced packaging market is expected to grow at a CAGR of 10.6% from 2024 to 2029, significantly outpacing the traditional packaging market's 2.1% CAGR [17]. Group 4 - In mainland China, major players in the integrated circuit packaging and testing industry include Longsys Technology, Tongfu Microelectronics, and Huatian Technology, with a market size projected to grow from ¥234.98 billion in 2019 to ¥331.90 billion in 2024, reflecting a CAGR of 7.2% [20][22]. - The advanced packaging market in mainland China is expected to grow at a CAGR of 14.4% from 2024 to 2029, with its market share reaching 22.9% by 2029 [22]. Group 5 - The global advanced packaging industry includes participants from both wafer manufacturing and packaging backgrounds, with significant growth driven by the demand for high-performance computing applications such as artificial intelligence and data centers [24][25]. - The market for Flip Chip (FC) packaging is projected to grow from $18.75 billion in 2019 to $26.97 billion in 2024, with a CAGR of 7.5% [28]. - Chiplet integration packaging is identified as a key growth area, with its market size expected to increase from $2.49 billion in 2019 to $8.18 billion in 2024, reflecting a remarkable CAGR of 26.9% [29]. Group 6 - The advanced packaging technology is widely applied across various sectors, including consumer electronics, mobile communications, and high-performance computing, with significant growth driven by the demand for advanced packaging in smartphones and AI applications [34][42]. - The global computing power is expected to grow from 309.0 EFlops in 2019 to 2,207.0 EFlops in 2024, with a CAGR of 48.2% [36]. Group 7 - The article outlines several trends in the integrated circuit advanced packaging and testing industry, including the acceleration of domestic substitution, the rise of chiplet integration packaging, and the increasing importance of industry chain collaboration [48][50][51]. - The value of advanced packaging is expected to continue rising, driven by the shift towards high-performance applications in AI and data centers [52].

Core Viewpoint - The integrated circuit ETF (562820) opened with a decline of 2.89%, indicating a bearish trend in the sector [1] Group 1: ETF Performance - The integrated circuit ETF (562820) opened at 2.083 yuan [1] - Since its establishment on April 12, 2024, the fund has achieved a return of 114.57% [1] - The fund has experienced a return of -4.65% over the past month [1] Group 2: Major Holdings Performance - Major stocks within the ETF showed significant declines, including: - Cambrian (寒武纪) down 2.42% - SMIC (中芯国际) down 2.50% - Haiguang Information (海光信息) down 2.25% - Lattice Technology (澜起科技) down 2.66% - GigaDevice (兆易创新) down 5.07% - Haowei Group (豪威集团) down 1.31% - Chipone (芯原股份) down 4.01% - JCET (长电科技) down 1.44% - Unisoc (紫光国微) down 2.00% - Tongfu Microelectronics (通富微电) down 2.07% [1] Group 3: Management Information - The ETF is managed by Harvest Fund Management Co., Ltd. [1] - The fund manager is Tian Guangyuan [1] - The performance benchmark for the ETF is the CSI All-Share Integrated Circuit Index [1]

证券日报网讯 通富微电（002156）11月17日在互动平台回答投资者提问时表示，公司紧跟行业技术发 展趋势，抓住市场发展机遇，面向未来高附加值产品以及市场热点方向，立足长远，大力开发扇出型、 圆片级、倒装焊等封装技术并扩充其产能；此外，积极布局Chiplet、2D+等顶尖封装技术，形成了差异 化竞争优势。 ...

Core Viewpoint - The company is experiencing continuous growth in its memory business, with its production lines entering mass production and significantly increasing its market share in the relevant field [2]. Group 1: Company Performance - The company's memory chip technology is maturing, leading to a stable entry into mass production for its long-planned memory production lines [2]. - The company's capacity utilization is currently quite full, indicating a strong alignment with market demand and customer structure [2]. Group 2: Market Dynamics - The company's capacity utilization will fluctuate based on changes in market supply and demand, as well as customer structure [2].

Core Viewpoint - The integrated circuit ETF (159546) opened with a decline of 1.81%, indicating a bearish trend in the sector [1] Group 1: ETF Performance - The integrated circuit ETF (159546) opened at 1.795 yuan [1] - Since its establishment on October 11, 2023, the fund has achieved a return of 82.90% [1] - The fund's performance over the past month has decreased by 6.56% [1] Group 2: Major Holdings Performance - Major holdings in the ETF include: - SMIC (中芯国际) opened down 0.08% [1] - Cambricon (寒武纪) fell by 2.52% [1] - Haiguang Information (海光信息) decreased by 2.13% [1] - Lattice Technology (澜起科技) dropped by 2.97% [1] - GigaDevice (兆易创新) declined by 5.05% [1] - Haowei Group (豪威集团) fell by 1.18% [1] - Chipone (芯原股份) decreased by 2.10% [1] - JCET (长电科技) dropped by 1.15% [1] - Unisoc (紫光国微) fell by 1.81% [1] - Tongfu Microelectronics (通富微电) decreased by 2.47% [1]

Summary of 3Q25 Results Wrap and Inventory Tracker for China Hardware and Semiconductors Industry Overview - **Industry**: China Hardware and Semiconductors - **Quarter**: 3Q25 Key Points 1. Performance of Tech Hardware and Semiconductors - 21% of companies reported better-than-expected results in 2Q25, down from 35% in the previous quarter, primarily from non-operational sources, Apple casing suppliers, and OSAT [1][2] - Among 29 tech hardware and semiconductor stocks, 6 beat expectations, 4 were in-line, and 19 missed in 3Q25 [2] 2. Inventory Levels - The China tech inventory tracker indicates healthy inventory levels for consumer electronics hardware in 3Q25, while AI hardware remains high due to strategic stocking [1][3] - DIO (Days Inventory Outstanding) for passive components and distributors was low, while DIO for TV, optical communications, and networking reached a 5-year high [3] 3. Apple and Android Supply Chains - The Apple supply chain is expected to experience profit-taking following an upward revision in iPhone build plans, with a projected 95 million iPhone 17 builds in 2H25 [7] - Android supply chains are under pressure due to anticipated profit squeezes from rising memory prices [2][8] 4. AI Hardware Growth - AI supply chains are expected to show high growth visibility in 2026, with upstream material lock-in, capacity expansion, and margin delivery as key themes [1][2][9] - The AI sector may face a slowdown from November to February due to a lack of catalysts, but long-term growth remains promising [9] 5. Localization Trends - Strong localization demand is noted among Chinese mature semiconductors, driven by uncertainties in supply from US vendors [2][11] - The "China-for-China" trend is gaining traction, with international semiconductor vendors increasingly partnering with local firms [11] 6. Company-Specific Insights - **Lens Tech**: Expected to benefit from iPhone cover glass upgrades and AI edge devices, with a target price of Rmb38 [10] - **Victory Giant (VGT)**: Anticipated to see robust growth due to AI-related PCB demand, with a target price of Rmb407 [10] - **Sunny Optical**: Likely to benefit from multiple growth engines in 2026, including automotive and AI smart glasses, with a target price of HK$103 [10] 7. Semiconductor Market Dynamics - Chinese semiconductor makers are experiencing rising inventory levels due to softer consumer demand and seasonal stocking [11] - The automotive sector showed signs of stabilization in 4Q25, ahead of new EV purchase tax incentives starting January 2026 [11] 8. Revenue and Growth Projections - Global smartphone shipments grew by 2.6% YoY in 3Q25, while TV shipments declined by 4.9% YoY [6][8] - Revenue growth for smartphone components suppliers was reported at 9% YoY, with net profits increasing by 35% YoY [6] 9. Challenges and Risks - Concerns over memory price hikes are expected to pressure profit margins for smartphone manufacturers [8] - The semiconductor industry faces oversupply issues, particularly in power discrete components, which may hinder recovery [2][11] 10. Analyst Recommendations - Analysts have downgraded certain stocks, such as Sanan, to Sell due to lack of recovery signs, while maintaining Buy ratings on companies like ASMPT and Chroma due to their strong market positions and growth potential [2][11] This summary encapsulates the key insights and trends from the 3Q25 results wrap and inventory tracker for the China hardware and semiconductor industry, highlighting performance metrics, inventory levels, supply chain dynamics, and company-specific forecasts.

Market Overview - The semiconductor sector experienced a decline of 1.13% on November 7, with Daway Technology leading the drop [1] - The Shanghai Composite Index closed at 3997.56, down 0.25%, while the Shenzhen Component Index closed at 13404.06, down 0.36% [1] Top Gainers in Semiconductor Sector - Kangqiang Electronics (002119) saw a significant increase of 10.02%, closing at 21.08 with a trading volume of 745,900 shares [1] - Wentai Technology (600745) rose by 9.70%, closing at 45.00 with a trading volume of 902,200 shares [1] - Changguang Huaxin (688048) increased by 9.01%, closing at 87.50 with a trading volume of 268,200 shares [1] Top Losers in Semiconductor Sector - Daway Technology (002213) fell by 5.66%, closing at 26.48 with a trading volume of 604,100 shares [2] - Canxin Technology (688691) decreased by 5.28%, closing at 115.73 with a trading volume of 67,900 shares [2] - Fudan Microelectronics (688385) dropped by 4.85%, closing at 57.90 with a trading volume of 136,600 shares [2] Capital Flow Analysis - The semiconductor sector experienced a net outflow of 4.338 billion yuan from institutional investors, while retail investors saw a net inflow of 2.454 billion yuan [2][3] - Notable net inflows from retail investors were observed in Kangqiang Electronics and New Clean Energy, with net inflows of 1.41 billion yuan and 1.15 billion yuan respectively [3] Summary of Trading Data - The trading data indicates a mixed performance among semiconductor stocks, with significant volatility in both gains and losses across various companies [1][2][3]

Investment Rating - The industry rating is "Outperform the Market" (maintained rating) [7] Core Viewpoints - The semiconductor industry is experiencing robust growth driven by AI and domestic substitution, with significant performance improvements across various segments [5][17] - The A-share semiconductor sector achieved total revenue of 1570.74 billion RMB in Q3 2025, with a net profit of 180.60 billion RMB, reflecting a year-on-year increase of 59.91% and a quarter-on-quarter growth of 25.92% [2][28] - The report highlights a structural growth trend, with digital chip design revenue increasing by 35.01% year-on-year and analog chip design net profit soaring by 1422.73% [2][28] Summary by Sections 1. Q3 2025 Semiconductor Performance Summary - The A-share semiconductor sector's revenue reached 1570.74 billion RMB, with a net profit of 180.60 billion RMB, marking a year-on-year increase of 59.91% and a quarter-on-quarter increase of 25.92% [2][28] - The digital chip design segment saw a revenue increase of 35.01% year-on-year, while the analog chip design segment's net profit surged by 1422.73% [2][28] 2. Foundry, Testing, and Equipment Materials - The wafer foundry sector showed a steady recovery with high capacity utilization rates, with SMIC's Q3 utilization rate between 85%-95% and Huahong Semiconductor exceeding 100% [3][15] - The testing segment benefited from demand in AI and automotive electronics, with notable revenue growth from Longi Technology and Tongfu Microelectronics [3][15] 3. IC Design Sector - The SoC sector performed well due to increased penetration of AI hardware, with companies like Rockchip and Amlogic reporting significant profit growth [4][16] - The storage segment is entering a "super cycle," with DRAM prices rising significantly, leading to substantial profit increases for companies like Jiangbolong [4][16] 4. Overall Market Outlook - The global semiconductor market is expected to maintain an optimistic growth trajectory in 2025, driven by AI and domestic substitution efforts [5][17] - The report suggests focusing on storage, power, foundry, ASIC, and SoC segments for performance elasticity, as well as the ongoing domestic substitution in equipment materials and computing chips [5][17]

Investment Rating - The report rates the advanced packaging industry as "stronger than the market" [1] Core Viewpoints - The advanced packaging technology is positioned as a key path to overcome the limitations of Moore's Law, driven by the exponential growth in computing power required for AI and large model training [2][14] - The global advanced packaging market is projected to exceed $79 billion by 2030, highlighting its role as a core growth engine in the semiconductor industry [2][23] - The demand for advanced packaging is surging due to the increasing need for high-performance AI chips, with TSMC's CoWoS technology becoming a critical support process for high-performance AI chips [2][17] Summary by Sections Chapter 1: Growing Demand for Intelligent Computing - The demand for intelligent computing is rapidly increasing, with significant growth in enterprise-level markets [5][9] - China's intelligent computing scale is expected to reach 725.3 EFLOPS in 2024, a year-on-year increase of 74.1% [9][10] Chapter 2: Diverse Packaging Paths - Advanced packaging technologies are evolving rapidly, with a focus on 2.5D/3D packaging solutions that are gaining popularity [2][18] - The global advanced packaging market is expected to grow from $46.1 billion in 2024 to $79.1 billion by 2030, with a compound annual growth rate (CAGR) of 21.71% for 2.5D/3D packaging [23][24] Chapter 3: Investment Recommendations - The report suggests focusing on key players in the advanced packaging sector, such as Changdian Technology, Tongfu Microelectronics, and JCET [2][24]