Group 1 - The GPU index declined by 2%, with most constituent stocks experiencing a downturn [1] - Companies such as Cambricon Technologies (寒武纪-U) and Tongfu Microelectronics (通富微电) fell over 3%, while Longxin Technology (龙芯中科), Beijing Junzheng (北京君正), and Huatian Technology (华天科技) dropped more than 2% [1]

Group 1 - Northern Huachuang is a leading domestic semiconductor equipment manufacturer, covering core process equipment such as etching machines, thin film deposition equipment, and cleaning machines, which are essential for memory chip manufacturing [1] - The company is expected to benefit from the growth in equipment orders driven by the expansion and technological upgrades of domestic memory manufacturers during the memory chip price increase cycle [1] - Northern Huachuang has made breakthroughs in advanced process equipment for 3D NAND and HBM, establishing a core competitive advantage in the global memory equipment market [1] Group 2 - Hua Hong Semiconductor is a leading domestic specialty process manufacturer with mature memory chip foundry capabilities, focusing on NOR Flash, eMMC, and SPI NAND [2] - The company is expected to benefit from the rising demand for memory chip foundry services as domestic memory manufacturers expand production [2] - Hua Hong's layout in automotive-grade memory chip foundry will further enhance its resilience against economic cycles [2] Group 3 - Zhongwei Company is a core supplier of etching equipment, with its 5nm etching machine already integrated into the supply chain of memory manufacturers [3] - The demand for high-end equipment is expected to grow due to the trend of upgrading memory chips to advanced processes like 3D NAND and HBM [3] - Zhongwei's layout in thin film deposition equipment enhances its service capabilities for memory manufacturers [3] Group 4 - Lanke Technology is a global leader in memory interface chips, with its products widely used in servers and PCs, holding a leading share in the DDR5 interface chip market [4] - The demand for DDR5 interface chips is expected to surge due to the explosion in AI server and high-end PC demand during the memory chip price increase cycle [4] - Lanke's breakthroughs in HBM interface chips will further open up growth opportunities [4] Group 5 - GigaDevice is a leading domestic memory chip design company, focusing on NOR Flash while also expanding into NAND Flash and DRAM [5] - The company is expected to benefit from the price increase of NOR Flash products driven by the recovery of consumer electronics and AI terminal demand [5] - GigaDevice's layout in automotive-grade memory chips will further expand its downstream application space [5] Group 6 - Shengyi Technology is a leading domestic copper-clad laminate manufacturer, with its products being core raw materials for memory chip packaging [6][7] - The growth in demand for copper-clad laminates is expected to be driven by the expansion of memory manufacturers and the increase in packaging needs during the memory chip price increase cycle [6][7] - Shengyi's breakthroughs in high-frequency and high-speed copper-clad laminates will adapt to the upgrade demands of memory chips [6][7] Group 7 - Shenzhen South Circuit is a leading domestic PCB manufacturer, with its high-end PCB products being core carriers for storage servers and modules [8] - The demand for high-end PCBs is expected to grow due to the explosion in AI server demand and the expansion of memory manufacturers during the memory chip price increase cycle [8] - Shenzhen South Circuit's layout in storage packaging substrates further enhances its position in the memory industry chain [8] Group 8 - Jiangbolong is a leading domestic storage module manufacturer, focusing on the development and manufacturing of storage modules for various applications [9] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [9] - Jiangbolong's layout in automotive-grade storage modules will further open up downstream application spaces [9] Group 9 - Xi'an Yicai is a core enterprise in semiconductor materials, focusing on silicon-based materials essential for memory chip manufacturing [10] - The demand for silicon-based materials is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [10] - Xi'an Yicai's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [10] Group 10 - Tuojing Technology is a leading domestic thin film deposition equipment manufacturer, with its PECVD and ALD equipment being core process equipment for memory chip manufacturing [11] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of 3D NAND technology during the memory chip price increase cycle [11] - Tuojing's layout in HBM-related equipment will further adapt to the upgrade demands driven by AI [11] Group 11 - Maiwei Co. is a core domestic semiconductor equipment enterprise, with its equipment already integrated into the supply chain of leading domestic memory manufacturers [12] - The growth in equipment orders is expected to be driven by the expansion of memory manufacturers and the increase in advanced packaging demand during the memory chip price increase cycle [12] - Maiwei's breakthroughs in HBM packaging equipment will adapt to the upgrade demands driven by AI [12] Group 12 - Shengmei Shanghai is a leading domestic semiconductor cleaning equipment manufacturer, with its single-wafer cleaning equipment integrated into the supply chain of leading memory manufacturers [13] - The demand for cleaning equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [13] - Shengmei's breakthroughs in 3D NAND cleaning technology will adapt to the technical iteration needs of memory chips [13] Group 13 - Changdian Technology is a leading domestic packaging and testing enterprise, covering the packaging and testing of various memory chip types [14] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [14] - Changdian's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [14] Group 14 - Changchuan Technology is a leading domestic semiconductor testing equipment manufacturer, with its testing equipment covering memory and logic chips [15] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [15] - Changchuan's breakthroughs in DDR5 and HBM testing technologies will adapt to the upgrade demands driven by AI [15] Group 15 - Baiwei Storage is a leading domestic storage chip design and module manufacturer, focusing on various storage modules for different applications [16] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [16] - Baiwei's layout in automotive-grade storage will further open up downstream application spaces [16] Group 16 - China Resources Microelectronics is a leading domestic power semiconductor and storage chip manufacturer, focusing on NOR Flash and eMMC [17] - The company is expected to benefit from the recovery in consumer electronics and industrial control demand during the memory chip price increase cycle [17] - China Resources' layout in automotive-grade storage chips will enhance its resilience against economic cycles [17] Group 17 - Tongfu Microelectronics is a core domestic packaging enterprise, covering the packaging of various memory chip types [18] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [18] - Tongfu's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [18] Group 18 - Yitang Co. is a core domestic semiconductor equipment enterprise, focusing on thin film deposition and rapid thermal processing equipment [19] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [19] - Yitang's breakthroughs in 3D NAND-related equipment will adapt to the technical iteration needs of memory chips [19] Group 19 - Jingsheng Mechanical and Electrical is a leading domestic semiconductor silicon wafer equipment manufacturer, with its equipment integrated into the supply chain of leading memory manufacturers [20] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the increase in silicon wafer demand during the memory chip price increase cycle [20] - Jingsheng's breakthroughs in 300mm large silicon wafer equipment will adapt to the advanced process needs of domestic storage [20] Group 20 - Xichuang Data is a leading domestic storage module and smart terminal manufacturer, focusing on various storage modules for different applications [21] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [21] - Xichuang's layout in automotive-grade storage will further open up downstream application spaces [21] Group 21 - Shannon Chip is a leading domestic storage chip distribution and solution provider, focusing on distribution and technical services for storage chips [22] - The growth in distribution revenue is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [22] - Shannon's layout in storage module solutions will enhance customer stickiness [22] Group 22 - Hushi Silicon Industry is a leading domestic semiconductor silicon wafer manufacturer, covering various specifications essential for memory chip manufacturing [23] - The demand for silicon wafers is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [23] - Hushi's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [23] Group 23 - Unisoc is a leading domestic security chip and storage chip manufacturer, focusing on eMMC and UFS [24] - The company is expected to benefit from the recovery in consumer electronics and the growth in security storage demand during the memory chip price increase cycle [24] - Unisoc's layout in automotive-grade storage chips will enhance its resilience against economic cycles [24] Group 24 - Fudan Microelectronics is a leading domestic FPGA and storage chip manufacturer, covering various storage chip types [25] - The growth in demand for storage products is expected to be driven by the increase in industrial control demand and the acceleration of domestic substitution during the memory chip price increase cycle [25] - Fudan's layout in automotive-grade storage chips will further open up downstream application spaces [25] Group 25 - Zhongke Feicai is a leading domestic semiconductor testing equipment manufacturer, covering testing equipment for memory and logic chips [26] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [26] - Zhongke's breakthroughs in 3D NAND testing technology will adapt to the technical iteration needs of memory chips [26] Group 26 - Huahai Qingke is a leading domestic chemical mechanical polishing (CMP) equipment manufacturer, with its CMP equipment integrated into the supply chain of leading memory manufacturers [27] - The demand for CMP equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [27] - Huahai's breakthroughs in 3D NAND polishing technology will adapt to the technical iteration needs of memory chips [27]

Core Insights - The semiconductor industry is experiencing a surge in demand for AI chips, leading to price increases of 5-20% by companies like ASE, while Taiwanese firms such as Powertech and Nan Ya are also raising prices by up to 30% due to full order books and near-capacity production [1][3] - TSMC has significantly raised its capital expenditure guidance for 2026 to between $52 billion and $56 billion, a 36.9% increase from 2025, with 10-20% allocated to advanced packaging and testing [2] - The demand for advanced packaging is expected to grow, with major companies like Changdian Technology and Tongfu Microelectronics actively expanding their production capacities to meet this demand [2][3] Industry Developments - The semiconductor packaging industry is seeing structural demand growth, particularly for AI and storage chips, which is tightening the capacity for standard storage chip packaging [3] - Rising prices of raw materials such as gold, silver, and copper are contributing to increased packaging costs, prompting packaging companies to raise prices to maintain profitability [3] - Companies are focusing on high-margin businesses and optimizing product structures in response to the favorable market conditions [3] Investment Recommendations - Investors are advised to focus on domestic companies actively investing in high-end advanced packaging, such as Changdian Technology and Tongfu Microelectronics, as well as the IPO progress of Shenghe Microelectronics [4] - Beneficiary stocks include Yongxi Electronics, Huatian Technology, Shenzhen Technology, and Huicheng Co., among others [4] - Equipment and materials beneficiaries include companies like Changchuan Technology, Jingzhida, and ASMPT, which are positioned to gain from the industry's growth [4]

中邮证券研报指出，通富微电中高端产品营业收入提升，供应链及上下游产业投资收益增厚业绩。公司 预计2025年度实现归母净利润11.0-13.5亿元，预计同比增长62.34%-99.24%；主要系2025年内，全球半 导体行业呈现结构性增长，公司积极进取，产能利用率提升，营收增幅上升，特别是中高端产品营业收 入明显增加。同时，得益于加强经营管理及成本费用的管控，公司整体效益显着提升。此外，公司准确 把握产业发展趋势，围绕供应链及上下游布局产业投资，取得了较好的投资收益，增厚了公司2025年业 绩。拟定增募资不超过44亿元，强化存储、汽车、晶圆级、高性能计算及通信等领域封测。本次公司定 增募资，主要投向下游高景气度、国产替代加速、技术密集的增长领域，提升现有产能规模与供给弹 性，以更好地承接下游市场复苏及结构性增长机遇，为国内外龙头客户提供更稳健的本土化封测支撑， 并为承接新兴优质客户奠定产能基础，巩固公司在全球封测产业的领先地位。维持"买入"评级。 ...

Investment Rating - The industry investment rating is maintained as "Positive" [4] Core Insights - The demand for AI computing power is driving a persistent shortage in storage [2][8] - Major storage companies are experiencing strong performance, with AI demand expected to continue creating incremental opportunities [6] - The supply of niche storage is under pressure from mainstream storage, leading to a sustained tight supply situation [7] Summary by Sections Investment Recommendations and Targets - Key investment targets include domestic storage chip design companies such as Zhaoyi Innovation, Puran, Jucheng, Dongxin, Beijing Junzheng, and Hengsuo [2][8] - Domestic storage module manufacturers like Jiangbolong, Demingli, and Baiwei Storage are also highlighted [2] - Companies benefiting from storage technology iterations include Lanke Technology, Lianyun Technology, and Aojie Technology [2] - Semiconductor equipment firms such as Zhongwei Company, Jingzhida, and Beifang Huachuang are recommended [2] - Domestic packaging and testing companies like Shentek, Huicheng, and Tongfu Microelectronics are included in the investment targets [2] Market Dynamics - TrendForce has revised upward the price growth rates for DRAM and NAND Flash products for the first quarter, with DRAM contract prices expected to rise by 90-95% and NAND Flash by 55-60% [7] - AI computing demand is becoming the dominant factor in storage demand, with significant price increases anticipated for Server DRAM and Enterprise SSDs [7] - The AI inference process is expected to significantly alter data center storage structures, leading to increased demand for active data storage [7] Niche Storage Supply - Niche storage products like NOR Flash and MLC/SLC NAND Flash are expected to remain in tight supply due to reduced production from major suppliers focusing on mainstream products [7] - The global capacity for MLC NAND Flash is projected to decrease by 41.7% in 2026 due to supply constraints [7]

Summary of Conference Call Notes Industry Overview - The semiconductor packaging and testing industry is entering a strong cycle, with price increases reported by both Taiwanese and mainland Chinese companies. Price hikes for storage packaging have started, with companies like Nanya increasing prices by 30%-40% and major players like ASE raising prices close to 20% [1][5][4]. Key Points on Advanced Packaging - Domestic companies are accelerating their positioning in advanced packaging, with 2026 expected to mark the transition from small-scale to large-scale production. Companies such as Changdian Technology, Tongfu Microelectronics, and others have made significant progress in 2.5D technology [1][6][8]. - The IPO of Shenghe Jingwei is anticipated to reshape the valuation system of the packaging and testing industry, with the company raising 8.4 billion yuan for the development of multi-chip integration packaging technology [1][8]. Domestic Computing Power - The domestic computing power sector is entering a period of intensive model releases, with companies like ByteDance launching new models that significantly drive demand for inference capabilities. ByteDance's average daily token consumption reached approximately 60 trillion in January, with a mid-term target of 180 trillion [1][10]. - Major cloud providers are shifting from single-card to super-node procurement strategies to enhance inference performance and cost-effectiveness, marking 2026 as a pivotal year for the domestic computing power industry [1][10]. CPU Market Trends - CPU demand continues to grow, driven by Microsoft's development of enterprise-level AI applications. The number of enterprise users spending over $1 million quarterly has increased by approximately 82%, with M365 new seat additions growing by 160% year-on-year [2][12]. - The transition to MRDIMM memory modules is noted, which are suitable for high-performance computing and AI applications, with peak bandwidth increasing by nearly 40% compared to standard DDR5 RDIMM [12]. Storage Market Dynamics - The storage market is experiencing robust growth, with contract prices exceeding expectations in Q1 and anticipated further increases in Q2. The strong demand in the storage industry has extended to the semiconductor packaging sector, with domestic packaging companies operating at full capacity [5][4]. Investment Recommendations - Recommended companies for investment include: - Advanced Packaging: Changdian Technology, Tongfu Microelectronics, and Huicheng Co. - Domestic Computing Power: Xinyuan Co. as a core beneficiary. - CPU-related: Guanghetong (PCB), Tongfu Microelectronics (PCB and memory interface chips), and others [9]. Additional Insights - The overall semiconductor packaging sector is in a strong cycle, with high capacity utilization and potential for further price increases. The advancements in 2.5D technology and the upcoming IPOs are expected to create significant investment opportunities [8][6].

Investment Rating - The industry investment rating is maintained as "Positive" [4] Core Insights - The demand for AI computing power is driving a persistent shortage in storage [2][8] - Major storage companies are showing strong performance, with AI demand expected to continue creating incremental opportunities [6] - The supply of niche storage is expected to remain tight due to pressure from mainstream storage products [7] Summary by Sections Investment Recommendations and Targets - Key investment targets include domestic storage chip design companies such as Zhaoyi Innovation, Puran, Jucheng, Dongxin, Beijing Junzheng, and Hengsuo [2][8] - Domestic storage module manufacturers like Jiangbolong, Demingli, and Baiwei Storage are also highlighted [2] - Companies benefiting from storage technology iterations include Lanke Technology, Lianyun Technology, and Aojie Technology [2] - Semiconductor equipment firms such as Zhongwei Company, Jingzhida, and Beifang Huachuang are recommended [2] - Domestic packaging and testing companies like Shentek, Huicheng, and Tongfu Microelectronics are included [2] - Supporting logic chip manufacturers such as Jinghe Integration are also mentioned [2] Market Dynamics - TrendForce has revised upward the price growth rates for DRAM and NAND Flash products for the first quarter, with DRAM contract prices expected to increase by 90-95% and NAND Flash by 55-60% [7] - AI computing demand is becoming the dominant factor in storage demand, with significant price increases expected for server DRAM and Enterprise SSDs [7] - The AI inference process is anticipated to change data center storage structures, leading to increased demand for active data storage [7] Niche Storage Outlook - Niche storage products like NOR Flash and MLC/SLC NAND Flash are expected to remain in short supply due to reduced production from major suppliers focusing on mainstream products [7] - The global capacity for MLC NAND Flash is projected to decrease by 41.7% in 2026 due to supply constraints [7]

Core Insights - The global High Bandwidth Memory (HBM) market is experiencing rapid growth, with shipments expected to increase from 1.5 billion gigabytes (GB) in 2023 to 5.7 billion GB by 2026, and revenues projected to rise from $4.35 billion in 2023 to $50 billion in 2026 [6][7][8]. HBM Industry Definition and Advantages - HBM is a high-performance semiconductor memory based on 3D stacking technology, offering high bandwidth and energy efficiency, primarily used in high-performance computing and networking applications [1][4]. - HBM has four main advantages over traditional DRAM: high bandwidth, high capacity, low power consumption, and small size [2][3]. HBM Industry Development Status - HBM technology is becoming a standard for AI acceleration cards (GPUs, TPUs, etc.), with its value share continuing to increase [4][6]. - The demand for HBM is driven by the needs of AI and high-performance computing, with significant growth expected in the coming years [6][10]. HBM Industry Chain - The HBM industry chain includes upstream materials (electrolytes, precursors, IC substrates) and semiconductor equipment (lithography machines, etching machines), with midstream focusing on HBM production and downstream applications in AI, data centers, and high-performance computing [8][9]. HBM Industry Competitive Landscape - The global HBM market is dominated by foreign manufacturers, with SK Hynix holding a 53% market share, followed by Samsung at 38% and Micron at 9% [14][15]. - Domestic companies in China, such as Changxin Memory, Changdian Technology, and others, are making significant progress in the HBM supply chain, aiming to increase local production capabilities [15][16]. HBM Industry Development Trends - HBM is positioned as a critical hardware component for AI and high-performance computing, with its unique 3D stacked structure providing superior bandwidth compared to traditional memory solutions [16][17]. - The future memory landscape will be heterogeneous, with HBM focusing on training scenarios, while other memory types will cater to specific workloads, creating a diverse memory ecosystem for the AI era [17].

证券研究报告：电子 | 公司点评报告 股票投资评级 买入 |维持 个股表现 2025-02 2025-04 2025-06 2025-09 2025-11 2026-01 -21% -9% 3% 15% 27% 39% 51% 63% 75% 87% 通富微电 电子 资料来源：聚源，中邮证券研究所 公司基本情况 | 最新收盘价（元） | 52.06 | | --- | --- | | 总股本/流通股本（亿股）15.18 | / 15.17 | | 总市值/流通市值（亿元）790 | / 790 | | 52 周内最高/最低价 | 56.34 / 22.78 | | 资产负债率(%) | 60.1% | | 市盈率 | 115.69 | | 第一大股东 | 南通华达微电子集团股 | | 份有限公司 | | 研究所 分析师:吴文吉 SAC 登记编号:S1340523050004 Email:wuwenji@cnpsec.com 分析师:翟一梦 SAC 登记编号:S1340525040003 Email:zhaiyimeng@cnpsec.com 通富微电(002156) 拟定增加码先进封装 l 投资要点 中高端产 ...

证券研究报告：电子 | 公司点评报告 股票投资评级 买入 |维持 个股表现 2025-02 2025-04 2025-06 2025-09 2025-11 2026-01 -21% -9% 3% 15% 27% 39% 51% 63% 75% 87% 通富微电 电子 资料来源：聚源，中邮证券研究所 公司基本情况 | 最新收盘价（元） | 52.06 | | --- | --- | | 总股本/流通股本（亿股）15.18 | / 15.17 | | 总市值/流通市值（亿元）790 | / 790 | | 52 周内最高/最低价 | 56.34 / 22.78 | | 资产负债率(%) | 60.1% | | 市盈率 | 115.69 | | 第一大股东 | 南通华达微电子集团股 | | 份有限公司 | | 研究所 分析师:吴文吉 SAC 登记编号:S1340523050004 Email:wuwenji@cnpsec.com 分析师:翟一梦 SAC 登记编号:S1340525040003 Email:zhaiyimeng@cnpsec.com 通富微电(002156) 拟定增加码先进封装 l 投资要点 中高端产 ...