证券代码：002916 证券简称：深南电路 公告编号：2024-030 深南电路股份有限公司 关于使用部分闲置募集资金进行现金管理的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 深南电路股份有限公司（以下简称"公司"）第三届董事会第二十次会议和 第三届监事会第十五次会议审议通过了《关于使用部分闲置募集资金进行现金管 理的议案》，同意公司在不影响募集资金投资计划正常进行的情况下，将总额不 超过 10 亿元（含本数）的闲置募集资金购买期限不超过 12 个月（含）的保本型 产品，使用期限自董事会审议通过之日起 24 个月内有效，在上述额度内资金可 滚动使用。独立董事、监事会及保荐机构就该事项已发表同意的意见。 具体公告详见公司于 2022 年 12 月 30 日在《证券时报》和巨潮资讯网 （http://www.cninfo.com.cn）披露的《关于使用部分闲置募集资金进行现金管理 的公告》（公告编号：2022-087）。 一、关于使用部分闲置募集资金进行现金管理的情况 近日，公司全资子公司无锡广芯封装基板有限公司（以下简称"无锡广 芯"）向中国银行股 ...

证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 编号：2024-48 √特定对象调研 □分析师会议 □现场参观 投资者关系 活动类别 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □其他 （ ） 活动参与人 员（排名不 分先后） 博时基金、长城基金、创金合信基金、财通证券、东吴证券 上市公司 接待人员 战略发展部总监、证券事务代表：谢丹；投资者关系经理：郭家旭 时间 2024 年 7 月 26 日 地点 公司会议室 形式 实地调研 投资者关系 活动主要内 容介绍 交流主要内容： Q1、请介绍公司 2024 年上半年业绩预增情况。 2024 年上半年，公司把握行业结构性机会，加大各项业务市场拓展力度，订单同比增 长，产能稼动率保持在良好水平，业务收入实现同比增长，同时由于 AI 的加速演进及应用 深化，叠加通用服务器迭代升级等因素，公司产品结构优化，助益利润同比提升。相关业绩 预告数据为公司财务部初步核算结果，未经审计机构审计，具体财务数据将在公司 2024 年 半年度报告中详细披露。 Q2、请介绍公司目前 PCB 业务产品下游应用分布情况。 公司在 PCB 业务方面 ...

Group 1: Company Performance Overview - In the first half of 2024, the company capitalized on structural opportunities in the industry, resulting in a year-on-year increase in orders and maintaining a good capacity utilization rate [2] - Business revenue achieved a year-on-year growth, supported by the accelerated evolution and deepening application of AI, along with the upgrade of general servers, which optimized the product structure and improved profits [2] Group 2: PCB Business Development - The company focuses on high-end PCB design, research, and manufacturing, with core downstream applications in communication equipment, particularly in data centers (including servers) and automotive electronics [2] - Since Q1 2024, there has been no significant improvement in demand for wireless communication base station products compared to Q4 2023, while demand for wired products like switches and optical modules has increased [3] Group 3: Impact of AI on PCB Business - The acceleration of AI and its deepening application has led to a growing demand for high computing power and high-speed networks in the ICT industry, influencing the demand for PCB products in high-speed communication networks, data center switches, AI accelerator cards, and storage [3] Group 4: Automotive Electronics Expansion - Automotive electronics is a key area for the company's PCB business, targeting both domestic and overseas Tier 1 customers, with a focus on new energy and ADAS, producing high-frequency, HDI, rigid-flex, and thick copper products [3] - The company continues to seize opportunities in the new energy and ADAS PCB sectors, focusing on the development of target customers and the release of project demands [3] Group 5: HDI Process Capabilities - The company possesses HDI process capabilities, including Any Layer interconnection, primarily applied in communication, data centers, industrial control, medical, and automotive electronics sectors [3] Group 6: Packaging Substrate Business - Since Q1 2024, the demand for BT-type products in the packaging substrate business has continued the trend from Q4 2023, with orderly progress in production line validation and sample certification for FC-BGA packaging substrates [3] Group 7: Raw Material Price Stability - From 2023 to Q1 2024, the overall price of major raw materials remained stable, although some prices for precious metals and certain board materials have shown an upward trend, which has not yet significantly impacted the company's operations [4] Group 8: Thailand Project Development - The company is investing 1.274 billion RMB in a factory in Thailand to expand its overseas market and meet international customer demands, with construction work currently underway [4]

证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 编号：2024-46 √特定对象调研 □分析师会议 □现场参观 投资者关系 活动类别 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □其他 （ ） 参与单位名称及 人员姓名（排名 不分先后） 平安养老、招商证券 时间 2024 年 7 月 24 日 地点 深南电路股份有限公司会议室 上市公司接待人 员姓名 副总经理、董事会秘书：张丽君 投资者关系 活动主要内容 介绍 交流主要内容： Q1、请介绍公司 2024 年上半年业绩预增情况。 2024 年上半年，公司把握行业结构性机会，加大各项业务市场拓展力度，订单同比 增长，产能稼动率保持在良好水平，业务收入实现同比增长，同时由于 AI 的加速演进 及应用深化，叠加通用服务器迭代升级等因素，公司产品结构优化，助益利润同比提升。 相关业绩预告数据为公司财务部初步核算结果，未经审计机构审计，具体财务数据将在 公司 2024 年半年度报告中详细披露。 Q2、请介绍公司目前 PCB 业务产品下游应用分布情况。 公司在 PCB 业务方面从事高中端 PCB 产品的设计、研发及制造等相关工 ...

证券代码:002916 证券简称:深南电路 深南电路股份有限公司投资者关系活动记录表 编号:2024-45 √特定对象调研 □分析师会议 □现场参观 投资者关系 活动类别 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □其他 ( ) 参与单位名称及 人员姓名(排名 不分先后) 华夏基金、国金证券、中邮证券 时间 2024 年 7 月 23 日 地点 深南电路股份有限公司会议室 上市公司接待人 员姓名 战略发展部总监、证券事务代表:谢丹;投资者关系经理:郭家旭 投资者关系 活动主要内容 介绍 交流主要内容: Q1、请介绍公司 2024 年上半年业绩预增情况。 2024 年上半年,公司把握行业结构性机会,加大各项业务市场拓展力度,订单同比 增长,产能稼动率保持在良好水平,业务收入实现同比增长,同时由于 AI 的加速演进 及应用深化,叠加通用服务器迭代升级等因素,公司产品结构优化,助益利润同比提升。 相关业绩预告数据为公司财务部初步核算结果,未经审计机构审计,具体财务数据将在 公司 2024 年半年度报告中详细披露。 Q2、请介绍公司目前 PCB 业务产品下游应用分布情况。 公司在 PCB 业务方面从事高中端 ...

证券代码:002916 证券简称:深南电路 深南电路股份有限公司投资者关系活动记录表 编号:2024-44 √特定对象调研 □分析师会议 □现场参观 投资者关系 活动类别 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □其他 ( ) 参与单位名称及 人员姓名(排名 不分先后) 国泰基金、易方达基金、新华资产、创金合信基金、鹏华基金、广发基金、浦银安盛 基金、景顺长城基金、长盛基金、建信基金、香港浩成资产、招商证券 时间 2024 年 7 月 18 日 地点 深南电路股份有限公司会议室 上市公司接待人 员姓名 副总经理、董事会秘书:张丽君;投资者关系经理:郭家旭 投资者关系 活动主要内容 介绍 交流主要内容: Q1、请介绍公司 2024 年上半年业绩预增情况。 2024 年上半年,公司把握行业结构性机会,加大各项业务市场拓展力度,订单同 比增长,产能稼动率保持在良好水平,业务收入实现同比增长,同时由于 AI 的加速演 进及应用深化,叠加通用服务器迭代升级等因素,公司产品结构优化,助益利润同比提 升。相关业绩预告数据为公司财务部初步核算结果,未经审计机构审计,具体财务数据 将在公司 2024 年半年度报告中 ...

Group 1: Company Performance - The company anticipates a significant increase in performance for the first half of 2024, driven by a high capacity utilization rate and a year-on-year revenue growth due to the acceleration of AI applications and server upgrades [2] - The preliminary financial data indicates that profit margins have improved due to optimized product structure [2] Group 2: Business Segments - The PCB business focuses on high-end product design, development, and manufacturing, primarily serving communication equipment, data centers, automotive electronics, and industrial control sectors [2] - In the automotive electronics sector, the company targets both domestic and overseas Tier 1 customers, emphasizing new energy and ADAS applications [3] - The demand for PCB products in the automotive electronics field has been maintained, with a focus on high-frequency and HDI products [3] Group 3: Market Trends and Impact - The demand for high-performance and high-speed network products is increasing due to the rapid evolution of AI and its applications, impacting the company's PCB business positively [3] - The company is adapting to the growing needs for edge computing and high-speed data transmission in various terminal applications [3] Group 4: Manufacturing and Production - The PCB factory's utilization rate has increased compared to Q1 2024, while the packaging substrate factory's utilization remains stable [4] - The company has made progress in the production capabilities of FC-BGA packaging substrates, with mass production capabilities for 14-layer and below products [3] Group 5: Raw Material Costs - The prices of key raw materials have remained stable from 2023 to Q1 2024, although there has been a recent increase in prices for some auxiliary materials due to fluctuations in commodity prices [4] - The company is closely monitoring international commodity price changes and maintaining communication with suppliers and customers [4]

Group 1: Financial Performance - The company expects a net profit attributable to shareholders of 910 million to 1 billion CNY for the first half of 2024, representing a year-on-year growth of 92.01% to 111.00% [2] - The anticipated net profit excluding non-recurring gains and losses is projected to be between 820 million and 910 million CNY, with a year-on-year increase of 92.64% to 113.78% [2] Group 2: Business Expansion and Market Focus - The company is focusing on high-end PCB products, primarily in communication equipment, data centers, automotive electronics, and industrial control sectors [2][3] - In the automotive electronics sector, the company targets both domestic and overseas Tier 1 customers, emphasizing new energy and ADAS applications [3] Group 3: Impact of AI and Technology Development - The acceleration of AI development is driving demand for high-performance and high-speed network PCB products, particularly in edge computing and data transmission [3] - The company has made significant advancements in packaging substrate technology, maintaining a leading position in the domestic market for BT-type packaging substrates [4] Group 4: Production Capacity and Operational Efficiency - The PCB factory's operating rate has increased compared to the first quarter of 2024, while the packaging substrate factory's operating rate remains stable [4] - The company has achieved mass production capabilities for products with 14 layers and above, while continuing to face technical challenges in high-end product development [4] Group 5: Electronic Assembly Business Strategy - The electronic assembly business is positioned as a downstream segment of PCB manufacturing, focusing on communication, data centers, and automotive electronics [4] - The company employs two sales models, Turnkey and Consign, to meet customer needs, with Turnkey involving self-managed procurement and production [4]

证券代码:002916 证券简称:深南电路 深南电路股份有限公司投资者关系活动记录表 编号:2024-41 √特定对象调研 □分析师会议 □现场参观 投资者关系 活动类别 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □其他 ( ) 参与单位名称及 人员姓名(排名 不分先后) 中泰证券、中信建投证券、广发证券、东北证券、财通证券、中银国际证券、国金证 券、方正证券、中金公司、华西证券、华金证券 时间 2024 年 7 月 12 日 地点 电话及网络会议 上市公司接待人 员姓名 战略发展部总监、证券事务代表:谢丹;投资者关系经理:郭家旭 投资者关系 活动主要内容 介绍 交流主要内容: Q1、请介绍公司 2024 年上半年业绩预增情况。 2024 年上半年,公司把握行业结构性机会,加大各项业务市场拓展力度,订单同比 增长,产能稼动率保持在良好水平,业务收入实现同比增长,同时由于 AI 的加速演进 及应用深化,叠加通用服务器迭代升级等因素,公司产品结构优化,助益利润同比提升。 公司预计 2024 年上半年实现归母净利润 9.1 亿元-10 亿元,预计同比增长 92.01%- 111.00%;预计实现扣非净利润 ...

Group 1: Financial Performance - The company expects to achieve a net profit attributable to shareholders of 910 million to 1 billion CNY in the first half of 2024, representing a year-on-year growth of 92.01% to 111.00% [2] - The expected net profit after deducting non-recurring gains and losses is 820 million to 910 million CNY, with a year-on-year growth of 92.64% to 113.78% [2] - These performance forecasts are preliminary calculations by the finance department and have not been audited [2] Group 2: Business Development - The company is focusing on high-end PCB products, primarily in communication equipment, data centers, automotive electronics, and industrial control sectors [2][3] - In the automotive electronics sector, the company targets both domestic and overseas Tier 1 customers, emphasizing new energy and ADAS applications [3] - The PCB business has seen an increase in demand for wired communication products, such as switches and optical modules, since Q1 2024 [3] Group 3: Technological Advancements - The company has achieved leading capabilities in the production of FC-CSP packaging substrates and has successfully introduced RF packaging substrate products for high-end applications [4] - The company is the largest domestic supplier of packaging substrates, covering all BT packaging forms, and has batch production capabilities for products with 14 layers or fewer [4] Group 4: Operational Efficiency - The PCB factory's operating rate has increased compared to Q1 2024, while the packaging substrate factory's operating rate remains stable [4] - The company arranges production based on the process requirements of different PCB products, allowing for some compatibility across various downstream fields [3] Group 5: Market Conditions - The prices of raw materials, including copper-clad laminates and copper foil, have remained stable from 2023 to Q1 2024, with some increases in precious metals and certain board materials [4] - The company is closely monitoring international commodity price changes and maintaining active communication with suppliers and customers [4]