Core Viewpoint - The company expects a significant increase in annual performance for 2025, with net profit attributable to shareholders projected to be between 3.15 billion to 3.34 billion, representing a year-on-year growth of 68.0% to 78.0% [1] Group 1: Financial Performance - For Q4, the company anticipates a net profit of 920 million, reflecting a year-on-year increase of 136.2% but a quarter-on-quarter decline of 4.5% [1] - The full-year performance is driven by the company's ability to capitalize on three major growth opportunities: AI computing power upgrades, increased storage market demand, and the electrification and intelligence of automobiles [1] - The company has enhanced its operational management capabilities through digital transformation and smart manufacturing upgrades, contributing to revenue and profit growth [1] Group 2: Business Trends - The demand for overseas AI computing power is robust, and the new production capacity is expected to quickly reach breakeven, contributing to flexible profits [2] - Domestic computing power is projected to experience significant growth in 2026, with the company positioned as a key player in the domestic PCB supply chain [2] - The high demand for substrate boards is leading to continuous price increases, with full capacity utilization and significant profit improvements [2] - The company is well-positioned in the future AI PCB technology upgrade path, with strong technical capabilities and production experience [2] Group 3: Future Outlook - The company is expanding its AI computing capacity, with new production facilities in Nantong, Thailand, and Wuxi expected to gradually come online between 2026 and 2027, opening up long-term growth potential [3]

Group 1 - The company, Shenzhen Sannuo Circuit (002916.SZ), has indicated in investor relations that it is planning to utilize a new land plot in Wuxi for PCB business-related products [1] - The land is designated for the storage of products related to the computing power of PCB business, with investments expected to be phased [1] - Specific investment amounts will be determined based on business development and market conditions [1]

Group 1 - The company aims to capitalize on three growth opportunities by 2025: AI computing power upgrades, increasing demand in the storage market, and the electrification and intelligence of automobiles [1] - The company plans to enhance market development efforts and improve market competitiveness to optimize product structure [1] - The company is committed to advancing digital transformation and smart manufacturing upgrades to enhance operational management capabilities, which will contribute to revenue and profit growth [1] Group 2 - The company expects to achieve a net profit attributable to shareholders of 3.15 billion to 3.34 billion yuan by 2025, representing a year-on-year growth of 68% to 78% [1]

证券代码：002916 证券简称：深南电路 深南电路股份有限公司投资者关系活动记录表 编号：2026-02 投资者关系 活动类别 √特定对象调研 □分析师会议 □现场参观 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 □其他 （ ） 活动参与人 员（排名不 分先后） 国金证券、中国人寿资管 上市公司 接待人员 战略发展部总监、证券事务代表：谢丹；证券事务主管：阳佩琴 时间 2026 年 2 月 4 日 地点 公司会议室 形式 实地调研 投资者关系 活动主要内 容介绍 交流主要内容： Q1、请介绍公司 2025 年业绩预增情况。 2025 年，公司把握 AI 算力升级、存储市场需求增长、汽车电动智能化三大增长机 遇，通过强化市场开发力度、提升市场竞争力，推动产品结构优化。同时，深入推进数字 化转型与智能制造升级，提升运营管理能力，助益公司营收规模和利润实现同比增长。 2025 年，公司预计实现归母净利润 31.5 亿元~33.4 亿元，预计同比增长 68%~78%；预 计实现扣非净利润 29.9 亿元~31.7 亿元，预计同比增长 72%~82%。（2025 年度业绩预告数 据仅为公司财务部初步核算的结果 ...

招商证券研报指出，深南电路发布25年业绩预增：归母净利31.5-33.4亿同比+68.0%～78.0%，扣非归母 净利29.9-31.7亿同比+72.0%～82.0%。Q4环降源于新产能爬坡、费用增加，静待H1业绩环比高增。全 年来看，公司充分把握AI算力升级、存储市场需求增长、汽车电动智能化三大增长机遇，通过强化市 场开发力度、提升市场竞争力，推动产品结构优化。同时，深入推进数字化转型与智能制造升级，提升 运营管理能力，助益公司营收规模和利润实现同比增长。看好公司在算力板及载板领域的产品技术及在 海外算力客户的积极拓展、卡位国内算力供应链体系主力角色，且积极扩充AI算力产能，南通四期、 泰国基地以及无锡新产能规划有望在26-27年逐步投产释放，打开中长线成长空间，维持"强烈推荐"投 资评级。 ...

事件：公司公告 25 年业绩预增：归母净利 31.5-33.4 亿同比+68.0%～78.0%， 扣非归母净利 29.9-31.7 亿同比+72.0%～82.0%。结合行业和公司近况，我们 点评如下： ❑ 风险提示：同行竞争加剧、算力客户开拓及订单导入不及预期，产能扩张不 及预期。 财务数据与估值 证券研究报告 | 公司点评报告 2026 年 02 月 04 日 深南电路（002916.SZ） Q4 环降源于新产能爬坡、费用增加，静待 H1 业绩环比高增 TMT 及中小盘/电子 | 会计年度 | 2023 | 2024 | 2025E | 2026E | 2027E | | --- | --- | --- | --- | --- | --- | | 营业总收入(百万元) | 13526 | 17907 | 23817 | 32153 | 43406 | | 同比增长 | -3% | 32% | 33% | 35% | 35% | | 营业利润(百万元) | 1398 | 2028 | 3530 | 6114 | 8921 | | 同比增长 | -19% | 45% | 74% | 73% | 46% | | ...

Group 1 - Northern Huachuang is a leading domestic semiconductor equipment manufacturer, covering core process equipment such as etching machines, thin film deposition equipment, and cleaning machines, which are essential for memory chip manufacturing [1] - The company is expected to benefit from the growth in equipment orders driven by the expansion and technological upgrades of domestic memory manufacturers during the memory chip price increase cycle [1] - Northern Huachuang has made breakthroughs in advanced process equipment for 3D NAND and HBM, establishing a core competitive advantage in the global memory equipment market [1] Group 2 - Hua Hong Semiconductor is a leading domestic specialty process manufacturer with mature memory chip foundry capabilities, focusing on NOR Flash, eMMC, and SPI NAND [2] - The company is expected to benefit from the rising demand for memory chip foundry services as domestic memory manufacturers expand production [2] - Hua Hong's layout in automotive-grade memory chip foundry will further enhance its resilience against economic cycles [2] Group 3 - Zhongwei Company is a core supplier of etching equipment, with its 5nm etching machine already integrated into the supply chain of memory manufacturers [3] - The demand for high-end equipment is expected to grow due to the trend of upgrading memory chips to advanced processes like 3D NAND and HBM [3] - Zhongwei's layout in thin film deposition equipment enhances its service capabilities for memory manufacturers [3] Group 4 - Lanke Technology is a global leader in memory interface chips, with its products widely used in servers and PCs, holding a leading share in the DDR5 interface chip market [4] - The demand for DDR5 interface chips is expected to surge due to the explosion in AI server and high-end PC demand during the memory chip price increase cycle [4] - Lanke's breakthroughs in HBM interface chips will further open up growth opportunities [4] Group 5 - GigaDevice is a leading domestic memory chip design company, focusing on NOR Flash while also expanding into NAND Flash and DRAM [5] - The company is expected to benefit from the price increase of NOR Flash products driven by the recovery of consumer electronics and AI terminal demand [5] - GigaDevice's layout in automotive-grade memory chips will further expand its downstream application space [5] Group 6 - Shengyi Technology is a leading domestic copper-clad laminate manufacturer, with its products being core raw materials for memory chip packaging [6][7] - The growth in demand for copper-clad laminates is expected to be driven by the expansion of memory manufacturers and the increase in packaging needs during the memory chip price increase cycle [6][7] - Shengyi's breakthroughs in high-frequency and high-speed copper-clad laminates will adapt to the upgrade demands of memory chips [6][7] Group 7 - Shenzhen South Circuit is a leading domestic PCB manufacturer, with its high-end PCB products being core carriers for storage servers and modules [8] - The demand for high-end PCBs is expected to grow due to the explosion in AI server demand and the expansion of memory manufacturers during the memory chip price increase cycle [8] - Shenzhen South Circuit's layout in storage packaging substrates further enhances its position in the memory industry chain [8] Group 8 - Jiangbolong is a leading domestic storage module manufacturer, focusing on the development and manufacturing of storage modules for various applications [9] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [9] - Jiangbolong's layout in automotive-grade storage modules will further open up downstream application spaces [9] Group 9 - Xi'an Yicai is a core enterprise in semiconductor materials, focusing on silicon-based materials essential for memory chip manufacturing [10] - The demand for silicon-based materials is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [10] - Xi'an Yicai's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [10] Group 10 - Tuojing Technology is a leading domestic thin film deposition equipment manufacturer, with its PECVD and ALD equipment being core process equipment for memory chip manufacturing [11] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of 3D NAND technology during the memory chip price increase cycle [11] - Tuojing's layout in HBM-related equipment will further adapt to the upgrade demands driven by AI [11] Group 11 - Maiwei Co. is a core domestic semiconductor equipment enterprise, with its equipment already integrated into the supply chain of leading domestic memory manufacturers [12] - The growth in equipment orders is expected to be driven by the expansion of memory manufacturers and the increase in advanced packaging demand during the memory chip price increase cycle [12] - Maiwei's breakthroughs in HBM packaging equipment will adapt to the upgrade demands driven by AI [12] Group 12 - Shengmei Shanghai is a leading domestic semiconductor cleaning equipment manufacturer, with its single-wafer cleaning equipment integrated into the supply chain of leading memory manufacturers [13] - The demand for cleaning equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [13] - Shengmei's breakthroughs in 3D NAND cleaning technology will adapt to the technical iteration needs of memory chips [13] Group 13 - Changdian Technology is a leading domestic packaging and testing enterprise, covering the packaging and testing of various memory chip types [14] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [14] - Changdian's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [14] Group 14 - Changchuan Technology is a leading domestic semiconductor testing equipment manufacturer, with its testing equipment covering memory and logic chips [15] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [15] - Changchuan's breakthroughs in DDR5 and HBM testing technologies will adapt to the upgrade demands driven by AI [15] Group 15 - Baiwei Storage is a leading domestic storage chip design and module manufacturer, focusing on various storage modules for different applications [16] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [16] - Baiwei's layout in automotive-grade storage will further open up downstream application spaces [16] Group 16 - China Resources Microelectronics is a leading domestic power semiconductor and storage chip manufacturer, focusing on NOR Flash and eMMC [17] - The company is expected to benefit from the recovery in consumer electronics and industrial control demand during the memory chip price increase cycle [17] - China Resources' layout in automotive-grade storage chips will enhance its resilience against economic cycles [17] Group 17 - Tongfu Microelectronics is a core domestic packaging enterprise, covering the packaging of various memory chip types [18] - The growth in packaging orders is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [18] - Tongfu's breakthroughs in advanced packaging will adapt to the needs of high-end memory chips [18] Group 18 - Yitang Co. is a core domestic semiconductor equipment enterprise, focusing on thin film deposition and rapid thermal processing equipment [19] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [19] - Yitang's breakthroughs in 3D NAND-related equipment will adapt to the technical iteration needs of memory chips [19] Group 19 - Jingsheng Mechanical and Electrical is a leading domestic semiconductor silicon wafer equipment manufacturer, with its equipment integrated into the supply chain of leading memory manufacturers [20] - The demand for equipment orders is expected to grow due to the expansion of memory manufacturers and the increase in silicon wafer demand during the memory chip price increase cycle [20] - Jingsheng's breakthroughs in 300mm large silicon wafer equipment will adapt to the advanced process needs of domestic storage [20] Group 20 - Xichuang Data is a leading domestic storage module and smart terminal manufacturer, focusing on various storage modules for different applications [21] - The company is expected to benefit from the recovery in consumer electronics and the explosion of AI terminal demand during the memory chip price increase cycle [21] - Xichuang's layout in automotive-grade storage will further open up downstream application spaces [21] Group 21 - Shannon Chip is a leading domestic storage chip distribution and solution provider, focusing on distribution and technical services for storage chips [22] - The growth in distribution revenue is expected to be driven by the price increase of memory chips during the memory chip price increase cycle [22] - Shannon's layout in storage module solutions will enhance customer stickiness [22] Group 22 - Hushi Silicon Industry is a leading domestic semiconductor silicon wafer manufacturer, covering various specifications essential for memory chip manufacturing [23] - The demand for silicon wafers is expected to grow due to the expansion and technological upgrades of memory manufacturers during the memory chip price increase cycle [23] - Hushi's breakthroughs in 300mm large silicon wafers will adapt to the advanced process needs of domestic storage [23] Group 23 - Unisoc is a leading domestic security chip and storage chip manufacturer, focusing on eMMC and UFS [24] - The company is expected to benefit from the recovery in consumer electronics and the growth in security storage demand during the memory chip price increase cycle [24] - Unisoc's layout in automotive-grade storage chips will enhance its resilience against economic cycles [24] Group 24 - Fudan Microelectronics is a leading domestic FPGA and storage chip manufacturer, covering various storage chip types [25] - The growth in demand for storage products is expected to be driven by the increase in industrial control demand and the acceleration of domestic substitution during the memory chip price increase cycle [25] - Fudan's layout in automotive-grade storage chips will further open up downstream application spaces [25] Group 25 - Zhongke Feicai is a leading domestic semiconductor testing equipment manufacturer, covering testing equipment for memory and logic chips [26] - The demand for testing equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [26] - Zhongke's breakthroughs in 3D NAND testing technology will adapt to the technical iteration needs of memory chips [26] Group 26 - Huahai Qingke is a leading domestic chemical mechanical polishing (CMP) equipment manufacturer, with its CMP equipment integrated into the supply chain of leading memory manufacturers [27] - The demand for CMP equipment is expected to grow due to the expansion of memory manufacturers and the upgrade of advanced processes during the memory chip price increase cycle [27] - Huahai's breakthroughs in 3D NAND polishing technology will adapt to the technical iteration needs of memory chips [27]

Group 1 - The company, ShenNan Circuit (002916.SZ), has three main business segments: printed circuit boards, electronic assembly, and packaging substrates, with applications in various fields including communication, data centers, industrial control medical, and automotive electronics [1] - The company does not engage in the production of the mentioned substrate materials [1] Group 2 - An investor inquired whether the company's products can support 800G and 1.6T connection adjustments and if the company possesses the manufacturing process or product capabilities for M9 level substrates [3]

格隆汇1月30日丨深南电路(002916.SZ)近日接受特定对象调研时表示，公司已具备 20 层及以下 FC-BGA 封装基板产品批量生产能力，22~26 层产品的技术研发及打样工作按期推进中。公司广州封装基板项目 一期已于 2023 年第四季度连线，产品线能力持续提升，产能爬坡稳步推进，已承接 BT 类及部分 FC- BGA 产品的批量订单。2025 年三季度广州广芯亏损环比有所收窄。 ...

Group 1 - The company, Shenzhen South Circuit (002916.SZ), reported that its overall capacity utilization rate remains relatively high [1] - The PCB business is expected to maintain a high capacity utilization rate through the third quarter of 2025 [1] - The packaging substrate business has seen a significant increase in capacity utilization due to rising demand in the storage market, with this trend expected to continue into the fourth quarter of 2025 [1]