Summary of Shengyi Technology Conference Call Company Overview - **Company**: Shengyi Technology (600183.SS) - **Industry**: Copper Clad Laminate (CCL) manufacturing - **Headquarters**: Dongguan, China - **Key Markets**: Consumer electronics, communication, automotive, and data center markets - **Revenue Breakdown**: CCL business accounted for 68% of total revenues in 1H25, followed by PCB business at 29% [3][4] Key Points Discussed 1. 2026 Outlook - **CCL Pricing**: The company raised CCL pricing in October due to higher raw material costs and supply constraints - **Demand Forecast**: Management is optimistic about rising CCL demand from data center clients in 2026, despite pressures from ongoing raw material price increases - **Market Stability**: Demand from consumer electronics and automotive markets has remained stable, with expected growth from AI/data center sectors supported by high-end CCL capacity expansion [4][4] 2. CCL Capacity Expansion - **Expansion Plans**: Shengyi Technology is actively expanding its CCL capacity, with new production expected to start in Thailand from 1Q26 - **Construction Progress**: The company's 'construction in progress' reached Rmb1.9 billion by the end of 3Q25, up from Rmb470 million at the end of 3Q24 - **Timeline**: Capacity expansion typically takes 14 to 16 months, with Phase I requiring more time due to infrastructure development [8][8] 3. Raw Material Supply - **Price Increases**: Management highlighted recent price hikes in raw materials, particularly fiberglass cloth, which has seen tight supply affecting both thin and thick cloth - **Cost Pressures**: The rising costs and uncertainties in raw material supply could impact profitability, as Shengyi focuses on CCL products and relies on third-party suppliers [9][9] 4. Expanding Data Center Business - **Market Diversification**: Shengyi has diversified its end markets, expecting increased contributions from AI/computing products that offer higher margins - **Client Engagement**: The company is working with both local and global-tier clients on server and switch products, focusing on the verification of new generation products [10][10] 5. AI PCB Market Insights - **Positive Market Sentiment**: Comments from Shengyi management regarding strong CCL demand from the AI/data center market align with a positive outlook for the AI PCB market growth - **Competitor Insights**: Shennan Circuits (002916.SZ) is also targeting computer/networking applications, indicating a broader industry trend towards AI-related products [2][2] Additional Insights - **Investment in HDI**: Shengyi Electronics, a subsidiary, announced a private placement plan to invest Rmb2.6 billion in HDI for AI computing applications, indicating a strategic focus on high-demand technology sectors [8][8] This summary encapsulates the key discussions and insights from the conference call regarding Shengyi Technology's current position and future outlook in the CCL and data center markets.

Investment Rating - The report maintains an "Outperform" rating for the PCB industry [2]. Core Insights - The industry is entering a new AI-driven cycle, fundamentally changing demand structures. The construction of AI server clusters is leading to simultaneous upgrades in PCB demand and pricing. The expected market for wired communication PCBs will reach 206.9 billion RMB by 2027, with a CAGR of 20% over the next two years [4]. - High-end PCBs are expected to remain in tight supply until 2027, with major global manufacturers expanding production aggressively. The combined output of 13 leading PCB manufacturers is projected to reach 186 billion RMB by 2027, with a CAGR of 54% from 2025 to 2027 [4]. - The trend towards high-end PCB manufacturing is accelerating due to technological iterations and material upgrades. The industry is expected to see a three-pronged evolution in materials, processes, and architectures driven by AI [4]. - The demand surge and profit improvement in upstream materials present opportunities for domestic substitution. The price of copper-clad laminates has risen significantly, and domestic manufacturers are making notable progress in high-end materials [4]. - The PCB industry is experiencing a long-term trend of simultaneous growth in volume, price, and structure, driven by AI. The report recommends focusing on leading companies with high-end manufacturing capabilities and overseas delivery layouts [4]. Summary by Sections AI-Driven Growth - The AI cycle is expected to drive significant growth in PCB demand, particularly in AI servers, high-speed switches, and optical modules. The total market for wired communication PCBs is projected to reach 1,433 billion RMB by 2025 and 1,815 billion RMB by 2026 [19]. Production Capacity Expansion - Major PCB manufacturers are announcing aggressive expansion plans, with significant investments in new production facilities in Southeast Asia and domestic high-end capacity [15]. Technological Advancements - The report highlights the rapid adoption of mSAP technology in AI servers and switches, which is essential for meeting the demands of high-density signal transmission [4][21]. Market Dynamics - The report notes that the global PCB market is expected to face a supply-demand gap of nearly 20 billion RMB by 2026, although this gap is anticipated to narrow by 2027 [19]. Key Players - The report identifies leading companies such as Huada Technology, Jingwang Electronics, and Shenghong Technology as key players to watch in the PCB industry due to their high-end manufacturing capabilities and strategic expansion plans [4].

Financial Performance - In Q3 2025, the company achieved a revenue of 6.301 billion CNY, representing a year-on-year growth of 33.25% [1] - The net profit attributable to shareholders reached 0.9287 billion CNY, with a year-on-year increase of 9.66% [1] - The non-recurring net profit totaled 0.916 billion CNY, reflecting a year-on-year growth of 94.16% [1] Gross Margin Improvement - The overall gross margin showed improvement in Q3 2025, driven by increased demand for storage packaging substrates and enhanced capacity utilization [2] - Revenue from PCB data centers and wired communication businesses continued to grow, contributing to a slight increase in gross margin [2] Business Expansion - The PCB business focuses on communication equipment, with key expansions in data centers (including servers) and automotive electronics [3] - The packaging substrate business includes a wide range of products, with significant growth in storage packaging substrates in Q3 2025 [4] Capacity Utilization - The overall capacity utilization remained high in Q3 2025, with a notable increase in packaging substrate business due to rising demand in the storage market [5] Production Capacity Development - The company has factories in Shenzhen, Wuxi, Nantong, and Thailand, with new capacity coming from both new factories and upgrades to existing ones [6] Raw Material Price Changes - Key raw materials include copper-clad laminates, semi-cured sheets, copper foil, gold salt, and ink, with some prices increasing in Q3 2025 due to commodity price fluctuations [7]

Core Viewpoint - The Chinese equity market is expected to perform well due to multiple supporting factors, with a tactical overweight view on A/H shares maintained by Guotai Junan Securities [1] Group 1: Market Performance - On November 25, 2025, the three major A-share indices opened higher, with the CSI A500 index rising by 1.10% [1] - Key stocks such as Huadian Co., Ltd. and Shenzhen South Circuit rose significantly, with Huadian hitting the daily limit and others like Shenghong Technology and Fuhua also seeing substantial gains [1] Group 2: Investment Outlook - Guotai Junan Securities highlights that the recent volatility and panic selling have released micro trading risks, creating a favorable environment for the market to establish new expectations as the 14th Five-Year Plan begins [1] - The firm believes that the regulatory authorities are determined to stabilize the capital market, and factors that previously caused valuation discounts have dissipated, indicating a potential upward trend in valuations [1] Group 3: Index Composition - As of October 31, 2025, the top ten weighted stocks in the CSI A500 index include major companies like CATL, Kweichow Moutai, and China Ping An, accounting for a total of 19.36% of the index [1] Group 4: Investment Products - Investors without stock accounts can access the A500 ETF through the A500 ETF Jiashi linked fund, allowing for a one-click investment in the top 500 A-share companies [2]

PCB概念震荡反弹，沪电股份涨停，生益电子、深南电路、胜宏科技等涨幅靠前。 炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 11月25日，A股三大指数集体高开。截至发稿，沪指涨0.61%，深证成指涨超1%，创业板指涨超2%。 | 上证指数 | 深证成指 | 创业板指 | | --- | --- | --- | | 3860.12 | 12774.40 | 2993.12 | | 23.35 0.61% | 189.32 1.50% | 64.08 2.19% | CPO概念拉升，德科立、瑞斯康达、可川科技、长飞光纤等涨停，长芯博创、光库科技等涨超10%。 | < V | CPO概念 | | | 2 O | | --- | --- | --- | --- | --- | | | 4323.41 | 5.29% | | | | 分时 五日 | 日K | 周K | 目K | 更多,◎ | | 成份股 | 股吧 | | | 资讯 | | 名称 | 最新 | 涨幅 ↓ | | 涨跌 | | 德科立 | 142.56 | 20.00% | | 23.76 | | 688205 科创 融 | | ...

Core Insights - The electronic sector has significantly outperformed the market since 2025, driven by substantial capital expenditures and demand for computing power from major companies like Google, Meta, Microsoft, and Amazon, which collectively spent nearly $100 billion in Q3 2025, a year-on-year increase of approximately 70% [1] - The demand for high-end PCBs (Printed Circuit Boards) has surged due to the explosion of computing power, particularly for AI servers, which require advanced PCB designs [1] - The global PCB market is projected to approach $95 billion by 2029, with the specialized PCB market for AI and high-performance computing expected to grow at a compound annual growth rate (CAGR) exceeding 20% from 2024 to 2029 [1] Semiconductor Sector - In Q3 2025, top performers in the semiconductor sector included companies like Silan Micro with a 1109% year-on-year growth and Geke Micro with 519% [2] - The strong performance of Nvidia and Google's AI advancements indicate that the AI industry is in an accelerating growth phase, presenting opportunities in the PCB sector as it aligns with AI chip upgrades [2] PCB Sector - Companies in the PCB sector, such as Shenghong Technology and Shennan Circuit, reported significant revenue and net profit growth, reflecting the rapid increase in orders for AI servers and related equipment [1][2] - The PCB market is experiencing a transformation driven by AI, which is reshaping the value chain of the electronic industry and creating new growth opportunities [2] Market Activity - On November 24, 2025, the PCB sector saw active trading, with stocks like Pengding Holdings and Huadian Shares rising over 1%, indicating positive market sentiment [3] - The electronic ETF (515260), which focuses on core leaders in the electronic sector, has attracted significant investment, with a total of 11.2 million yuan in inflows over three days, reflecting investor confidence in the sector's future performance [3] Investment Tools - The electronic ETF (515260) and its linked funds are designed to track the electronic 50 index, focusing on semiconductor and consumer electronics sectors, including high-demand areas like AI chips and 5G [5][6] - The ETF's composition heavily features the Apple supply chain, which accounts for 44.63% of its holdings, benefiting from the anticipated strong performance of Apple's product line [6] - Government policies are supporting the semiconductor industry, aiming for self-sufficiency and leveraging AI to enhance consumer electronics, positioning the electronic sector for potential growth [6]

Summary of Shennan Circuits (002916.SZ) Conference Call Company Overview - **Company**: Shennan Circuits (002916.SZ) - **Market Cap**: Rmb102.6 billion / $14.4 billion - **Target Price**: Rmb254.00, raised by approximately 70% from previous estimates - **Current Price**: Rmb199.96 - **Upside Potential**: 27.0% [1][30] Key Industry Insights - **Industry Focus**: Transition from telecom PCB to AI PCB, targeting compute and networking demands, particularly in the context of the growing market for 800G and 1.6T optical transceivers [1][22] - **Growth Drivers**: - Expansion of high-end PCB capacity in Jiangsu and Thailand factories [1][23] - Increased demand for AI PCB from AI accelerators, optical transceivers, and switches [1][22] - Strong growth in IC substrate business driven by memory chips [1][24] Financial Performance and Projections - **Earnings Growth**: Expected net income growth of 44% CAGR from 2025 to 2027 [1] - **Revenue Estimates**: - 2025: Rmb22,775 million (up 7% from previous estimates) - 2026: Rmb28,491 million (up 15%) - 2027: Rmb35,503 million (up 29%) [1][27] - **Gross Margin Improvement**: Anticipated increase in gross margin by 2.6ppts, 2.7ppts, and 3.4ppts for 2025, 2026, and 2027 respectively [1][26] Competitive Positioning - **Market Position**: Shennan has established long-term partnerships in the telecom sector, which aids its entry into the data center PCB market [4] - **Competitive Risks**: Potential competition from peers with higher exposure to AI and data centers, which could impact pricing and margins [4][37] Capacity and Production - **Capacity Expansion**: Significant ramp-up in production capacity expected from the Jiangsu Nantong factory and Thailand factory in 2026 [19][23] - **Product Mix Upgrade**: Transition towards high-layer count PCBs and optical transceivers, with a projected increase in AI PCB revenue contribution to 28%, 36%, and 41% of total PCB revenues from 2025 to 2027 [22] Investment Thesis - **Recommendation**: Maintain Buy rating based on strong growth prospects in AI PCB and IC substrate markets, supported by capacity expansion and product upgrades [1][30] - **Risks**: Slower-than-expected expansion into AI PCB, increased competition, customer concentration risks, and slower growth in server/automotive PCB and IC substrate markets [37] Conclusion - Shennan Circuits is positioned to benefit from the growing demand for AI PCBs and high-end IC substrates, with significant revenue and earnings growth projected over the next few years. The company's strategic expansion and product upgrades are expected to enhance its competitive edge in the evolving technology landscape.

Core Viewpoint - ShenNan Circuit (002916) announced that as of now, the company and its subsidiaries do not provide guarantees to entities outside the consolidated financial statements, and there are no overdue guarantees, litigation-related guarantees, or losses due to guarantee judgments [1] Summary by Categories - **Company Guarantees** - The company and its subsidiaries have no guarantees provided to entities outside the consolidated financial statements [1] - There are no overdue guarantees reported [1] - **Legal and Financial Status** - The company is not involved in any litigation related to guarantees [1] - There are no losses incurred from guarantee judgments against the company [1]

Core Viewpoint - The company, Xingsen Technology, has confirmed its position in the FCBGA packaging substrate market, highlighting the competitive landscape among domestic manufacturers [1] Group 1: Company Insights - Xingsen Technology is one of the domestic manufacturers capable of mass production of FCBGA packaging substrates [1] - Other companies with similar capabilities include Shenzhen South Circuit, Zhuhai Yuya, and Anjieli Meiwai, each with varying production capacities, technical capabilities, and mass production progress [1]

证券代码：002916 证券简称：深南电路 公告编号：2025-036 关于对外担保的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、担保情况概述 深南电路股份有限公司（以下简称"公司"）于 2025 年 8 月 26 日召开第四 届董事会第八次会议，审议通过了《关于为子公司提供担保的议案》，同意公司 为全资子公司泰兴电路有限公司（以下简称"泰兴电路"）向银行申请授信贷款 提供不超过 20,000 万元的担保，该担保事项发生的有效期限为自第四届董事会 第八次会议审议通过之日起一年内有效。具体公告详见披露于《证券时报》和巨 潮资讯网（http://www.cninfo.com.cn）的《关于为子公司提供担保的公告》（公告 编号：2025-029）。本次担保前，公司为泰兴电路提供的担保余额为 6.30 亿元， 本次担保后，公司对泰兴电路的担保金额为 8.30 亿元，剩余可用担保额度为 0 亿元。 二、担保进展情况 泰兴电路因生产建设需要，向中国进出口银行深圳分行（以下简称"进出口 银行"）申请贷款合计不超过 2 亿元人民币，有效期自 2025 年 1 ...