Core Viewpoint - Deep South Circuit (002916.SZ) reported that the overall capacity utilization rate of its PCB business remains high in Q3 2025, while the packaging substrate business has seen a significant month-on-month increase in capacity utilization due to rising demand in the storage market and application processor chip products [1] Group 1 - The PCB business is maintaining a high overall capacity utilization rate as of Q3 2025 [1] - The packaging substrate business has experienced a noticeable month-on-month increase in capacity utilization [1] - Increased demand in the storage market and application processor chip products is driving the growth in the packaging substrate business [1]

Core Insights - The company disclosed an investor relations activity record highlighting the capabilities of HDI as a platform technology for high-density wiring in PCB boards [1] - The company's PCB business possesses HDI process capabilities, primarily applied in mid-to-high-end products across various downstream sectors including communication, data centers, industrial control medical, and automotive electronics [1] Summary by Categories Technology - HDI is identified as a platform technology that enables high-density wiring for PCB boards [1] Business Application - The company's PCB business utilizes HDI technology in several mid-to-high-end products [1] - Key downstream sectors for the application of HDI technology include communication, data centers, industrial control medical, and automotive electronics [1]

Group 1: Financial Performance - The company's overall gross margin improved in Q3 2025, driven by increased demand for storage packaging substrates and higher capacity utilization rates [1] - PCB data center and wired communication business revenues continued to grow, contributing to a slight increase in gross margins [1] - The revenue from packaging substrates increased quarter-on-quarter, with significant growth in storage packaging substrates [2] Group 2: Business Expansion - The PCB business focuses on communication equipment, with key expansions in data centers (including servers) and automotive electronics [1] - The company has a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers/storage [2] Group 3: Production Capacity and Technology - The company has achieved mass production capability for FC-BGA packaging substrates with up to 20 layers, while R&D for 22-26 layer products is progressing on schedule [3] - New factories in Nantong Phase IV and Thailand are under construction, with the Thailand factory already in trial production [4] - The overall capacity utilization rate remains high, with a noticeable increase in the packaging substrate business due to rising demand [5] Group 4: Raw Material Prices - Key raw materials include copper-clad laminates, prepregs, copper foil, gold salt, and inks, with some experiencing price increases in Q3 2025 due to commodity price fluctuations [6] - The company is actively monitoring international commodity price changes and maintaining communication with suppliers and customers [6] Group 5: Technology Application - HDI technology is applied in the PCB business, primarily for mid-to-high-end products in communication, data centers, industrial control, medical, and automotive electronics [8]

Core Insights - The PCB industry is experiencing unprecedented growth driven by the explosive demand for high-end HDI and packaging substrates due to AI server requirements [1][2][3] - A total of 38 listed companies in the A-share PCB sector reported a combined revenue of 1560.42 billion yuan and a net profit of 168.62 billion yuan for the first three quarters of 2025, both figures marking historical highs [2][3] - The industry is witnessing a significant expansion in high-end production capacity, raising concerns about potential price competition if AI demand does not sustain post-2026 [1][5][7] Revenue and Profit Growth - The PCB sector's total revenue increased by approximately 385 billion yuan or 32.75% year-on-year, while net profit rose by 73.51 billion yuan or 77.3% [1][2] - Leading companies such as Huadian Co., Shenghong Technology, and Shennan Circuit are showing robust growth, with revenue exceeding 10 billion yuan for several firms [2][3] - Notable performers include Shenghong Technology with a revenue growth of 83.40% and a net profit increase of 324.38% [2][3] High-End Product Demand - The surge in AI server demand is identified as the primary driver of the PCB industry's high growth, particularly for high-end products like HDI and packaging substrates [3][4] - Companies that successfully capture high-end PCB market demand are experiencing faster growth, with significant differences in profit margins across the sector [3][4] - Huadian Co. and Shenghong Technology reported sales net profit margins exceeding 20%, while others like Shennan Circuit and Shengyi Technology surpassed 13% [3][4] Capacity Expansion and Market Competition - Major PCB manufacturers are investing heavily in expanding high-end production capacity to meet the rising demand for AI-related products [5][6] - Companies like Shengyi Technology and Huadian Co. are undertaking significant capital projects to enhance their production capabilities [5][6] - The current expansion trend raises concerns about intensified competition and potential profit erosion if demand does not keep pace with the new capacity coming online [5][7] Future Outlook and Challenges - Analysts express caution regarding the sustainability of the current demand growth, suggesting that a slowdown could lead to oversupply and price competition in the future [7] - The PCB industry is characterized by high fixed costs, making capacity utilization critical for profitability, and any decline in utilization could severely impact margins [7] - Future competition may shift from quantity to quality, focusing on technological advancements and customer loyalty, favoring companies with early expansion and technological advantages [7]

Market Overview - The large fund concept sector experienced a decline of 0.73% on November 5, with Shengke Communication leading the drop [1] - The Shanghai Composite Index closed at 3969.25, up 0.23%, while the Shenzhen Component Index closed at 13223.56, up 0.37% [1] Stock Performance - Notable gainers in the large fund concept sector included: - Xingfa Group (600141) with a closing price of 28.89, up 5.02% and a trading volume of 325,000 shares, totaling 920 million yuan [1] - Baiwei Storage (688525) closed at 124.90, up 2.44% with a trading volume of 212,800 shares, totaling 2.558 billion yuan [1] - Tuojing Technology (688072) closed at 310.20, up 1.77% with a trading volume of 72,900 shares, totaling 2.219 billion yuan [1] - Major decliners included: - Shengke Communication (688702) closed at 110.25, down 3.73% with a trading volume of 43,500 shares, totaling 482 million yuan [2] - Guoxin Technology (688262) closed at 30.34, down 3.10% with a trading volume of 131,100 shares [2] - Huahong Company (688347) closed at 120.97, down 2.58% with a trading volume of 213,600 shares, totaling 2.594 billion yuan [2] Capital Flow - The large fund concept sector saw a net outflow of 2.352 billion yuan from institutional investors, while retail investors contributed a net inflow of 2.305 billion yuan [2] - Notable capital flows included: - Tuo Jing Technology (688072) with a net inflow of 156 million yuan from institutional investors [3] - Deep South Circuit (002916) with a net inflow of 116 million yuan from institutional investors [3] - Zhongwei Company (688012) with a net inflow of 83.21 million yuan from institutional investors [3]

Investment Rating - The report maintains a "Recommended" investment rating for the company [1]. Core Views - The company has achieved significant revenue growth, with a 28.39% year-over-year increase in revenue to 16.754 billion yuan and a 56.30% increase in net profit to 2.326 billion yuan for the first three quarters of 2025 [5][9]. - The company is positioned to benefit from the domestic substitution of semiconductor substrates, with a diverse range of packaging substrate products that cater to various applications, including mobile smart terminals and servers/storage [9][10]. - The report projects an increase in net profit for the years 2025 to 2027, with estimates of 3.202 billion yuan, 4.698 billion yuan, and 5.893 billion yuan respectively, reflecting a strong growth trajectory [10][12]. Financial Summary - Revenue projections for the company are as follows: 17.907 billion yuan in 2024, 22.922 billion yuan in 2025, 29.110 billion yuan in 2026, and 36.388 billion yuan in 2027, with year-over-year growth rates of 32.4%, 28.0%, 27.0%, and 25.0% respectively [8][12]. - The company's net profit is expected to grow significantly, with projections of 3.202 billion yuan in 2025, 4.698 billion yuan in 2026, and 5.893 billion yuan in 2027, indicating a robust growth rate [10][12]. - Key financial ratios indicate improving profitability, with gross margins expected to rise to 30% by 2026 and net profit margins reaching 16.2% by 2027 [12]. Market Position - The company is recognized as a leading domestic IC substrate manufacturer, benefiting from the increasing demand for AI computing power, structural growth in the storage market, and the rise of automotive electronics [9][10]. - The company has successfully introduced new high-end DRAM products, leading to a significant increase in orders for storage products [9][10].

Investment Rating - The investment rating for the company is "Buy" and is maintained [6]. Core Insights - The company reported significant year-on-year growth in performance, with a revenue increase of 28.39% to 16.754 billion yuan and a net profit increase of 56.30% to 2.326 billion yuan for the first three quarters of 2025. The gross margin and net margin were 28.20% and 13.90%, respectively [2][4]. - In Q3 2025, the company achieved a revenue of 6.301 billion yuan, reflecting a year-on-year growth of 33.25% and a quarter-on-quarter growth of 11.11%. The net profit for the quarter was 966 million yuan, showing a year-on-year increase of 92.87% and a quarter-on-quarter increase of 11.20%. The gross margin and net margin for the quarter were 31.39% and 15.35%, respectively [2][4]. - The company benefits from the demand for AI computing upgrades, structural growth in the storage market, and increased demand for automotive electronics. The demand for AI accelerator cards, switches, optical modules, servers, and related products continues to rise, contributing to revenue growth [9]. - The company emphasizes a long-term strategy of technological leadership, with R&D investment accounting for 7.36% of revenue in Q3 2025. Ongoing projects include advancements in next-generation communication, data center, and automotive electronics PCB technologies [9]. - The company is expected to achieve net profits of 3.467 billion yuan, 5.056 billion yuan, and 7.025 billion yuan for the years 2025, 2026, and 2027, respectively, with corresponding PE ratios of 41.24, 28.28, and 20.36 [9]. Summary by Sections Financial Performance - For the first three quarters of 2025, the company achieved total revenue of 16.754 billion yuan and a net profit of 2.326 billion yuan, with respective year-on-year growth rates of 28.39% and 56.30% [2][4]. - In Q3 2025, the company reported revenue of 6.301 billion yuan and a net profit of 966 million yuan, with year-on-year growth rates of 33.25% and 92.87% [2][4]. Market Position and Strategy - The company is recognized as a leading player in the PCB industry in China and a pioneer in the packaging substrate sector. The demand for products in the communication and data center sectors is expected to drive future growth [9]. - The company maintains a focus on technological innovation and R&D, with significant investments aimed at enhancing its product offerings and market competitiveness [9].

Core Viewpoint - Yingxin Development has reached a trading limit, marking a consecutive two-day increase, while Yishitong has surged over 14%. Other companies such as Shannon Chip, Sanfu Co., Huahong Semiconductor, Shenzhen South Circuit, and Shikong Technology have also seen gains [1] Company Performance - Yingxin Development has achieved a trading limit and a two-day consecutive increase [1] - Yishitong has experienced a significant rise of over 14% [1] - Other companies including Shannon Chip, Sanfu Co., Huahong Semiconductor, Shenzhen South Circuit, and Shikong Technology have followed suit with upward trends [1]

Core Viewpoint - The electronic ETF (515260) is experiencing fluctuations, with a slight decrease in value, but there is optimism in the sector as evidenced by significant capital inflow and strong performance from many constituent stocks [1][3]. Market Performance - The electronic sector has a total market capitalization of 107.32 trillion yuan, leading all sectors and accounting for 12.42% of the total market, an increase of nearly 3 percentage points since the beginning of the year [3]. - As of October 31, 49 out of 50 constituent stocks of the electronic ETF have reported Q3 results, with 44 companies profitable and 40 showing year-on-year net profit growth [3]. Company Performance - Notable profit increases include: - Silan Micro's net profit increased 11 times year-on-year - Geke Micro, Shenghong Technology, Cambricon, and others reported net profit growth rates of 518%, 324%, 321%, and 265% respectively [3]. Investment Outlook - Galaxy Securities emphasizes that the technology sector will be a long-term investment focus, particularly in the electronic industry driven by AI and overall valuation improvements [3]. - The ETF is positioned to benefit from trends in semiconductor equipment and materials localization, as well as infrastructure investments driven by AI demand [3]. Sector Trends - Major tech companies like Google, Meta, Microsoft, and Amazon are increasing capital expenditures, indicating a sustained trend into the next year [4]. - The demand for AI-related products, particularly in the PCB sector, is surging, with many companies experiencing strong order growth and production capacity expansion [4]. Policy Support - There is strong governmental support for the semiconductor industry, aiming for self-sufficiency, while AI is reshaping consumer electronics, enhancing user experiences [5].

Core Viewpoint - Fund managers remain confident in AI computing power despite some divergence in their investment strategies during Q3 2025, with a focus on the PCB sector and light communication leaders [1][2][3] Group 1: Fund Manager Strategies - Notable fund manager Jin Zicai increased holdings in PCB-related companies such as Shenzhen South Circuit, Shengyi Technology, and Huidian Co., while reducing positions in leading optical module firms like NewEase and Taicheng Light [1][2] - Fund manager Zheng Xi also mirrored this strategy by increasing investments in PCB companies and reducing exposure to optical communication stocks [2] - Fund manager Lei Tao diversified by increasing allocations in both optical communication and PCB sectors, with significant gains reported [2] Group 2: Market Outlook - Jin Zicai expressed optimism about the overseas computing power sector, suggesting that the market has underestimated the growth potential and sustainability of earnings in this area [3] - Zheng Xi highlighted the increasing allocation to AI computing and semiconductor storage sectors, anticipating strong growth in AI applications and a favorable market for global computing resources [3] - The overall sentiment among top-performing fund managers indicates a belief in the ongoing demand for computing power, with expectations of significant growth opportunities ahead [3]