Core Viewpoint - The article highlights how Tongyu New Materials, under the leadership of Zhang Chi, has transformed from a domestic player in the electronic resin sector to a key contributor in the core materials of the electronic industry, focusing on lead-free and halogen-free copper-clad laminates [1][2]. Company Development - Tongyu New Materials was established in 2015, targeting the domestic electronic industry's reliance on foreign materials, and quickly gained certifications from major clients like Kingboard, Nanya, and Shantou Ultrasound [2][3]. - The company has developed a comprehensive team covering the entire supply chain, allowing for rapid response to customer needs, distinguishing itself from foreign competitors [2][3]. Technological Advancements - The company has overcome several technical challenges in producing modified epoxy resins, achieving 17 authorized invention patents, thus turning its previous weaknesses into strengths [3][6]. - Tongyu New Materials is one of the few domestic companies mastering multiple series of lead-free and halogen-free electronic resin technologies, actively promoting the localization of high-end applications [6][7]. Market Potential - Electronic resins account for 20% of the cost of copper-clad laminates, which are essential for printed circuit boards (PCBs) used in various industries, including smart appliances and automotive electronics [4][5]. - The global PCB substrate market was valued at $81.742 billion in 2022 and is expected to reach $101.56 billion by 2026, indicating significant growth potential for the electronic resin industry [4][5]. Future Outlook - The company plans to leverage its upcoming IPO to attract talent and enhance its production capacity, addressing current bottlenecks in meeting customer demand [7][8]. - The proposed investment project aims to produce 20,000 tons of electronic resin annually, which will help alleviate capacity constraints and strengthen the company's market position [7][8].

Core Viewpoint - The demand for high-end electronic resins is increasing due to the global PCB industry shifting to China, with the company Tongyu New Materials planning to raise funds for expanding production capacity to meet this demand [1][3]. Company Summary - Tongyu New Materials is set to be listed on the Shenzhen Stock Exchange on July 10, primarily to raise funds for its subsidiary's project to produce 200,000 tons of electronic resin annually, addressing capacity constraints [1]. - The company has a production capacity utilization rate projected at 100.04%, 105.93%, and 116.37% for the years 2022 to 2024 [1]. - The chairman of Tongyu New Materials emphasized that the fundraising project will effectively expand the company's production capacity and enhance its competitive and profitability capabilities [1]. Industry Summary - China is currently the largest producer of copper-clad laminates globally, but the high-performance electronic resins used in these laminates are still dominated by companies from the US, South Korea, Japan, and Taiwan, indicating a significant domestic supply gap [2]. - The electronic resin market is crucial for the production of copper-clad laminates, semiconductor packaging materials, and other electronic components, which are essential for high-tech industries [1][2]. - The demand for electronic resins is expected to rise with the development of high-density interconnect printed circuit boards, driven by trends in miniaturization and lightweight electronic products [2]. - The company is focusing on R&D, with a compound annual growth rate of 20.28% in R&D investment from 2022 to 2024, aiming to reduce reliance on foreign suppliers and increase the domestic production rate of high-performance electronic resins [2][3]. - The market for high-performance electronic resins is anticipated to grow significantly due to the ongoing advancements in 5G and 6G communication technologies, AI computing power, and automotive intelligence [5].

Company Overview - Tongyu New Materials has been deeply engaged in the electronic resin field for nearly 10 years, breaking the monopoly of international leading companies in the lead-free and halogen-free copper-clad laminate applicable electronic resin sector [2] - The company specializes in the research, production, and sales of electronic resins, primarily used in the production of copper-clad laminates, with products including MDI modified epoxy resin, DOPO modified epoxy resin, high-bromine epoxy resin, BPA-type phenolic epoxy resin, and phosphorus-containing phenolic resin curing agents [2] Industry Insights - The electronic resin industry is crucial as it is one of the three main raw materials for producing copper-clad laminates, which are fundamental materials for processing printed circuit boards (PCBs) [2] - The copper-clad laminate industry in mainland China has seen rapid growth, with the output value increasing from $6.1 billion in 2014 to $9.3 billion in 2023, benefiting from the global PCB industry shifting to mainland China [2] Financial Performance - The company achieved operating revenues of 1.193 billion yuan, 886 million yuan, and 952 million yuan for the years 2022, 2023, and 2024, with year-on-year growth rates of 25.95%, -25.70%, and 7.47% respectively [2] - The net profit attributable to the parent company for the same years was 188 million yuan, 164 million yuan, and 143 million yuan, with year-on-year growth rates of 38.98%, -12.51%, and -12.87% respectively [2] - In Q1 2025, the company reported operating revenue of 276 million yuan, a year-on-year increase of 25.60%, while the net profit attributable to the parent company was 33 million yuan, a decrease of 4.43% year-on-year [2] IPO Details - The company plans to issue 10 million new shares in its IPO, raising 840 million yuan, with the funds intended for a 200,000-ton electronic resin project and to supplement working capital [3] - The company is currently experiencing tight production capacity, with utilization rates exceeding 100% during the reporting period [3] Valuation and Market Performance - Tongyu New Materials has a certain valuation advantage, with an issuance price-to-earnings ratio of 23.7 times, compared to an average dynamic P/E ratio of 36.88 times for comparable companies [5] - If the company achieves the average valuation of comparable companies on its first trading day, it would require a 55.6% increase from its issuance price [5] - The issuance price of 84 yuan is relatively high, and similar new stocks with prices around this level have shown an average first-day increase of 85.36%, significantly lower than the average first-day increase of 291.59% for new stocks over the past year [5]

Core Viewpoint - The legal opinion letter confirms that Tongyu New Materials (Guangdong) Co., Ltd. has obtained all necessary approvals and qualifications for its initial public offering (IPO) and listing on the ChiNext board, complying with relevant laws and regulations [2][3][9]. Group 1: Company Approval and Authorization - The company's board of directors approved the proposal for the IPO and submitted it to the 2021 annual general meeting for review [3][4]. - The shareholders' meeting approved the IPO proposal with 100% of the voting shares represented [3][4]. - The Shenzhen Stock Exchange's ChiNext Listing Committee has approved the company's IPO [4][5]. Group 2: Company Qualifications - The company is a legally established joint-stock company with a registered capital of 30 million yuan [5][6]. - The company has been in continuous operation for over three years and holds a valid business license issued by the Zhaoqing Market Supervision Administration [5][6]. - The company has a sound organizational structure and has established necessary governance bodies, complying with the requirements of the Company Law and Securities Law [5][6]. Group 3: Financial Performance - The company's net profits for the years 2022, 2023, and 2024 were reported as 188.0032 million yuan, 164.4793 million yuan, and 143.3056 million yuan, respectively [6][7]. - The company has maintained positive net profits over the last two years, with a cumulative net profit exceeding 50 million yuan [6][7]. Group 4: Compliance with Regulations - The company has complied with the Management Measures and Listing Rules, ensuring that its financial statements reflect its financial status accurately [5][6]. - The company and its major stakeholders have made public commitments regarding share lock-up and stock price stabilization measures, in accordance with the Securities Law and Listing Rules [6][7]. Group 5: Sponsorship and Representation - The company has appointed Industrial Securities as its sponsor for the IPO, which is registered with the China Securities Regulatory Commission [7][9]. - The designated representatives from the sponsor are responsible for overseeing the IPO process [7][9].

股票简称：同宇新材 股票代码：301630 同宇新材料（广东）股份有限公司 Tongyu Advanced Materials （Guangdong） Co., Ltd. 广东省肇庆市四会市大沙镇马房开发区（西南一区编号 ES1020） 首次公开发行股票并在创业板上市 之 上市公告书 保荐人（主承销商） （福州市湖东路 268 号） 二〇二五年七月 同宇新材料（广东）股份有限公司 上市公告书 特别提示 同宇新材料（广东）股份有限公司 上市公告书 同宇新材料（广东）股份有限公司（以下简称"同宇新材"、"本公司"、"发 行人"或"公司"）股票将于 2025 年 7 月 10 日在深圳证券交易所创业板上市。 创业板公司具有经营风险高、业绩不稳定、退市风险大等特点，投资者面临 较大的市场风险。投资者应充分了解创业板市场的投资风险及本公司所披露的风 险因素，审慎做出投资决定。 本公司提醒投资者应充分了解股票市场风险及本公司披露的风险因素，在新 股上市初期切忌盲目跟风"炒新"，应当审慎决策、理性投资。 如无特别说明，本上市公告书中的简称或名词的释义与《同宇新材料（广东） 股份有限公司首次公开发行股票并在创业板上市招股说明 ...

同宇新材料（广东）股份有限公司 首次公开发行股票并在创业板上市之 上市公告书提示性公告 保荐人（主承销商）：兴业证券股份有限公司 本公司及全体董事、监事、高级管理人员保证信息披露的内容真实、准确、 完整、及时，没有虚假记载、误导性陈述或重大遗漏。 经深圳证券交易所审核同意，同宇新材料（广东）股份有限公司（以下简称 "同宇新材"、"本公司"、"发行人"）人民币普通股股票将于 2025 年 7 月 10 日 在深圳证券交易所创业板上市，上市公告书全文和首次公开发行股票的招股说明 书全文披露于中国证券监督管理委员会指定信息披露网站：巨潮资讯网，网址 www.cninfo.com.cn ； 中 证 网 ， 网 址 www.cs.com.cn ；中国证券网，网址 www.cnstock.com；证券时报网，网址 www.stcn.com；证券日报网，网址 www.zqrb.cn；经济参考网，网址 www.jjckb.cn；中国金融新闻网，网址 www.financialnews.com.cn；中国日报网，网址 cn.chinadaily.com.cn，供投资者查 阅。 所属网页二维码：巨潮资讯网 一、上市概况 （一）股 ...

（福建省福州市湖东路 268 号） 同宇新材料（广东）股份有限公司 上市保荐书 声 明 兴业证券股份有限公司（以下简称"保荐机构"或"本保荐机构"）及保荐 代表人根据《中华人民共和国公司法》（以下简称"《公司法》"）《中华人民共和 国证券法》（以下简称"《证券法》"）《首次公开发行股票注册管理办法》（以下简 称"《注册管理办法》"）《证券发行上市保荐业务管理办法》（以下简称"《保荐管 理办法》"）等有关法律、行政法规和中国证券监督管理委员会（以下简称"中国 证监会"）及深圳证券交易所的规定，诚实守信，勤勉尽责，严格按照依法制订 的业务规则、行业自律规范出具本上市保荐书，并保证所出具文件的真实性、准 确性和完整性。 兴业证券股份有限公司 关于同宇新材料（广东）股份有限公司 首次公开发行股票并在创业板上市 之 上市保荐书 保荐机构（主承销商） 本上市保荐书中如无特别说明，相关用语与《同宇新材料（广东）股份有限 公司首次公开发行股票并在创业板上市招股说明书》中含义相同。 1 同宇新材料（广东）股份有限公司 上市保荐书 一、发行人概况 | | 发行人基本情况 | | | | --- | --- | --- | --- ...

北京市朝阳区建外大街丁 12 号英皇集团中心 8、9、11 层 8/9/11/F, Emperor Group Centre, No.12D, Jianwai Avenue, Chaoyang District, Beijing, 100022, P.R.China 电话/Tel.:010-50867666 传真/Fax:010-56916450 网址/Website:www.kangdalawyers.com 北京 西安 深圳 海口 上海 广州 杭州 沈阳 南京 天津 菏泽 成都 苏州 呼和浩特 香港 武汉 郑州 长沙 厦门 重庆 合肥 宁波 济南 昆明 南昌 北京市康达律师事务所 关于同宇新材料（广东）股份有限公司 首次公开发行股票并在创业板上市的 法律意见书 康达股发字【2025】第 0051 号 释 义 在本《法律意见书》中，除非文义另有所指，下列词语具有下述涵义： | 简称 | - | 含义 | | --- | --- | --- | | 发行人、同宇新材、公司、股份 | 指 | 同宇新材料（广东）股份有限公司 | | 公司 | | | | 有限公司、同宇有限 | 指 | 广东同宇新材料有限公司，系 ...

同宇新材料（广东）股份有限公司 首次公开发行股票并在创业板上市 发行结果公告 保荐人（主承销商）：兴业证券股份有限公司 特别提示 同宇新材料（广东）股份有限公司（以下简称"发行人"）首次公开发行 1,000.00 万股人民币普通股（A 股）（以下简称"本次发行"）的申请已经深 圳证券交易所（以下简称"深交所"）上市审核委员会审议通过，并已经中国 证券监督管理委员会同意注册（证监许可〔2025〕907 号）。本次发行的保荐 人（主承销商）为兴业证券股份有限公司（以下简称"保荐人（主承销 商）"）。发行人的股票简称为"同宇新材"，股票代码为"301630"。 本次发行采用网上向持有深圳市场非限售 A 股股份和非限售存托凭证市值 的社会公众投资者直接定价发行（以下简称"网上发行"）的方式进行，全部 为新股，不转让老股。发行人和保荐人（主承销商）协商确定本次发行数量为 1,000.00 万股，发行价格为 84.00 元/股。本次发行中网上发行数量为 1,000.00 万股，占本次发行总量的 100%。本次发行的股票无流通限制及锁定安排。 本次发行的网上认购缴款工作已于 2025 年 7 月 3 日（T+2 日）结束。 ...

同宇新材料（广东）股份有限公司 网上摇号中签结果公告 保荐人（主承销商）：兴业证券股份有限公司 特别提示 首次公开发行股票并在创业板上市 同宇新材料（广东）股份有限公司（以下简称"发行人"）首次公开发行 股票并在创业板上市的申请已经深圳证券交易所（以下简称"深交所"）上市 审核委员会审议通过，并已经中国证券监督管理委员会同意注册（证监许可 〔2025〕907 号）。 本次发行采用网上向持有深圳市场非限售 A 股股份和非限售存托凭证市值 的社会公众投资者定价发行（以下简称"网上发行"）的方式进行，全部为新 股，不转让老股。发行人和保荐人（主承销商）兴业证券股份有限公司（以下 简称"保荐人（主承销商）"）协商确定本次发行数量为 1,000.00 万股，发行 价格为 84.00 元/股。本次发行中网上发行 1,000.00 万股，占本次发行总量的 100%。本次发行的股票无流通限制及锁定安排。 根据《同宇新材料（广东）股份有限公司首次公开发行股票并在创业板上 市发行公告》，发行人和保荐人（主承销商）于 2025 年 7 月 2 日（T+1 日）上 午在深圳市罗湖区深南东路 5045 号深业中心 311 室主持了同宇 ...