Q3 2025 Results Presentation 30 October 2025 Disclaimer We also do not undertake any obligation to provide you with access to any additional information or to update this presentation or any additional information or to correct any inaccuracies in this presentation or any additional information which may become apparent. This presentation does not constitute an offer or invitation to purchase or subscribe for any shares and no part of it shall form the basis of or be relied upon in connection with any contr ...

Core Insights - ASMPT reported a sales revenue of HKD 36.6 billion for the third quarter, representing a year-on-year growth of 9.5% [1] - The total new orders amounted to HKD 36.21 billion, reflecting a year-on-year increase of 14.2% [1] Group 1: Business Performance - The advanced packaging (AP) segment, particularly the thermal compression bonding (TCB) solutions, received repeat orders from clients in advanced memory and logic applications [1] - The mainstream business benefited from the ongoing adoption of artificial intelligence (AI), with increased demand for AI infrastructure in data centers, data transmission, and energy management [1] Group 2: Market Dynamics - In the Chinese market, the demand for semiconductor solutions (wire bonders, die bonders) and surface mount technology solutions, primarily for electric vehicles (EVs), continued to grow [1] - The high utilization rates of outsourced semiconductor assembly and testing facilities, along with China's leading position in the electric vehicle market, contributed to the increased demand in the mainstream business [1]

Core Insights - ASMPT reported a revenue of HKD 3.66 billion for Q3 2025, representing a year-on-year increase of 9.5% [1] - The total new orders amounted to HKD 3.621 billion, reflecting a year-on-year growth of 14.2% [1] - The company experienced a loss attributable to shareholders of HKD 270 million, marking a shift from profit to loss compared to the previous year [1] - Basic loss per share was HKD 0.65 [1] Business Performance - The advanced packaging (AP) and mainstream businesses benefited from the ongoing adoption of artificial intelligence (AI) [1] - The thermal compression bonding (TCB) solutions in advanced packaging received repeat orders from clients in advanced memory and logic applications [1] - Demand for mainstream business was driven by AI infrastructure, including data centers, data transmission, and energy management [1] Market Dynamics - In the Chinese market, the high utilization rates of electric vehicle (EV) and outsourced semiconductor assembly and testing (OSAT) companies boosted demand [1] - However, contributions from automotive and industrial markets outside of China remained weak [1] - The demand for mainstream business continued to benefit from AI, primarily driven by enhanced energy management capabilities in data centers and the demand for AI server motherboards in base stations [1] Segment Analysis - In the Chinese market, demand in the semiconductor solutions segment and surface mount technology (SMT) solutions segment continued to grow [1] - The new order total for wire bonding and die bonding applications in the semiconductor solutions segment was driven by the increasing utilization rates of outsourced semiconductor assembly and testing facilities [1] - Demand in the SMT solutions segment was mainly from electric vehicles, where the company maintains a leading position in China [1]

2025年第三季度的每股基本亏损为港币0.65元，而根据非香港财务报告会计准则计量经调整每股基本盈 利为港币0.24元。按此非香港财务报告会计准则计量，按季减少25.0%，按年则增加200.0%。 格隆汇10月28日丨ASMPT(00522.HK)公布截至2025年9月30日止三个月(2025年第三季度)录得销售收入 为港币 36.6亿元(4.68亿美元)，分别按季增加7.6%及按年增加9.5%。集团2025年第三季度的综合除税后 亏损为港币2.69亿元。然而，根据非香港财务报告会计准则计量1经调整除税后盈利为港币1.02亿元，按 季减少24.4%，按年则增加245.2%。 ...

ASMPT LIMITED 香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責，對其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 （於開曼群島註冊成立之有限公司） （股份代號：0522） 二零二五年第三季度業績新聞稿 有關 ASMPT Limited 及其附屬公司截至二零二五年九月三十日止三個月業績的 新聞稿附載於本公告。 承董事會命 董事 黃梓达 香港，二零二五年十月二十八日 於本公告日期，本公司董事會成員包括獨立非執行董事：樂錦壯先生（主席）、 張仰學先生、蕭潔雲女士及許明明女士；非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執行 董事： 黃梓 达先生及 Guenter Walter Lauber 先生。 （本公告之中英文版本如有任何歧義，概以英文版本為準。） [新聞稿] ASMPT 公布二零二五年第三季度業績 人工智能推動強勁勢頭 集團業績概覽 關鍵亮點 先進封裝及主流業務均受惠於人工智能 TCB 技術於第四代高頻寬記憶 ...

Financial Performance - Total new orders for Q3 2025 amounted to HKD 3,620.7 million (USD 463 million), representing a quarterly decrease of 3.5% but an annual increase of 14.2%[2] - Sales revenue for Q3 2025 was HKD 3,661.2 million (USD 468 million), reflecting a quarterly increase of 7.6% and an annual increase of 9.5%[5] - Adjusted net profit for Q3 2025 was HKD 101.9 million, down 24.4% quarter-on-quarter but up 245.2% year-on-year[5] - The adjusted gross margin for Q3 2025 was 37.7%, a decrease of 203 basis points quarter-on-quarter and 330 basis points year-on-year[2] - Adjusted operating profit for Q3 2025 was HKD 124.4 million, a decrease of 26.6% quarter-over-quarter and 30.3% year-over-year[16] - The company reported a net loss of HKD 268,599 for Q3 2025, compared to a profit of HKD 134,338 in Q2 2025[29] - The company reported a total comprehensive loss of HKD 363,322 for Q3 2025, compared to a comprehensive income of HKD 863,463 in Q2 2025[29] - For the three months ended September 30, 2025, the company reported a loss attributable to shareholders of HKD (269,877) thousand, compared to a profit of HKD 131,214 thousand for the previous quarter[34] - The basic loss per share for the three months ended September 30, 2025, was HKD (0.65), while the adjusted earnings per share was HKD 0.24[37] - The gross profit for the three months ended September 30, 2025, was HKD 1,305,750 thousand, with a gross margin of 35.7%, which adjusted to HKD 1,379,634 thousand and a gross margin of 37.7%[37] - The operating profit for the same period was HKD 50,480 thousand, which adjusted to HKD 124,364 thousand[37] - The semiconductor solutions segment reported a gross profit of HKD 701,959 thousand with a gross margin of 37.3%, which adjusted to HKD 775,843 thousand and a gross margin of 41.3%[41] - The company recognized a one-time inventory write-off of HKD 73.9 million in Q3 2025 due to a product simplification plan[33] - The company recognized a one-time inventory write-off related to the voluntary liquidation of a subsidiary in the semiconductor solutions segment, impacting the financial results significantly[35] Sales and Orders - Q4 2025 sales revenue is forecasted to be between USD 470 million and USD 530 million, indicating a quarterly increase of 6.8% and an annual increase of 14.3% at the median[3] - In Q3 2025, the total new orders amounted to HKD 3,620.7 million (USD 463 million), representing a quarterly decrease of 3.5% but an annual increase of 14.2%[16] - Sales revenue for Q3 2025 reached HKD 3,661.2 million (USD 468 million), reflecting a quarterly growth of 7.6% and an annual growth of 9.5%[16] - The semiconductor solutions segment recorded sales revenue of HKD 1,879.8 million (USD 240 million), a quarterly decline of 6.5% but an annual increase of 5.0%[20] - The surface mount technology solutions segment achieved sales revenue of HKD 1,781.4 million (USD 228 million), with a quarterly increase of 28.0% and an annual increase of 14.6%[25] - The total unfulfilled orders at the end of the quarter were approximately USD 868 million[18] - Semiconductor solutions segment sales for Q3 2025 reached HKD 1,879,838, while surface mount technology solutions segment sales were HKD 1,781,362, contributing to total sales revenue of HKD 3,661,200[32] Market Trends and Demand - The advanced packaging business continues to benefit from strong demand driven by artificial intelligence, particularly in high bandwidth memory and advanced logic applications[7] - Demand in the mainstream business is primarily driven by data centers and electric vehicles in the Chinese market, with increased utilization rates in outsourced semiconductor assembly and testing[14] - The company anticipates stable demand from China, although the recovery outlook for the automotive and industrial end markets remains uncertain[26] - The company has not faced significant impacts from tariff policies but acknowledges existing uncertainties and will continue to monitor the situation closely[26] - The total potential market for TCB is projected to exceed $1 billion by 2027, driven by investments in the AI ecosystem and demand for advanced packaging[26] Operational Efficiency and Cost Management - The company expects to save approximately HKD 128 million (RMB 115 million) in future years due to the voluntary liquidation of AEC, enhancing operational cost efficiency[15] - R&D expenses for Q3 2025 were HKD 535,420, slightly increasing from HKD 525,888 in Q2 2025[27] Corporate Governance - The board of directors includes independent non-executive directors and executive directors, ensuring a diverse governance structure[44] Innovation and Collaboration - The company is actively collaborating with major logic and memory firms on various projects, indicating ongoing innovation and market expansion efforts[11] - The surface mount technology solutions segment has seen significant growth in new system-in-package (SiP) orders, supporting the development of artificial intelligence[13] - The company has secured repeat orders for its TCB solutions in both memory and logic sectors, showcasing its competitive edge in the advanced packaging market[8]

Core Viewpoint - ASMPT (00522.HK) experienced a decline of over 6%, with a current drop of 6.61%, trading at HKD 87.55, and a transaction volume of HKD 165 million [1] Group 1 - ASMPT's stock price fell by 6.61% [1] - The current trading price of ASMPT is HKD 87.55 [1] - The trading volume for ASMPT reached HKD 165 million [1]

Group 1 - ASMPT's stock price dropped over 6%, currently at 87.55 HKD with a trading volume of 165 million HKD [1] - The company announced a board meeting on October 28 to consider and approve the release of its unaudited consolidated performance for the nine months ending September 30, 2025, which will be published after market close on that day [1] - Morgan Stanley predicts ASMPT may report a loss in Q3 due to one-time restructuring expenses but encourages investors to focus on long-term growth drivers such as CoWoS-L capacity expansion, development of high-frequency memory in China, and hybrid bonding progress [1] Group 2 - Morgan Stanley's Q3 revenue guidance for ASMPT is a median of 475 million USD, representing an 11% year-over-year growth [1] - The firm believes ASMPT's revenue will meet the guidance but expects a one-time restructuring expense of approximately 360 million RMB, leading to a net loss of about 69 million RMB during the period [1]

Group 1 - The Hong Kong stock market indices collectively rose, with the Hang Seng Tech Index increasing by over 1%, indicating a potential for a "three consecutive rises" [1] - Technology stocks, chip stocks, and Chinese brokerage stocks showed significant upward movement, with major holdings in the Hang Seng Tech Index ETF (513180) including Baidu, ASMPT, Alibaba, Xpeng Motors, Hua Hong Semiconductor, and SMIC experiencing notable gains [1] - Guotai Junan Securities suggests that if the US-China tariff conflict is nearing its end, a stabilization in the political cycle could enhance risk appetite, benefiting the Hang Seng Tech Index and low-priced offshore stocks [1] Group 2 - As of October 24, the latest valuation (PETTM) of the Hang Seng Tech Index ETF (513180) was 23.28 times, which is below the historical average for approximately 70% of the time since the index's inception, indicating a potentially undervalued position [2] - The Hong Kong tech sector is expected to benefit from current trends in AI, with the backdrop of potential Fed rate cuts leading to unexpected foreign capital inflows, alongside continuous increases in southbound capital [2]

每经AI快讯，ASMPT(00522.HK)盘中涨超5%，截至发稿，涨5.65%，报87.95港元，成交额7752.94万港 元。 ...