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ASMPT(00522.HK)拟3月3日举行董事会会议批准全年业绩
Ge Long Hui· 2026-02-11 08:40
Group 1 - The company ASMPT (00522.HK) announced that its board meeting will be held on March 3, 2026, to consider and approve the release of the annual performance announcement for the year ending December 31, 2025, for the company and its subsidiaries [1] - The board will also consider the distribution of the final dividend during this meeting [1] - The announcement regarding these matters will be published on the morning of March 4, 2026 [1]
ASMPT(00522) - 董事会召开日期
2026-02-11 08:33
香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負 責,對其準確性或完整性亦不發表任何聲明,並明確表示,概不對因本公告全 部或任何部份內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 承董事會命 ASMPT Limited 公司秘書 江俊 香港,二零二六年二月十一日 於本公告日期,本公司董事會成員包括獨立非執行董事:樂錦壯先生(主席)、 張仰學先生、蕭潔雲女士及許明明女士;非執行董事: Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生;執行 董事: 黃梓 达先生及 Guenter Walter Lauber 先生。 (本公告之中英文版本如有任何歧義,概以英文版本為準。) ASMPT LIMITED (於開曼群島註冊成立之有限公司) (股份代號:0522) 董事會召開日期 ASMPT Limited(「本公司」)謹此宣布,本公司董事會會議將於二零二六年三 月三日(星期二)舉行,藉以(其中包括)考慮及批准刊發本公司及其附屬公 司截至二零二五年十二月三十一日止年度的全年業績公告,以及考慮派發末期 股息。上述公告將於二零二六年三月四 ...
小摩:升ASMPT(00522)至“增持”评级 目标价上调至125港元
Zhi Tong Cai Jing· 2026-02-11 06:11
Core Viewpoint - Morgan Stanley upgraded ASMPT (00522) from "Neutral" to "Overweight" with a target price increase from HKD 76 to HKD 125, citing strong capital expenditure trends in advanced logic packaging and initial signs of improvement in the OSAT market [1] Group 1: Rating and Price Target - The rating for ASMPT has been upgraded to "Overweight" [1] - The target price has been raised to HKD 125 from HKD 76 [1] Group 2: Financial Forecasts - Earnings per share forecasts for the fiscal years 2026 and 2027 have been increased by 7% and 15% respectively [1] Group 3: Market Insights - ASMPT is expected to raise its long-term total addressable market size for TCB equipment and is confident in gaining more market share [1] - The company is making progress in the high bandwidth memory (HBM) TCB market, with a favorable capital expenditure environment in China and among mainstream OSAT vendors [1]
小摩:升ASMPT至“增持”评级 目标价上调至125港元
Zhi Tong Cai Jing· 2026-02-11 06:09
Core Viewpoint - Morgan Stanley upgraded ASMPT (00522) rating from "Neutral" to "Overweight" and raised the target price from HKD 76 to HKD 125, citing strong capital expenditure trends in advanced logic packaging and initial signs of improvement in the mainstream outsourced semiconductor assembly and test (OSAT) market [1] Group 1 - The company’s earnings per share forecasts for fiscal years 2026 and 2027 were increased by 7% and 15% respectively [1] - ASMPT is expected to raise its long-term total addressable market size for thermal compression bonding (TCB) equipment and is confident in gaining more market share in this area [1] - The company will provide updates on its progress in the high bandwidth memory (HBM) thermal compression bonding market, noting that the capital expenditure environment in China and among mainstream OSAT providers is becoming more favorable [1]
大行评级丨小摩:将ASMPT列入正面催化剂观察名单,目标价上调至125港元
Ge Long Hui· 2026-02-11 05:37
Core Viewpoint - Morgan Stanley upgraded ASMPT's rating from "Neutral" to "Overweight" and raised the target price from HKD 76 to HKD 125, citing strong capital expenditure trends in advanced logic packaging and initial signs of improvement in the mainstream outsourced semiconductor assembly and test (OSAT) market [1] Group 1 - The company’s earnings per share forecasts for fiscal years 2026 and 2027 were increased by 7% and 15% respectively [1] - ASMPT is expected to raise its long-term total addressable market estimates for thermal compression bonding (TCB) equipment and is confident in gaining more market share in this segment [1] - The capital expenditure environment in the Chinese market and among mainstream OSAT vendors is becoming more favorable [1]
ASMPT盘中涨超8% 获主要客户订购超细间距TCB AOR芯片对晶圆设备
Xin Lang Cai Jing· 2026-02-11 02:56
Core Viewpoint - ASMPT has secured a new order from a major client for two ultra-fine pitch thermal compression bonding (TCB) machines utilizing proprietary plasma active oxide removal (AOR) technology, reinforcing its leadership in the advanced packaging market [1] Group 1: Company Developments - ASMPT's stock price increased by over 8% during trading, with a current price of 107 HKD and a trading volume of 343 million HKD [1] - The new order for TCB equipment is aimed at chip-to-wafer (C2W) applications, highlighting the company's technological advancements [1] Group 2: Industry Insights - SMIC's executives indicated that the company's capital expenditure for 2025 is projected to be 8.1 billion USD, exceeding earlier expectations due to strong customer demand and extended equipment delivery times [1] - For 2026, SMIC expects its sales revenue growth to surpass the average of comparable peers, with capital expenditure remaining roughly stable compared to 2025, assuming no significant changes in the external environment [1]
ASMPT早盘涨超8% 获主要客户订购超细间距TCB AOR芯片对晶圆设备
Zhi Tong Cai Jing· 2026-02-11 01:53
Group 1 - ASMPT's stock price increased by over 8% in early trading, currently up 7.14% at HKD 108.1, with a trading volume of HKD 151 million [1] - ASMPT announced a new order from a major client for two units of its proprietary plasma active oxide removal (AOR) technology for ultra-fine pitch thermal compression bonding (TCB) equipment, reinforcing its leadership in the advanced packaging market [1] - SMIC's executives indicated that the company's capital expenditure for 2025 is projected to be USD 8.1 billion, exceeding earlier expectations due to strong customer demand, changes in the external environment, and longer equipment delivery times [1] Group 2 - SMIC provided guidance for 2026, expecting sales revenue growth to exceed the average of comparable peers, with capital expenditure remaining roughly flat compared to 2025, assuming no significant changes in the external environment [1]
港股异动 | ASMPT(00522)早盘涨超8% 获主要客户订购超细间距TCB AOR芯片对晶圆设备
智通财经网· 2026-02-11 01:53
Group 1 - ASMPT's stock price increased by over 8% in early trading, currently at 108.1 HKD with a trading volume of 151 million HKD [1] - ASMPT announced a new order from a major client for two ultra-fine pitch thermal compression bonding (TCB) machines equipped with proprietary plasma active oxide removal (AOR) technology for chip-to-wafer (C2W) applications, reinforcing its technological leadership in the advanced packaging market [1] Group 2 - SMIC's executives indicated that the company's capital expenditure for 2025 is projected to be 8.1 billion USD, exceeding earlier expectations due to strong customer demand, changes in the external environment, and longer equipment delivery times [1] - SMIC provided guidance for 2026, suggesting that sales revenue growth will exceed the average of comparable peers, with capital expenditure expected to remain roughly flat compared to 2025, assuming no significant changes in the external environment [1]
花旗集团对ASMPT的多头持仓比例降至7.51%
Jin Rong Jie· 2026-02-10 09:19
本文源自:金融界AI电报 据香港交易所披露,花旗集团对ASMPT Ltd.的多头持仓比例于2026年2月4日从7.52%降至7.51%。 ...
ASMPT:黄梓达退任集团行政总裁兼董事职务,公司开始物色继任者人选
Jin Rong Jie· 2026-02-10 06:07
本文源自:金融界AI电报 ASMPT2月10日在港交所公告,黄梓达已决定于其本公司董事任期在本公司即将于二零二六年五月七日 举行的股东周年大会上届满后,不再膺选连任。黄梓达作为执行董事的任期将于股东周年大会结束时届 满。此外,黄梓达决定退任集团行政总裁职务。黄梓达已同意在委任其继任人之前,继续以集团行政总 裁身份留任。本公司已启动全面遴选程序,以物色黄梓达的继任人选。 ...