Core Insights - The Hang Seng Index Company announced its quarterly review results, including the addition of Sinopharm to the Hang Seng Index, increasing the number of constituent stocks from 88 to 89 [1] - The Hang Seng Tech Index will include Li Auto while removing ASMPT from its constituents [1] Group 1 - The Hang Seng Index will now consist of 89 stocks following the inclusion of Sinopharm [1] - The addition of Sinopharm reflects a strategic move to enhance the index's representation of the healthcare sector [1] - The Hang Seng Tech Index's adjustment indicates a shift in focus towards electric vehicle manufacturers like Li Auto [1]

格隆汇11月21日丨根据联交所最新权益披露资料显示，2025年11月17日，ASMPT(00522.HK)获JPMorgan Chase & Co.以每股均价77.8447港元增持好仓27.67 万股，涉资约2153.96万港元。 | FREE FREE | 大股東/董事/最高行政人員名稱作出披露的 買入 / 南出或涉及的股每股的平均價 | | | | 特有機容的设分數目 | 估已發行的 有關事件的日 | | --- | --- | --- | --- | --- | --- | --- | | | | | | | | (請參閱上述*註解)有孜崇權版(日/月/年) | | | | | | | | 分目分析 | | CS20251120E00306 | JPMorgan Chase & Co. | 1101(L) | 276,699(L | HKD 77.8447 | 29.186.437(L | 7.00(L)17/11/2025 | | | | | | | 3,026,358(S) | 0.72(S) | | | | | | | 23,665,415(P) | 5.68(P) | | 股份代號: | 005 ...

香港联交所最新资料显示，11月17日，摩根大通增持ASMPT(00522)27.6699万股，每股作价77.8447港 元，总金额约为2153.96万港元。增持后最新持股数目约为2918.64万股，最新持股比例为7%。 ...

智通财经APP获悉，香港联交所最新资料显示，11月17日，摩根大通增持ASMPT(00522)27.6699万股， 每股作价77.8447港元，总金额约为2153.96万港元。增持后最新持股数目约为2918.64万股，最新持股比 例为7%。 ...

Core Viewpoint - ASMPT's Q3 revenue met expectations, benefiting from advanced packaging and mainstream business driven by AI technology [1] Financial Performance - Gross margin was 35.7%, influenced by product mix [1] - Net loss was 269 million yuan, primarily due to the liquidation of the Shenzhen factory; adjusted profit for the quarter was 102 million yuan after excluding restructuring costs and inventory write-offs [1] Future Outlook - Revenue forecast for 2025 was reduced by 5% to 13.56 billion yuan, and net profit forecast was cut by 75% to 250 million yuan due to order cancellations and the restructuring of the Shenzhen factory, which has been completed [1] - 2026 profit forecast remains unchanged [1] - The rating of "outperforming the industry" is maintained, supported by market optimism regarding the company's AP business and an upward adjustment of the market valuation center [1] - Target price increased by 25% to 90 HKD [1]

Core Insights - ASMPT reported third-quarter results that met expectations, driven by advanced packaging and mainstream business benefiting from AI technology [1] - The gross margin was 35.7%, influenced by the product mix [1] - The net loss was 269 million yuan, primarily due to the impact of the Shenzhen factory liquidation; adjusted profit for the quarter was 102 million yuan after excluding restructuring costs and inventory write-offs [1] Financial Performance - Third-quarter new orders totaled 463 million USD, with a cancellation from a high-density substrate manufacturer affecting the original order total of 487 million USD [1] - Revenue for the third quarter met expectations, but profit fell short of the bank's forecasts [1] - Revenue forecast for 2025 was reduced by 5% to 13.56 billion yuan, and net profit forecast was cut by 75% to 250 million yuan; 2026 profit forecast remains unchanged [1] Market Outlook - The company maintains a "outperform" rating due to positive market sentiment towards its AP business and an upward shift in market valuation [1] - Target price was raised by 25% to 90 HKD [1]

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 | 截至月份: | 2025年10月31日 | | | | 狀態: 新提交 | | --- | --- | --- | --- | --- | --- | | 致：香港交易及結算所有限公司 | | | | | | | 公司名稱: | ASMPT Limited | | | | | | 呈交日期: | 2025年11月3日 | | | | | | I. 法定/註冊股本變動 | | | | | | | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | 於香港聯交所上市 (註1) | 是 | | 證券代號 (如上市) | 00522 | 說明 | | | | | | 法定/註冊股份數目 | | 面值 | | | 法定/註冊股本 | | | --- | --- | --- | --- | --- | --- | --- | --- | | 上月底結存 | | 500,000,000 HKD | | 0.1 | HKD | | 50,000,000 | | 增加 / 減少 (-) | | | | | HKD | | | | 本月底結 ...

Core Insights - ASMPT reported 3Q25 revenue of HKD 36.61 billion (USD 4.68 billion), a year-on-year increase of 9.5% and a quarter-on-quarter increase of 7.6%, aligning with expectations, primarily benefiting from AI-driven advanced packaging and mainstream businesses [1] - The gross margin was 35.7%, down 5.32 percentage points year-on-year and 4.05 percentage points quarter-on-quarter, mainly due to product mix effects [1] - The net loss was HKD 2.69 billion, significantly impacted by the Shenzhen factory liquidation; adjusted profit for the quarter was HKD 1.02 billion after excluding restructuring costs and inventory write-offs [1] Revenue and Orders - In 3Q25, semiconductor business revenue was USD 2.40 billion, down 6.5% quarter-on-quarter but up 5.0% year-on-year, with new orders of USD 2.08 billion, down 1.7% quarter-on-quarter and down 12.4% year-on-year [1] - SMT business secured USD 2.55 billion in orders, down 5.0% quarter-on-quarter but up 51.8% year-on-year, driven by advanced packaging demand and electric vehicle demand in China [1] Future Guidance and Developments - The company guided for 4Q25 revenue between USD 4.7 billion and USD 5.3 billion, with a midpoint indicating a year-on-year increase of 14.3% and a quarter-on-quarter increase of 6.8% [1] - Continuous development of new products in advanced packaging, including TCB solutions for 12-layer fourth-generation high-bandwidth memory, has received multiple HBM orders [2] - The company’s C2W ultra-fine pitch TCB plasma active removal solution has passed quality and reliability certification from leading wafer foundry clients and is ready for mass production [2] Profit Forecast and Valuation - Due to one-time order cancellations and the Shenzhen factory restructuring, the company has lowered its 2025 revenue forecast by 5% to HKD 135.60 billion and net profit forecast by 75% to HKD 2.5 billion, while maintaining the 2026 profit forecast [2] - The current stock price corresponds to a 22x 2026e P/E ratio, with a maintained outperform rating and a target price increase of 25% to HKD 90, reflecting a 24x 2026e P/E ratio and a 10% upside potential [2]

ASMPT (0522.HK) Conference Call Summary Company Overview - ASMPT is the world's largest assembly and packaging equipment supplier for the semiconductor and LED industries, serving chip manufacturers and consumer electronics manufacturers [19][20]. Key Industry Insights - The semiconductor industry is experiencing a recovery, particularly driven by increasing investments in AI technology [1][4]. - The Total Addressable Market (TAM) for TCB (Through Silicon Via) is expected to exceed US$1 billion by 2027, fueled by robust global AI infrastructure investments [3]. Financial Performance - **3Q25 Results**: - Adjusted Gross Profit Margin (GPM) decreased by 2 percentage points quarter-over-quarter to 37.7% due to a shift in product mix towards more wire bonders [2]. - Adjusted profit was HK$102 million, significantly below market expectations of HK$201 million [2]. - **4Q25 Guidance**: - Revenue guidance is set between US$470-530 million (HK$3.7-4.1 billion), which is above consensus estimates [2]. - Bookings are expected to remain flat quarter-over-quarter, with mid-teens percentage growth in SEMI bookings [2]. Growth Opportunities - **TCB and HB Potential**: - Significant orders for C2S TCB are anticipated to contribute to revenue in early 2026 [3]. - C2W TCB revenue is expected to commence at a leading foundry, indicating strong demand [3]. - The company is collaborating with logic and memory makers on Gen 2 HB, which presents future growth potential [3]. - **Traditional Business Recovery**: - The traditional side of the business is showing signs of recovery, particularly in mainstream SEMI and SMT, driven by AI-related applications and demand recovery in China [4]. Valuation and Investment Strategy - The target price has been raised to HK$100 from HK$85, reflecting an industry re-rating based on expanding AI opportunities [5][21]. - The expected share price return is 19.3%, with a total expected return of 21.8% including dividends [7]. Earnings Summary - **Projected Earnings**: - 2025E: Net Profit of HK$155 million, EPS of HK$0.37, with a significant decline from previous years [6]. - 2026E: Expected recovery with net profit projected at HK$1,475 million and EPS of HK$3.53, indicating an 847.2% growth [6]. - 2027E: Further growth anticipated with net profit of HK$1,995 million and EPS of HK$4.78 [6]. Risks - Potential risks include a slowdown in AI infrastructure investment, loss of TCB market share, reduced demand due to alternative technologies, and intensifying industry competition [22]. Conclusion - ASMPT is positioned to benefit from the recovery in the semiconductor industry, particularly through AI-driven advanced packaging solutions. The company’s strategic focus on TCB and HB technologies, along with a recovering traditional business, supports a positive outlook for future earnings growth and share price appreciation [20][21].

Summary of Conference Call Company and Industry - The conference call pertains to a semiconductor company specializing in advanced packaging technologies, particularly in the fields of high bandwidth memory (HBM) and semiconductor solutions. Key Points and Arguments 1. **Strong Growth Momentum**: The company reported strong growth in Q3 2025, driven by advancements in advanced packaging and mainstream business, particularly in the HBM sector and AI infrastructure demand [2][6][12]. 2. **Technological Leadership**: The company maintains a leading position in advanced logic and HBM markets, leveraging proprietary technologies such as Thermal Compression Bonding (TCB) and Fluxus for superior scalability and cost efficiency [2][3][12]. 3. **Market Demand**: Significant demand is noted from AI infrastructure, data centers, and electric vehicles in China, contributing to high capacity utilization across production lines [2][5]. 4. **Financial Performance**: The company achieved revenues of $468 million in Q3 2025, a 7.6% increase quarter-over-quarter and a 9.5% increase year-over-year, primarily due to SMT business growth [6][12]. 5. **Order Trends**: The company recorded $462.5 million in orders, with a strong order-to-shipment ratio of 1.04, indicating sustained demand despite a one-time order cancellation from a major customer [6][7]. 6. **Profit Margins**: Adjusted gross margin for Q3 was 37.7%, lower than usual due to the high proportion of SMT business and lower semiconductor margins, but year-to-date margins remain around 40% [7][8]. 7. **Future Guidance**: The company expects Q4 2025 revenues to range between $470 million and $530 million, supported by semiconductor and SMT business growth, with a potential for TCB revenues to exceed $1 billion by 2027 [12][23]. 8. **Operational Efficiency**: The company is optimizing its global supply chain through strategic restructuring, which is expected to enhance cost efficiency and competitiveness [5][28]. Other Important but Overlooked Content 1. **Impact of AI**: The company is experiencing a complex relationship with AI demand, which is driving growth but is difficult to quantify in terms of revenue contribution [66][68]. 2. **Market Dynamics**: The company acknowledges the ongoing uncertainties in the market, particularly regarding tariff impacts, but remains confident in its global positioning and flexibility to adapt [12][42]. 3. **Future Orders and Technology Transition**: The transition to higher performance computing and the adoption of new technologies like Fluxus are seen as critical for future growth, with expectations for significant orders in 2026 [30][32][63]. 4. **Customer Relationships**: The company is actively engaging with leading customers to address their pain points and enhance its competitive positioning in the market [51][52]. This summary encapsulates the key insights from the conference call, highlighting the company's performance, market dynamics, and future outlook in the semiconductor industry.