评估将考虑SMT解决方案分部的一系列选项，可能包括但不限于出售、合营、分拆及上市，或保留并 支持SMT解决方案分部的战略发展以确保其长期成功及价值创造。 作为全球市场及技术领导者，SMT解决方案分部结合深度工艺技术、创新科技、行业领先硬件、软件 及服务解决方案。其独特的产品组合为汽车、工业、消费电子及半导体终端市场的电子制造及关键应用 提供集成解决方案，涵盖从高混合╱低产量至高速量产及先进封装技术。 格隆汇1月21日丨ASMPT(00522.HK)宣布，其正就其表面贴装技术("SMT")解决方案分部启动策略方案 评估("评估")。评估乃公司转型历程的一部分，亦体现其持续致力于保障所有持份者(包括员工、客户及 供应商)利益的同时，为股东实现价值最大化。 评估旨在识别最有利于支持SMT解决方案分部长期增长及成功的潜在机遇，同时使公司可聚焦于日益 增长的半导体("SEMI")解决方案分部。 SMT解决方案分部的产品组合包括高精度DEK印刷机以及强大的SIPLACE贴片平台，该平台最近由获 全新设计的创新SIPLACEV平台辅助。该解决方案组合辅以一整套全面的软件解决方案，覆盖从机器及 生产线级别至工厂及企业级别。该 ...

评估将考虑 SMT 解决方案分部的一系列选项，可能包括但不限于出售、合营、分拆及上市，或保留并 支持 SMT 解决方案分部的战略发展以确保其长期成功及价值创造。 作为全球市场及技术领导者，SMT 解决方案分部结合深度工艺技术、创新科技、行业领先硬件、软件 及服务解决方案。其独特的产品组合为汽车、工业、消费电子及半导体终端市场的电子制造及关键应用 提供集成解决方案，涵盖从高混合╱低产量至高速量产及先进封装技术。 SMT 解决方案分部的产品组合包括高精度 DEK 印刷机以及强大的 SIPLACE 贴片平台，该平台最近由 获全新设计的创新 SIPLACE V 平台辅助。该解决方案组合辅以一整套全面的软件解决方案，覆盖从机 器及生产线级别至工厂及企业级别。该分部的制造执行系统(MES)为一个模组化、可扩展且支援云端的 平台，能与企业系统及工厂自动化解决方案无缝集成。 智通财经APP讯，ASMPT(00522)发布公告，其正就其表面贴装技术(SMT)解决方案分部启动策略方案 评估。评估乃本公司转型历程的一部分，亦体现其持续致力于保障所有持份者(包括员工、客户及供应 商)利益的同时，为股东实现价值最大化。 评估旨在识别最 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對 其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份 內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 ASMPT LIMITED （於開曼群島註冊成立之有限公司） （股份代號：0522） 新聞稿 ASMPT宣布SMT解決方案分部之 策略方案評估 題為《ASMPT宣布SMT解決方案分部之策略方案評估》的新聞稿附載於本公告。 承董事會命 董事 黃梓达 香港，二零二六年一月二十一日 於本公告日期，本公司董事會成員包括獨立非執行董事：樂錦壯先生（主席）、 張仰學先生、蕭潔雲女士及許明明女士；非執行董事： Hichem M'Saad 博士及 Paulus Antonius Henricus Verhagen 先生；執行董事：黃梓达先生及 Guenter Walter Lauber 先生。 （本公告之中英文版本如有任何歧義，概以英文版本為準。） ASMPT宣布SMT解決方案分部之策略方案評估 （二零二六年一月二十一日，新加坡訊）— ASMPT（香港交易所股份代號：0522），一間 全球領先之半導體和電子產品製造的集 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對 其準確性或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份 內容而產生或因倚賴該等內容而引致的任何損失承擔任何責任。 ASMPT LIMITED 策略方案評估 ASMPT Limited（「ASMPT」或「本公司」）謹此宣布，其正就其表面貼裝技術 （「SMT」）解決方案分部啟動策略方案評估（「評估」）。評估乃本公司轉型歷程 之一部分，亦體現其持續致力於保障所有持份者（包括員工、客戶及供應商）利益之 同時，為股東實現價值最大化。 評估旨在識別最有利於支持 SMT 解決方案分部長期增長及成功之潛在機遇，同時使本 公司可聚焦於日益增長之半導體（「SEMI」）解決方案分部。 評估將考慮 SMT 解決方案分部之一系列選項，可能包括但不限於出售、合營、分拆及 上市，或保留並支持 SMT 解決方案分部之戰略發展以確保其長期成功及價值創造。 作為全球市場及技術領導者，SMT 解決方案分部結合深度工藝技術、創新科技、行業 領先硬件、軟件及服務解決方案。其獨特之產品組合為汽車、工業、消費電子及半導 體終端市場之電子製造及關鍵應用提供集成解 ...

Core Viewpoint - The semiconductor industry is experiencing growth driven by AI computing power and storage demand, with expectations for a strong expansion cycle in domestic semiconductor equipment by 2026, leading to significant order growth in the sector [1] Group 1: Industry Insights - The global semiconductor industry is heating up due to dual drivers of AI computing power and storage demand [1] - Dongwu Securities predicts that the domestic semiconductor equipment sector will enter a strong expansion cycle by 2026, with order growth in the semiconductor equipment industry expected to exceed 30%, potentially reaching over 50% [1] - The high prosperity of the industry is supported by clear expectations for future growth [1] Group 2: Company Performance - Financial reports indicate that ASMPT has seen a continuous year-on-year increase in new orders for six consecutive quarters [1] - The resurgence in demand for AI servers and domestic market needs is driving the recovery of Surface Mount Technology (SMT) [1] - The company is entering a new upward cycle with the expansion of High Bandwidth Memory (HBM), supported by improvements in advanced packaging, SMT structure, and cost optimization, leading to a turning point in gross margin and profitability [1] - The performance elasticity of ASMPT is expected to be significant from 2025 to 2027, with a positive outlook on the company's market share growth in China [1]

Core Viewpoint - ASMPT's stock price increased by 4.28% to HKD 93.9, with a trading volume of HKD 179 million, driven by the rising demand in the global semiconductor industry due to AI computing power and storage needs [1] Industry Summary - The global semiconductor industry is experiencing growth, with East Wu Securities predicting a strong expansion cycle for domestic semiconductor equipment starting in 2026, with order growth in the semiconductor equipment sector expected to exceed 30%, potentially reaching over 50% [1] - The semiconductor industry is characterized by high prosperity, supported by clear expectations for future growth [1] Company Summary - ASMPT has seen a continuous year-on-year increase in new orders for six consecutive quarters, driven by the synergy between AI server demand and domestic market needs, leading to a recovery in Surface Mount Technology (SMT) [1] - The company is entering a new upward cycle with the expansion of High Bandwidth Memory (HBM), and improvements in advanced packaging, SMT structure, and cost optimization are contributing to a turning point in gross margin and profitability [1] - Financial projections indicate significant earnings elasticity for ASMPT from 2025 to 2027, with a positive outlook on the company's market share growth in China [1]

Group 1 - The core viewpoint of the article highlights that the company is positioned to benefit significantly from the growing demand for advanced packaging equipment driven by global AI and HPC trends, with a complete equipment matrix covering key processes [1] - The company holds the largest global market share in TCB and has successfully upgraded and mass-produced HB equipment, indicating strong competitive positioning in the advanced packaging sector [1] - The company has seen a continuous increase in new orders for six consecutive quarters, driven by the resonance of AI server demand and domestic market recovery, suggesting a positive outlook for revenue growth [1] Group 2 - The company is expected to experience a significant increase in advanced packaging revenue and global market share due to structural expansion in the industry, particularly with the ramp-up of HBM production and ongoing equipment procurement cycles [1] - The improvement in profit margins is attributed to a higher proportion of high-margin products, structural enhancements in SMT, and cost optimization, indicating a turning point in profitability [1] - The geopolitical landscape and domestic substitution trends are expected to enhance the company's market share in China, as it is the only packaging equipment manufacturer capable of supplying ECD, benefiting from local supply chain policies [1] Group 3 - The company is projected to achieve revenue of HKD 141.14 billion, 165.73 billion, and 189.05 billion for the years 2025-2027, representing year-on-year growth rates of 6.69%, 17.42%, and 14.07% respectively [2] - The expected net profit for the same period is HKD 4.19 billion, 11.13 billion, and 17.15 billion, with corresponding PE ratios of 85, 32, and 21 times, indicating a clear growth trajectory [2] - The investment recommendation is to "overweight" the stock based on the company's long-term growth logic, order recovery, and profit structure improvement [2]

Investment Rating - The report assigns an "Accumulate" rating for the company, marking its first coverage [2]. Core Insights - The company is positioned to benefit from the accelerating domestic semiconductor equipment replacement and improved order visibility driven by advanced packaging technology [1]. - The company has a comprehensive equipment matrix in advanced packaging, with a leading market share in TCB (Thermal Compression Bonding) and has upgraded its HB (Hybrid Bonding) equipment for mass production [8]. - The company is expected to see significant revenue growth from 2025 to 2027, with projected revenues of HKD 141.14 billion, HKD 165.73 billion, and HKD 189.05 billion, respectively, reflecting year-on-year growth rates of 6.69%, 17.42%, and 14.07% [8]. Summary by Sections 1. Market Performance - The company has experienced a significant market performance shift, with a 44% increase compared to the previous year, while the semiconductor index has shown varied performance [4]. 2. Profit Forecast - The company’s revenue is projected to decline by 24.10% in 2023, followed by a gradual recovery with expected growth rates of 6.69%, 17.42%, and 14.07% from 2025 to 2027 [7]. - The net profit is forecasted to recover from a low of HKD 345 million in 2024 to HKD 1.715 billion by 2027, indicating a strong rebound in profitability [7]. 3. Valuation Recovery - The company is expected to benefit from the long-term trend of advanced packaging, with a clear growth logic supported by order recovery and improved profit structure [8]. - The company’s TCB market share is projected to reach 35%-40% by 2027, with a total potential market exceeding USD 1 billion [66]. 4. Advanced Packaging Growth - The advanced packaging market is anticipated to surpass traditional packaging by 2025, driven by the increasing demand for AI and high-performance computing [36]. - The global advanced packaging market is expected to grow at a CAGR of approximately 10% until 2023, with significant contributions from government policies and diverse downstream demand [37]. 5. Geopolitical and Domestic Market Dynamics - The company is expected to gain market share in China due to the acceleration of domestic substitution and geopolitical factors, with a focus on local supply chain control [8]. - The company has established a strong local presence in China, with a significant portion of its revenue derived from the region, indicating a strategic advantage in the domestic market [35].

Core Viewpoint - ASMPT's stock rose over 6%, reaching HKD 90.8, with a trading volume of HKD 240 million, indicating positive market sentiment towards the company and the semiconductor industry driven by a storage supercycle [1] Industry Summary - Huatai Securities is optimistic about the semiconductor industry's accelerated growth due to a storage supercycle, predicting a 39.4% year-on-year increase in the global storage market by 2026, surpassing the 27.8% growth rate of 2025 [1] - TrendForce forecasts a 26% increase in DRAM Bit demand and a 21% increase in NAND Bit demand for 2026, compared to 22% and 15% in 2025 respectively [1] - Key growth drivers in the industry include HBM4 for GPUs in the Rubin series and eSSD for AI inference [1] Company Summary - SK Hynix has placed an order with ASMPT for new thermal compression bonding machines (TCB) to support HBM4 production, with plans to order 100 additional machines by March 2026 to align with the expansion of its Cheongju M15X wafer fab [1] - The competition for orders among ASMPT, Hanmi Semiconductor, and Hanwha is expected to intensify, but if Korean manufacturers cannot resolve patent disputes quickly, ASMPT may further increase its market share and potentially dominate HBM4 equipment supply [1]

Core Viewpoint - ASMPT's stock rose over 6%, reaching HKD 90.8, with a trading volume of HKD 240 million, indicating strong market interest in the company [1] Group 1: Market Growth Projections - Huatai Securities is optimistic about the storage supercycle driving accelerated growth in the semiconductor industry [1] - According to WSTS forecasts, the global storage market is expected to grow by 39.4% year-on-year in 2026, surpassing the 27.8% growth rate of 2025 [1] - TrendForce predicts a 26% increase in DRAM Bit demand and a 21% increase in NAND Bit demand in 2026, compared to 22% and 15% in 2025 respectively [1] Group 2: Key Growth Drivers - The main growth points in the industry include HBM4 for GPU applications and eSSD for AI inference [1] - Reports from mid-December indicated that SK Hynix ordered a batch of new thermal compression bonding machines (TCB) from ASMPT to support HBM4 production [1] - SK Hynix plans to order an additional 100 HBM4 TCBs by March 2026 to align with the expansion of its Cheongju M15X wafer fab, leading to increased competition for orders among ASMPT, Hanmi, and Hanwha [1] Group 3: Competitive Landscape - If Korean manufacturers cannot resolve patent disputes quickly, ASMPT may further expand its market share and potentially dominate the supply of HBM4 equipment [1]