来源：滚动播报 纳斯达克公司宣布纳斯达克100指数成份股调整将于12月22日生效。6家公司即将被纳入纳斯达克100指 数。分别是艾尼拉姆制药公司、费罗维亚集团、英斯梅德公司、单片电源系统公司、希捷科技控股有限 公司和西部数据公司。而有6家被移出，百健公司（Biogen）CDW公司、格芯公司、露露乐蒙、安森美 半导体和交易台公司（The Trade Desk）。 ...

Dec. 12, 2025 产业洞察 根据TrendForce集邦咨询最新调查，2025年第三季全球晶圆代工产业持续受AI高效能运算(HPC)，和消费性电子新品主芯片与周边IC需求带动，以7nm(含) 以下先进制程生产的高价晶圆贡献营收最为显著，加上部分厂商得益于供应链分化商机，推升前十大晶圆代工厂第三季合计营收季增8.1%，接近451亿美 元。 TrendForce集邦咨询表示，由于预期2026年景气与需求将受国际形势影响，同时2025年中以来存储器逐季涨价、产能吃紧，供应链对2026年主流终端应用 需求转趋保守，即便车用、工控将于2025年底重启备货，预估第四季晶圆代工产能利用率成长动能将受限，前十大厂合计产值季增幅可能明显收敛。 | Ranking | Company | | Revenue | | Market Share | | | --- | --- | --- | --- | --- | --- | --- | | | | 3Q25 | 2Q25 | QoQ | 3Q25 | 2Q25 | | I | 台积电(TSMC) | 33,063 | 30,239 | 9.30% | 71.00% | ...

Siemens and GlobalFoundries (GF) have announced a new partnership to integrate AI-driven technologies into semiconductor manufacturing, targeting increased efficiency and reliability across production processes. The collaboration, formalised through a memorandum of understanding (MoU), spans areas such as fab automation, electrification, and the deployment of digital solutions throughout the semiconductor lifecycle. The companies will focus on implementing advanced AI-enabled software, sensors, and real ...

欧盟执委会周四表示，已批准德国政府向格罗方德、X-FAB提供 6.23 亿欧元（7.2916 亿美元）的援 助，用于支持在德国新建两家半导体制造厂。 欧盟执委会周四表示，已批准德国政府向格罗方德、X-FAB提供 6.23 亿欧元（7.2916 亿美元）的援 助，用于支持在德国新建两家半导体制造厂。 援助包括两笔赠款，价值分别为 4.95 亿欧元和 1.28 亿欧元。 较大一笔赠款将提供给 GlobalFoundries 公司，这是一家专门为其他公司制造半导体设备的半导体代工 厂。第二笔资助将提供给 X-FAB，用于支持在其位于德国埃尔福特的现有厂址上建设一个新的开放式 代工厂。 欧盟执委会在一份声明中说，这些措施促进了欧洲经济活动的发展，这些设施将是首创的。委员会还补 充说，这些措施将对欧洲半导体生态系统产生更广泛的积极影响。 责任编辑：刘明亮 援助包括两笔赠款，价值分别为 4.95 亿欧元和 1.28 亿欧元。 较大一笔赠款将提供给 GlobalFoundries 公司，这是一家专门为其他公司制造半导体设备的半导体代工 厂。第二笔资助将提供给 X-FAB，用于支持在其位于德国埃尔福特的现有厂址上建设一个新的 ...

GlobalFoundries on Wednesday appointed Sam Franklin as its chief financial officer, succeeding David Reeder, who stepped down earlier this year. ...

Franklin’s proven financial leadership and strategic expertise will support GF’s continued growth and profitabilityMALTA, N.Y., Dec. 10, 2025 (GLOBE NEWSWIRE) -- GlobalFoundries (GF) today announced that its Board of Directors has appointed Sam Franklin as Chief Financial Officer, effective immediately. Mr. Franklin previously served as Senior Vice President of Business Finance & Operations and Investor Relations and recently Interim CFO. “We are delighted to have Sam formally appointed as CFO,” said Tim Br ...

Core Thesis - GLOBALFOUNDRIES Inc. (GFS) is positioned as a key player in the U.S. semiconductor industry, particularly in the context of national security and self-sufficiency efforts [2][4] Company Positioning - GFS has inherited its "trusted foundry" status from IBM, making it one of the few Department of Defense-designated suppliers for secure chips in critical applications [2][3] - The company has a diverse manufacturing footprint that includes radio frequency, power management, and automotive semiconductors, which are essential for defense and infrastructure [3] Financial Backing and Contracts - GFS has received over $1.5 billion in funding from the CHIPS Act and government-backed loans to expand its U.S. manufacturing capabilities [3] - The company has secured long-term contracts with government and industrial clients, ensuring stable cash flow and high visibility in its operations [3][4] Competitive Advantage - GFS is executing its operational strategy effectively, contrasting with competitors like Intel, which are still in the process of scaling their operations [4] - The company's alignment with U.S. semiconductor industrial policy emphasizes its role in providing secure and reliable domestic semiconductor production [4]

Core Viewpoint - CPO (Co-Packaged Optics) technology is set to revolutionize the external bandwidth of AI data centers, significantly enhancing data transmission speeds and reducing power consumption, marking a shift in computational infrastructure [1][3]. Industry Trends - The silicon photonics industry is on the brink of explosive growth, with over 150 companies forming a diverse ecosystem from upstream SOI/Epi-wafer to downstream cloud computing and AI factories [1][3]. - The competition among foundries is intensifying, with significant investments in silicon photonics capacity and technology, as companies race to establish themselves in the CPO market [3][4]. Foundry Dynamics - Foundries are crucial in transitioning silicon photonics from design to large-scale production, focusing on integrated manufacturing capabilities that combine photonic and electronic components [4][5]. - Samsung is aggressively investing in silicon photonics to challenge TSMC's dominance, positioning CPO technology as a key competitive advantage in the advanced packaging market [5][6]. Strategic Acquisitions - GlobalFoundries' acquisition of Advanced Micro Foundry (AMF) aims to solidify its leadership in silicon photonics, enhancing its manufacturing capabilities and supply chain reliability [7]. - Tower Semiconductor is expanding its production capacity significantly, driven by the surging demand for silicon photonics, with a focus on providing comprehensive delivery packages [8]. Design Services and Integration - Companies like Broadcom are transforming silicon photonics into platform businesses, integrating optical engines directly into their networking solutions to facilitate scalable deployment [12][13]. - Marvell's acquisition of Celestial AI is a strategic move to enhance its optical interconnect capabilities, aiming to provide a comprehensive connectivity platform for AI infrastructure [17][19]. XPU Manufacturers' Role - XPU manufacturers, particularly NVIDIA, are pivotal in driving the commercialization of CPO technology, with NVIDIA's CPO solutions expected to generate significant revenue by 2026 [21][22]. - AMD is also positioning itself in the silicon photonics space through strategic acquisitions and partnerships, focusing on AI interconnect needs [23]. Intel's Foundation - Intel has established itself as a foundational player in the silicon photonics ecosystem, having commercialized the technology early and built a robust supply chain [24][25]. Conclusion - The competition in the "optical chip" space is not just about manufacturing capacity but also about reshaping the interconnect architecture for AI data centers, with CPO technology expected to be fully commercialized by 2027 [26].

Core Points - The meeting on December 3 involved a delegation of Chinese entrepreneurs led by Ren Hongbin, President of the China Council for the Promotion of International Trade, discussing cooperation in the semiconductor sector with the U.S. Semiconductor Industry Association [1] - Key topics included enhancing cooperation in the semiconductor field, deepening multilateral collaboration, and maintaining stability in global industrial and supply chains [1] Group 1 - The meeting featured participation from key figures such as the President and CEO of the U.S. Semiconductor Industry Association, John Neuffer, and representatives from major companies including Qualcomm, GlobalFoundries, ON Semiconductor, Nokia, Synopsys, and Emerson [1] - The dialogue aimed to address the importance of collaboration between China and the U.S. in the semiconductor industry, which is critical for both nations' technological advancements and economic stability [1]

Presentation[Operator Instructions] As a reminder, today's program is being recorded. And now I'd like to introduce your host for today's program, Eric Chow, Investor Relations. Please go ahead, sir.Thank you for standing by. Welcome to the GlobalFoundries Business Webinar Series, Enabling AI in the Physical World.Eric ChowDirector of Investor Relations Thank you, operator. Good morning, everyone, and welcome to GlobalFoundries' Inaugural Business and Strategy Webinar. Today, we will be providing a market, ...