Core Insights - Tower Semiconductor announced the launch of its 2025 Global Technology Symposium (TGS), which will take place in Shanghai, China on September 16, 2025, and in Santa Clara, California, USA on November 18, 2025. The symposium will focus on key market trends in AI, high-speed interconnects, and other rapidly evolving fields [1]. Event Highlights - The TGS will showcase Tower's capabilities in enabling high-performance interconnects, energy-efficient architectures, and advanced imaging solutions, emphasizing how its technology and design services can accelerate product development and create measurable market value [1]. - Registration for the TGS in China is now open, allowing participants to engage with industry leaders and experts [3][7]. Agenda Overview - The agenda includes a keynote speech by Tower's CEO Russell Ellwanger, who will share the company's future vision and commitment to driving customer business growth through collaboration [4]. - Expert-led technical discussions will cover Tower's industry-leading solutions in silicon photonics, silicon germanium, RF SOI, power management, image sensors, and advanced display technologies [4][6]. - The event will feature insights from global technology leaders on AI innovations and breakthroughs in optical communications [4]. Networking Opportunities - Attendees will have the chance to interact with Tower executives, industry experts, and peers, fostering collaboration for the next wave of semiconductor innovations [4].

Market Overview - The main board saw significant gains with notable stocks such as Yuyin Co. (+10.07%), Times Publishing (+10.02%), and Hengbao Co. (+10.00%) leading the charge [1] - The ChiNext board also performed well, highlighted by Xiongdi Technology (+13.22%) and Shangluo Electronics (+12.74%) [1] - The Sci-Tech Innovation board was led by Lais Information (+4.55%) and Gai Lun Electronics (+4.25%) [1] - The SW Education Publishing sector showed a slight increase of 0.64% [1] Domestic News - TSMC's subsidiary, Caiyu, is aggressively developing super-surface technology to enter the AR glasses market, aiming to expand its consumer product offerings and explore silicon photonics opportunities [1] - Unisoc launched a fully domestically produced enterprise-level PCIe 5.0 SSD, the Unisoc Flash E5200, featuring domestic main control chips and 3D TLC storage particles [1] - UMC announced its collaboration with Intel on a 12nm process, which is a key development plan expected to achieve mass production by 2027 [1] - ASE introduced a new chip-on-wafer bridge technology utilizing TSV to enhance I/O density and thermal performance, addressing increasing bandwidth demands [1] Company Announcements - Kangxi Communication reported a reduction in shareholding by a major shareholder, Pan Bin, who decreased his stake to below 5% by selling 2,293,073 shares [3] - Airong Software announced a cash dividend distribution of 1.50 yuan per 10 shares, totaling 31,332,495 yuan [3] - Huashi Technology received five invention patents for its independently developed products, with a patent term of 20 years [3] - Runze Technology disclosed a reduction in shareholding by major shareholders, who sold 2,457,300 shares, representing 0.1427% of the total share capital [3] Overseas News - New思科技 reported receiving a letter from the U.S. Department of Commerce regarding new export restrictions to China, prohibiting sales and access to certain services [4] - DRAMeXchange reported a significant increase in the average trading price of PC DRAM products, which rose by 27.27% in May [4] - TrendForce indicated that NAND Flash suppliers faced a 15% decline in average selling prices in Q1 2025, with total revenue for the top five brands dropping nearly 24% [4] - AMD plans to launch a new AI chip tailored for the Chinese market, based on the RDNA4 architecture, following Nvidia's similar move [4]