德银认为，内存短缺、AI挤压主流组件、光电子加速渗透、先进封测升级、800V电源架构改革及边缘AI回归增长，将成为2026年欧洲科技硬件行业的六 大核心主题。DRAM与NAND价格暴涨并将持续上涨至2027年，AI需求推高测试与封测投入，数据中心光子技术加速普及，800V架构重塑功率器件格 局，边缘AI轻量化应用开启新一轮增长周期。 德银在12月10日发布的2026年欧洲科技硬件行业报告中认为，2026年科技硬件将由六大主题主导： 内存短缺、AI挤压主流组件、光电子加速渗透、先 进封测升级、800V电源架构改革及边缘AI回归增长。 市场正经历剧烈的价格波动，内存短缺已从单纯的组件风险升级为宏观层面的关切。据追风交易台消息，德银分析师Robert Sanders团队在研报中表 示， 过去三个月，DRAM现货价格暴涨300-400%，NAND闪存同步大涨200%，且涨势正向合约价快速传导。 与此同时，AI 支出持续挤占主流电子组件供应，光电子、先进封测、800V 电源架构等技术赛道加速爆发，边缘 AI 已在多个领域形成落地态势。多重 变量正重构行业竞争格局。 这些趋势将直接影响消费电子、智能手机、数据中心等关键终 ...

Core Viewpoint - The article discusses the growing application of silicon photonics technology as a potential replacement for copper wire in data transmission, particularly in data centers, while highlighting the current limitations and future prospects of this technology [1][2]. Group 1: Current State of Transmission Technologies - Currently, silicon photonics is primarily used for long-distance transmission in data centers, while copper wire is still dominant for medium and short distances due to its high speed of up to 200 Gbit per second [1][2]. - The advancements in copper wire technology have exceeded initial expectations, achieving speeds of 200 Gbit per second, which matches the current capabilities of silicon photonics [1][2]. Group 2: Advantages and Future Developments of Silicon Photonics - Silicon photonics has the potential for significant cost reductions and efficiency improvements in the future, especially as technology advances [2]. - Future developments aim to integrate optical engines directly with switch chips on the same substrate, potentially allowing for transmission speeds of up to 400 Gbit per second per fiber [2]. - The integration of multiple optical engines could lead to a total transmission capacity of 25.6 terabits per second, significantly enhancing data transfer capabilities [2]. Group 3: Challenges and Market Dynamics - Despite the advantages of silicon photonics, challenges remain in terms of production costs and the complexity of integrating optical components, which currently limits its market share compared to copper wire [2]. - The co-packaged optics (CPO) industry is highlighted as a part of the silicon photonics manufacturing process, with many Taiwanese manufacturers focusing on contract manufacturing and backend processes [2]. Group 4: Industry Context and Demand - The demand for data transmission is rapidly increasing, driven by the explosion of generative AI and the need for higher computational power, which exposes the limitations of traditional copper wire [5][6]. - Data centers are projected to consume vast amounts of electricity, with the energy demands potentially increasing twentyfold, underscoring the need for more efficient transmission technologies [6].

Core Viewpoint - Tower Semiconductor announces the launch of the 2025 Global Technology Symposium (TGS), focusing on key market trends in AI, high-speed interconnects, and other rapidly evolving fields, showcasing its capabilities in high-performance interconnects, energy-efficient architectures, and advanced imaging solutions [1]. Event Highlights - The TGS will take place in Shanghai, China on September 16, 2025, and in Santa Clara, California, USA on November 18, 2025 [1]. - Registration for the TGS in China is now open [1][3]. Agenda Overview - The event will feature a keynote speech by Tower's CEO, Russell Ellwanger, discussing the company's future vision and commitment to driving customer business growth through collaboration [4]. - Expert-led technical discussions will focus on Tower's industry-leading solutions in silicon photonics, silicon germanium, RF SOI, power management, image sensors, and advanced display technologies [4]. - A guest panel with global technology leaders will provide insights on AI innovations and breakthroughs in optical communications [4]. - Opportunities for networking with Tower executives, industry experts, and peers to foster collaboration for the next wave of semiconductor innovation [4]. Detailed Session Topics - Keynote by Russell Ellwanger [5]. - Invited talk by Eoptolink on AI high-speed interconnects [5]. - Discussion on market megatrends and Tower's technology solutions in RF mobile, infrastructure, power, and sensors [5]. - Presentation on Tower's design enablement services [6]. - Overview of power management technologies for system efficiency and integration [6]. - Insights into OLEDoS displays and next-generation image sensor technologies [6]. - Foundry technologies for high-speed data transfer applications, including Tower's silicon photonics and RF SOI technologies [6]. Venue Information - The event will be held at the Aloft Hotel in Zhangjiang, Shanghai [9].

Core Insights - Tower Semiconductor announced the launch of its 2025 Global Technology Symposium (TGS), which will take place in Shanghai, China on September 16, 2025, and in Santa Clara, California, USA on November 18, 2025. The symposium will focus on key market trends in AI, high-speed interconnects, and other rapidly evolving fields [1]. Event Highlights - The TGS will showcase Tower's capabilities in enabling high-performance interconnects, energy-efficient architectures, and advanced imaging solutions, emphasizing how its technology and design services can accelerate product development and create measurable market value [1]. - Registration for the TGS in China is now open, allowing participants to engage with industry leaders and experts [3][7]. Agenda Overview - The agenda includes a keynote speech by Tower's CEO Russell Ellwanger, who will share the company's future vision and commitment to driving customer business growth through collaboration [4]. - Expert-led technical discussions will cover Tower's industry-leading solutions in silicon photonics, silicon germanium, RF SOI, power management, image sensors, and advanced display technologies [4][6]. - The event will feature insights from global technology leaders on AI innovations and breakthroughs in optical communications [4]. Networking Opportunities - Attendees will have the chance to interact with Tower executives, industry experts, and peers, fostering collaboration for the next wave of semiconductor innovations [4].

Market Overview - The main board saw significant gains with notable stocks such as Yuyin Co. (+10.07%), Times Publishing (+10.02%), and Hengbao Co. (+10.00%) leading the charge [1] - The ChiNext board also performed well, highlighted by Xiongdi Technology (+13.22%) and Shangluo Electronics (+12.74%) [1] - The Sci-Tech Innovation board was led by Lais Information (+4.55%) and Gai Lun Electronics (+4.25%) [1] - The SW Education Publishing sector showed a slight increase of 0.64% [1] Domestic News - TSMC's subsidiary, Caiyu, is aggressively developing super-surface technology to enter the AR glasses market, aiming to expand its consumer product offerings and explore silicon photonics opportunities [1] - Unisoc launched a fully domestically produced enterprise-level PCIe 5.0 SSD, the Unisoc Flash E5200, featuring domestic main control chips and 3D TLC storage particles [1] - UMC announced its collaboration with Intel on a 12nm process, which is a key development plan expected to achieve mass production by 2027 [1] - ASE introduced a new chip-on-wafer bridge technology utilizing TSV to enhance I/O density and thermal performance, addressing increasing bandwidth demands [1] Company Announcements - Kangxi Communication reported a reduction in shareholding by a major shareholder, Pan Bin, who decreased his stake to below 5% by selling 2,293,073 shares [3] - Airong Software announced a cash dividend distribution of 1.50 yuan per 10 shares, totaling 31,332,495 yuan [3] - Huashi Technology received five invention patents for its independently developed products, with a patent term of 20 years [3] - Runze Technology disclosed a reduction in shareholding by major shareholders, who sold 2,457,300 shares, representing 0.1427% of the total share capital [3] Overseas News - New思科技 reported receiving a letter from the U.S. Department of Commerce regarding new export restrictions to China, prohibiting sales and access to certain services [4] - DRAMeXchange reported a significant increase in the average trading price of PC DRAM products, which rose by 27.27% in May [4] - TrendForce indicated that NAND Flash suppliers faced a 15% decline in average selling prices in Q1 2025, with total revenue for the top five brands dropping nearly 24% [4] - AMD plans to launch a new AI chip tailored for the Chinese market, based on the RDNA4 architecture, following Nvidia's similar move [4]