格芯首席执行官TIM Breen表示："公司第三季度业绩表现强劲，营收、毛利率、营业利润率和每股收益 均达到预期范围的高端。连续第四个季度，我们在汽车和通信基础设施以及数据中心终端市场均实现了 强劲的同比增长。随着我们持续优化产品组合并提升业务盈利能力，第三季度毛利率环比和同比增长均 有所提升。此外，我们在硅光子学和FDX平台等关键增长应用领域也看到了客户强劲的增长势头，这令 我们倍感鼓舞。" 周三，格芯(GFS.US)盘初涨超5%，报36.47美元。消息面上，尽管传统处理器的需求并不均衡，但格芯 第三季度业绩高于华尔街的预期。财报显示，该公司三季度营收达16.9亿美元，同比下降2.9%，超出预 期1000万美元;非GAAP每股收益为0.41美元，超出预期0.03美元。 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源 ：内容 编译自 yole 。 由于传统的基于处理器的架构面临物理限制，这项技术在满足数据中心需求（尤其是人工智能和机器 学习）方面发挥着至关重要的作用。硅光子学实现的高速通信对于支持更快的计算至关重要。不断增 长的带宽需求不仅推动了硅光子学的发展，也推动了薄膜铌酸锂的发展，从而提升了网络的数据容 量。 光子集成电路，尤其是绝缘体上硅 (SOI) 和绝缘体上铌酸锂 (LNOI)，为具有高容量可扩展性的应用 提供了多功能平台，尤其适用于数据中心，而中国企业正在成为该领域的新领导者。由于硅片性能稳 定，电信是另一个高容量应用领域。除此之外，光学激光雷达、3D 集成、量子计算、光学陀螺仪， 甚至医疗光子学都拥有巨大的潜力，尽管一些应用面临技术和监管挑战。硅光子学向可见光谱的扩展 有望在未来开启更多创新用途。 硅光子产业格局正在围绕多元化参与者形成：积极参与硅光子产业的主要垂直整合参与者（例如 Innolight、思科、Marvell、Broadcom、Coherent、Lumentum、Eoptolink）；初创公司 / 设计公 司 （ Xphor 、 DustP ...

Core Insights - Data centers are becoming the core engine driving global economic and social development, marking a new era in the semiconductor industry driven by AI, cloud computing, and large-scale infrastructure [1] - The demand for semiconductors in data centers is evolving from simple processors and memory to a complex ecosystem encompassing computing, storage, interconnect, and power supply [1] AI Surge: Arms Race in Data Centers - The explosion of artificial intelligence, particularly generative AI, is the most powerful catalyst for this transformation, with AI-related capital expenditures surpassing non-AI spending, accounting for nearly 75% of data center investments [3] - By 2025, AI-related investments are expected to exceed $450 billion, with AI servers rapidly increasing from a few percent of total computing servers in 2020 to over 10% by 2024 [3] - The global semiconductor market for data centers is projected to reach $493 billion by 2030, with data center semiconductors expected to account for over 50% of the total semiconductor market [3] GPU and ASIC Race - GPUs will continue to dominate due to the complexity and processing demands of AI workloads, with NVIDIA transforming from a traditional chip designer to a full-stack AI and data center solution provider [5] - Major cloud service providers are developing their own AI acceleration chips to compete with NVIDIA, intensifying competition in the AI chip sector [5] HBM Market Growth - The HBM market is experiencing explosive growth, expected to reach $3.816 billion by 2025, with a CAGR of 68.2% from 2025 to 2033 [6] - Key trends in the HBM market include increased bandwidth and capacity, energy efficiency, integration with AI accelerators, and the rise of standardized interfaces [6] Disruptive Technologies - Silicon photonics and co-packaged optics (CPO) are redefining data center performance and efficiency, with industry giants actively investing in this area [8] - The introduction of TFLN modulators is enhancing optical communication capabilities within data centers [9] Next-Generation Data Center Design - The shift to direct current (DC) power supply is becoming essential due to the rising power density demands of AI workloads, with modern AI racks requiring up to 600 kW [11] - Wide bandgap (WBG) semiconductor materials like GaN and SiC are crucial for high-frequency, high-voltage power conversion systems [12] - Liquid cooling technology is projected to grow at a CAGR of 14%, expected to exceed $61 billion by 2029, addressing the cooling challenges posed by high-density AI workloads [12] Advanced Thermal Management - Advanced cooling solutions, including direct chip liquid cooling and immersion cooling, are becoming necessary as traditional air cooling methods are insufficient for high-density AI workloads [13][14] - The industry is at a "thermal tipping point," necessitating fundamental adjustments in data center design to accommodate liquid cooling requirements [15] Future Outlook - The future of data centers will be characterized by increased heterogeneity, specialization, and energy efficiency, with a focus on advanced packaging technologies and comprehensive sensor systems [15]