据悉，此次合作建立了端到端的汽车技术解决方案，无缝集成高通科技领先的Snapdragon数字底盘™谷 歌汽车软件的解决方案，赋能汽车制造商打造更能预见、响应和适应驾驶者需求的下一代车辆。 观点网讯：1月5日，高通与谷歌扩大十年合作，推动汽车创新和人工智能驱动的移动出行。 免责声明：本文内容与数据由观点根据公开信息整理，不构成投资建议，使用前请核实。 ...

每经AI快讯，1月5日，高通盘前涨2.5%。 ...

高通推出了全套机器人技术。 ...

Core Viewpoint - Qualcomm has introduced a next-generation robotic integrated architecture at CES, which combines hardware, software, and composite artificial intelligence [1] Group 1: Product Launch - Qualcomm unveiled its latest high-performance robotic processor, the Qualcomm Dragonfly™ IQ10 series, aimed at industrial AMRs and advanced full-size humanoid robots [1] - This new robotic-specific processor expands the company's current roadmap for robotics, offering high-performance and energy-efficient "robot brains" capabilities [1] Group 2: Technological Advancements - The innovation leverages Qualcomm's established expertise in edge artificial intelligence and high-performance low-power systems, transforming prototypes into deployable intelligent machines [1]

在CES展会上，高通科技公司今日宣布了其扩展的物联网产品组合，其中包括全新的高通龙翼™Q系列 处理器。凭借新服务和开发者产品的补充，并在过去18个月内收购了Augentix、Arduino、Edge Impulse、FocusAI和 Foundries.io，高通科技现已具备满足从全球企业到独立本地开发者等更广泛物联网 客户的需求，愿景是成为所有工业和嵌入式领域核心边缘计算和人工智能技术的首选供应商。高通科技 公司汽车、工业及嵌入式物联网及机器人执行副总裁兼集团总经理Nakul Duggal表示："在高通科技， 我们不仅推出了新产品，还要推出一种全面的新方法，帮助几乎所有规模、几乎所有行业的组织，在追 求效率和新机遇的过程中，从人工智能和边缘计算中受益。"高通科技公司汽车、工业与嵌入式物联网 及机器人业务执行副总裁兼集团总经理Nakul Duggal表示。"我们扩展的工业与嵌入式物联网产品组 合，结合强大的开发者生态系统，使我们成为构建智能、互联业务解决方案的终极平台，具备可扩展性 的地位。" ...

Investment Rating - The industry investment rating is maintained as "Positive" [5] Core Insights - The report emphasizes the importance of advancements and innovations in edge AI, predicting accelerated integration into various hardware products and industrial applications by 2026 [9][10] - Key players in the edge AI sector include chip manufacturers, terminal product manufacturers, and core component manufacturers, with specific companies highlighted for investment opportunities [3][10] Summary by Sections Investment Recommendations and Targets - Focus on the upgrade and innovation breakthroughs in edge AI, with recommended stocks including: - Edge AI main control chip manufacturers: Amlogic, Aojie Technology, Hengxuan Technology, Espressif Technology, Starshine Technology, Rockchip [3][10] - Terminal product manufacturers: Lenovo Group, Xiaomi Group, Luxshare Precision, Linying Intelligent Manufacturing, BYD Electronics, Lens Technology, Ezviz, Innosilicon [3][10] - Core component manufacturers: Huanxu Electronics, Sunny Optical Technology, Orbbec, SUTENG, STMicroelectronics, OmniVision, and Pegatron [3][10]

Core Viewpoint - Major Chinese smartphone manufacturers, including Huawei, Xiaomi, OPPO, vivo, and Honor, are planning to adjust their chip strategies between 2026 and 2027 by gradually reducing or even stopping the use of Qualcomm Snapdragon platforms in favor of increasing the adoption of MediaTek Dimensity series processors [1][4]. Group 1: Chip Strategy Transition - Chinese smartphone manufacturers are shifting from reliance on a single supplier to a dual-track parallel chip strategy, driven by risk mitigation and cost control [4]. - Currently, Huawei has largely transitioned to its own Kirin chip solutions, while Xiaomi, OPPO, vivo, and Honor are adopting a "Qualcomm + MediaTek" dual-supplier strategy to effectively disperse supply chain risks [4]. - OPPO's Find X series flagship models are available with both Snapdragon and Dimensity chip versions, allowing market performance and user feedback to guide future product directions [4]. Group 2: Cost Pressures - The direct driver for smartphone manufacturers adjusting their chip strategies is the ongoing rise in costs, particularly the increasing prices of Qualcomm's flagship chips [5]. - The latest Snapdragon 8 Gen 2 chip has a procurement cost of $280, accounting for 25% to 35% of the material costs of high-end smartphones, significantly squeezing overall profit margins [6]. - Storage chip prices are also rising, with industry analysts estimating that the material costs for high-end smartphones could increase by over 40% by 2026 compared to three years ago, while terminal prices may not rise correspondingly [7]. Group 3: MediaTek's Competitive Position - MediaTek's ability to gain favor among manufacturers is primarily due to its significant improvement in technical capabilities, with the Dimensity series now competing directly with Qualcomm's flagship chips in terms of performance and power consumption [8]. - Since the launch of the Dimensity 9000 series, MediaTek's sustained investment in high-end chip development has begun to yield results, with the latest Dimensity 9500 mobile platform receiving market recognition [9]. - OPPO Find X9, Find X9 Pro, and vivo X300, X300 Pro flagship models are now equipped with the Dimensity 9500 platform, indicating that MediaTek chips are no longer exclusive to mid-range models [9]. Group 4: Market Restructuring - The competitive landscape of the smartphone chip market is undergoing structural changes, with MediaTek's increasing market share in the high-end segment redefining the market dynamics [10]. - Industry forecasts suggest that by 2026, MediaTek's share in the global high-end smartphone chip market could rise from less than 20% to over 30%, posing more challenges to Qualcomm's market dominance [11]. - The dual-platform strategy is expected to become a standard configuration for mainstream smartphone manufacturers, allowing for flexible chip platform allocation across different product series and price points, maximizing market coverage while reducing supply chain risks [12]. Group 5: Consumer Impact - For consumers, this shift means a wider range of product choices, with smartphones featuring different chip platforms offering differentiated performance, pricing, and unique features, thereby driving technological innovation across the industry [13]. - As Huawei returns to self-developed chips and other manufacturers seek a balance between price and technology, flagship smartphones will increasingly feature MediaTek Dimensity chips, changing consumer selection criteria [13].

Investment Rating - The report suggests a focus on AI consumer applications, embodied intelligence, autonomous driving, and XR technologies, indicating a positive outlook for companies in these sectors [6][24]. Core Insights - The CES 2026 event is highlighted as a key opportunity to observe advancements in AI, particularly in consumer applications such as AI PCs and embodied intelligence [6][24]. - Significant developments in chip technology are anticipated, with AMD, Intel, and Qualcomm expected to unveil new products that enhance processing capabilities [2][11]. - The report emphasizes the evolution of video models into general visual foundation models, showcasing the capabilities of Google DeepMind's Veo 3 [5][14]. - DeepSeek's mHC architecture aims to address the stability issues in training large models, which could lead to more reliable AI applications [18][19]. Summary by Sections CES 2026 Preview - Focus on new chip products from leading companies: AMD's Ryzen 7 9850X3D and Intel's Panther Lake chips, which promise a 50% performance increase [2][11]. - Emphasis on advancements in autonomous driving technologies, with companies like Sony Honda Mobility and BMW showcasing new models and AI systems [3][12]. Technology Industry Dynamics - Google DeepMind's research indicates that video models are evolving into versatile visual models capable of zero-shot learning, enhancing their applicability across various tasks [5][14]. - DeepSeek's mHC architecture is designed to improve the training stability of large models while maintaining high expressiveness, potentially paving the way for larger-scale model training [18][19]. Weekly Insights - The report recommends focusing on companies that can effectively implement AI technologies in real-world scenarios, particularly in hardware and platforms that support multimodal reasoning [6][24]. - Suggested companies for investment include NVIDIA, Tesla, LITE, AVGO, and Google, which are positioned to benefit from advancements in AI and computing infrastructure [6][24].

Group 1 - The CES 2026 will take place from January 6 to January 9, focusing on AI as it transitions into practical applications, marking the year as the beginning of AI technology integration and industrialization [2][9] - A total of 4,112 companies will participate in CES 2026, with major players like AMD, Lenovo, Hisense, and TCL showcasing innovations across various sectors, including chips, hardware, and vertical applications [2][3] - The event will highlight the integration of AI in various industries, including automotive and supply chains, demonstrating deep connections and applications across the entire industry chain [2][6] Group 2 - NVIDIA's CEO Jensen Huang will not deliver a keynote this year but will participate in discussions about AI's impact on consumer electronics and infrastructure [3][7] - AMD is expected to unveil its next-generation mobile processor, the Ryzen AI 400 series, featuring 12 Zen 5 cores and enhanced NPU capabilities [6][4] - Siemens' CEO will present advancements in industrial AI, showcasing how AI, digital twins, and automation are transforming manufacturing and infrastructure [6][9] Group 3 - The home appliance sector will see significant AI integration, with major companies like Hisense and TCL leading the charge in redefining the future of home electronics [10][11] - Hisense will introduce the world's first display technology upgraded to a "four-core architecture," along with a humanoid robot capable of multi-language interaction [10][11] - The cleaning appliance market, particularly robotic vacuums, is dominated by Chinese brands, while iRobot faces bankruptcy, highlighting a shift in market leadership [13][19] Group 4 - The CES 2026 will feature a strong presence of embodied intelligence products, with over 50% of exhibitors being Chinese companies, showcasing advancements in humanoid robots and smart assistants [20][22] - New AI-native devices, including AI glasses and AI headphones, will be introduced, indicating a shift towards AI as the next generation of consumer electronics [24][26] - The event will also host discussions on the future of technology, including topics like AI's role in industrial transformation and the commercialization of embodied intelligence [30][28]

Group 1 - Qualcomm's sixth-generation Snapdragon 8 Elite Gen 6 chip will be divided into "Standard" and "Pro" versions, with the Pro version expected to exceed $300, making it likely exclusive to high-end "Ultra" models [1] - The Pro version's price increase is attributed to advancements in manufacturing processes, specifically the use of TSMC's 2nm technology, which significantly raises production costs [3] - The cost of a single 2nm silicon wafer is approximately $30,000, which could account for one-third of the total production budget for high-end smartphones, leading many manufacturers to opt for the Standard version to maintain price stability [3] Group 2 - The Standard version of the Snapdragon 8 Elite Gen 6 is expected to feature a "2+3+3" CPU cluster and will support LPDDR5X memory, providing flagship performance without the latest LPDDR6 support [3] - The Standard version may offer better battery life and stable performance due to its conservative configuration, avoiding the overheating issues associated with high-performance chips [3] - The existence of the Snapdragon 8 Elite Gen 6 chip was confirmed through the analysis of HyperOS code, indicating its release alongside the Xiaomi 18 series [5][7] Group 3 - HyperOS code also reveals Qualcomm's advancements in communication technology, referencing the Snapdragon X90 and X95 modems for enhanced connectivity features [8]