| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-076 | | --- | --- | --- | | 债券代码：118057 | 债券简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 关于股份回购实施结果暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/10/29 | | | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 回购方案实施期限 | 年 月 2024 10 | 10 | 28 | 日~2025 | 年 | 月 | 27 | 日 | | 预计回购金额 | 7,000万元~9,000万元 | | | | | | | | | 回购价格上限 | 32.44元/股 | | | | | | | | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 √用于转换公司可转债 | | | | | | | | | | □为维护公司 ...

一、可转换公司债券发行上市概况 | 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-077 | | --- | --- | --- | | 债券代码：118057 | 债券简称：甬矽转债 | | 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 根据相关法律法规规定及《甬矽电子（宁波）股份有限公司向不特定 对象发行可转换公司债券募集说明书》（以下简称"《募集说明书》"）的约 定，甬矽电子（宁波）股份有限公司（以下简称"公司"）本次发行的"甬矽 转债"自2026年1月2日起可转换为公司股份。 公司现就本次向不特定对象发行可转换公司债券，对不符合上海证券 交易所科创板股票投资者适当性要求的投资者所持"甬矽转债"不能转股的风 险，提示如下： 三、其他 投资者如需了解"甬矽转债"的详细情况，请查阅公司于2025年6月24日在 上海证券交易所网站（www.sse.com.cn）披露的《甬矽电子（宁波）股份有限 公司向不特定对象发行可转换公司债券募集说明书》。 （一）可转债发行情况 经中国证券监督 ...

Core Points - Yongxi Electronics (Ningbo) Co., Ltd. announced that the "Yongxi Convertible Bonds" can be converted into company shares starting from January 2, 2026 [1] - The company issued 1.165 billion yuan of convertible bonds to unspecified investors on July 2, 2025, which began trading on the Shanghai Stock Exchange from July 16 [1] - As a Sci-Tech Innovation Board listed company, investors participating in the conversion of convertible bonds must meet the suitability management requirements for Sci-Tech Innovation Board stock investors [1]

Core Viewpoint - The article emphasizes the importance of heterogeneous integration technology in the semiconductor industry, particularly in the context of new demands from artificial intelligence, smart driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory to address these challenges and promote collaboration between industry and academia [2][19]. Meeting Background - The semiconductor industry is facing new stringent requirements for chip design and manufacturing due to advancements in AI and high-performance computing. Key issues such as power consumption, performance, area, and cost are driving the acceleration of emerging semiconductor technologies [2]. - Heterogeneous integration has emerged as a significant and promising direction in the semiconductor field, especially as traditional Moore's Law approaches physical limits. The conference aims to tackle challenges in 2.5D/3D heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and glass-based packaging [2]. - Ningbo is positioned as a core port city in China with a strong foundation in advanced manufacturing, making it an ideal location for this conference. The Yongjiang Laboratory is a provincial-level innovation platform focusing on electronic information materials and micro-nano device preparation [2]. Meeting Content - The conference will focus on core technologies such as multi-material heterogeneous integration and optoelectronic integration, covering advanced packaging technologies like 3D heterogeneous integration, optoelectronic co-packaging, wafer-level bonding, and semiconductor materials and equipment [3]. Basic Information - The 2025 Heterogeneous Integration Annual Conference will be held from November 17-19, 2025, in Ningbo, organized by TrendBank and Yongjiang Laboratory, with an expected attendance of 200-500 participants [4]. Proposed Agenda - The agenda includes closed-door meetings, technical discussions on micro-nano devices, and various forums focusing on advanced packaging technologies and materials [7][9][10]. Conference Features - The conference aims to integrate resources across the heterogeneous integration industry chain, involving all stakeholders from upstream to downstream, and will feature a combination of large and small meetings to facilitate both broad discussions and targeted interactions [8]. - A live supply-demand matching platform will be set up to allow participants to directly engage with cutting-edge technologies and products [8]. Registration and Fees - The registration fee for the conference is RMB 2500 per person, with early bird discounts available. Special rates are offered for students [12].

Group 1 - The core viewpoint of the news is that Yongxi Electronics has seen a significant increase in stock price, with a rise of 5.08% to 34.96 CNY per share, and a total market capitalization of 14.32 billion CNY [1] - Yongxi Electronics, established on November 13, 2017, specializes in integrated circuit packaging and testing, with its main revenue sources being system-level packaging products (41.16%), flat no-lead packaging products (37.79%), high-density fine-pitch bump flip-chip products (14.67%), wafer-level testing products (4.24%), and other products [1] Group 2 - From the perspective of fund holdings, Guotai Fund has a significant position in Yongxi Electronics, with its Guotai Core Value Two-Year Holding Period Stock A fund holding 415,400 shares, accounting for 3.54% of the fund's net value, making it the eighth largest holding [2] - The Guotai Core Value Two-Year Holding Period Stock A fund has achieved a return of 22.91% this year, ranking 2200 out of 4222 in its category, and a return of 47.75% over the past year, ranking 2131 out of 3800 [2]

Group 1 - The third session of the Supervisory Board of Yongxi Electronics (Ningbo) Co., Ltd. held its 16th meeting on September 10, 2025, to discuss and approve various proposals [2][3] - The meeting was legally convened with all three supervisors present, ensuring the validity of the resolutions made [2][4] - The Supervisory Board approved the achievement of the vesting conditions for the first vesting period of the 2024 Restricted Stock Incentive Plan, allowing 571,000 shares to vest for 57 eligible participants [3][40] Group 2 - The third session of the Board of Directors held its 19th meeting on September 10, 2025, where it also approved the same proposals regarding the Restricted Stock Incentive Plan [10][11] - The Board confirmed that the vesting conditions for the first vesting period had been met, with the same number of shares (571,000) approved for vesting [11][35] - The Board also approved the cancellation of certain unvested restricted stocks due to the departure of two participants, totaling 55,000 shares [5][53] Group 3 - The total number of restricted stocks granted under the 2024 plan is 3.312 million shares, representing 0.81% of the company's total share capital [21] - The initial grant consists of 2.912 million shares, with a grant price of 12.555 yuan per share [21][40] - The vesting period for the granted stocks is set for a maximum of 60 months, with specific performance targets tied to the company's revenue growth [22][27] Group 4 - The company has followed all necessary procedures for the implementation of the incentive plan, including approvals from the Board and Supervisory Board, as well as disclosures to the stock exchange [31][48] - The legal opinions confirm that the vesting and cancellation of stocks comply with relevant laws and regulations, ensuring no harm to the interests of shareholders [56][57] - The company will continue to fulfill its disclosure obligations as required by regulations [57][58]

Core Points - The company, Yongxi Electronics, announced the cancellation of 55,000 unvested restricted stock units from its 2024 incentive plan due to the departure of two incentive plan participants [1] Group 1 - The third meeting of the third board of directors and the sixteenth meeting of the third supervisory board was held on September 10, 2025 [1] - The decision to cancel the restricted stock was made because two participants no longer qualified for the incentive plan [1] - The total number of restricted stock units that will be canceled is 55,000 [1]

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-075 | | --- | --- | --- | | 债券代码：118057 | 债券简称：甬矽转债 | | 会关于公司 2024 年限制性股票激励计划首次授予激励对象名单的核查意见及公示 情况说明》（公告编号：2024-056）。 甬矽电子（宁波）股份有限公司 关于作废 2024 年限制性股票激励计划 部分限制性股票的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 甬矽电子（宁波）股份有限公司（以下简称"公司"）于 2025 年 9 月 10 日召 开了第三届董事会第十九次会议和第三届监事会第十六次会议，审议通过了《关于 作废 2024 年限制性股票激励计划部分限制性股票的议案》，现将有关事项说明如 下： 一、本激励计划已履行的决策程序和信息披露情况 （一）2024 年 7 月 19 日，公司召开第三届董事会第七次会议，审议通过了《关 于<2024 年限制性股票激励计划（草案）>及其摘要的议案》《关于<2024 年限制性 股票激励计划实施 ...

| 证券代码：688362 | 证券简称：甬矽电子 | 公告编号：2025-074 | | --- | --- | --- | | 债券代码：118057 | 债券简称：甬矽转债 | | 甬矽电子（宁波）股份有限公司 关于 2024 年限制性股票激励计划首次授予部分 第一个归属期归属条件成就的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 甬矽电子（宁波）股份有限公司（以下简称"公司"或"本公司"）于 2025 年 9 月 10 日召开了第三届董事会第十九次会议、第三届监事会第十六次会议， 审议通过了《关于 2024 年限制性股票激励计划首次授予部分第一个归属期归属 条件成就的议案》，根据公司《2024 年限制性股票激励计划（草案）》（以下 简称"《激励计划》"或"本激励计划"）的规定和 2024 年第三次临时股东大 会的授权，现将有关事项说明如下： 一、股权激励计划批准及实施情况 （一）本激励计划的主要内容 1、股权激励方式：第二类限制性股票。 2、授予数量：授予的限制性股票总量为 331.20 万 ...

上海君澜律师事务所 关于 甬矽电子（宁波）股份有限公司 2024 年限制性股票激励计划 作废部分限制性股票及归属条件成就 之 法律意见书 二〇二五年九月 上海君澜律师事务所 法律意见书 上海君澜律师事务所 关于甬矽电子（宁波）股份有限公司 2024 年限制性股票激励计划 作废部分限制性股票及归属条件成就之 法律意见书 致：甬矽电子（宁波）股份有限公司 上海君澜律师事务所（以下简称"本所"）接受甬矽电子（宁波）股份有 限公司（以下简称"公司"或"甬矽电子"）的委托，根据《上市公司股权激 励管理办法》（以下简称"《管理办法》"）、《上海证券交易所科创板股票 上市规则》（以下简称"《上市规则》"）、《科创板上市公司自律监管指南 第 4 号—股权激励信息披露》（以下简称"《监管指南》"）、《甬矽电子 （宁波）股份有限公司 2024 年限制性股票激励计划》（以下简称"《激励计 划》"或"本次激励计划"）的规定，就甬矽电子本次激励计划作废部分限制 性股票及首次授予部分的第一个归属期归属条件成就的相关事项（以下简称 "本次作废及归属"）出具本法律意见书。 上海君澜律师事务所 法律意见书 误导、疏漏之处。 （三）本所仅就公司 ...