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南芯科技(688484):推出190Vpp压电液冷驱动芯片,工业+汽车电子打开成长空间
Great Wall Securities· 2025-07-15 05:31
Investment Rating - The report maintains a "Buy" rating for the company, indicating an expected stock price increase of over 15% relative to the industry index in the next six months [4][19]. Core Viewpoints - The company has launched the SC3601 piezoelectric liquid cooling driver chip, which significantly enhances heat dissipation performance in mobile smart terminals, filling a gap in domestic technology [1][2]. - The demand for advanced cooling solutions is driven by the increasing power consumption and heat generation of AI chips, creating a substantial market opportunity for the company's products [2][9]. - The company is well-positioned to benefit from the recovery in the consumer electronics market and the growth in automotive electronics, with expectations of continued revenue and profit growth in the coming years [3][10]. Financial Summary - Revenue is projected to grow from 1,780 million yuan in 2023 to 4,814 million yuan in 2027, with a compound annual growth rate (CAGR) of approximately 36.9% [1]. - Net profit is expected to increase from 261 million yuan in 2023 to 719 million yuan in 2027, with notable growth rates in subsequent years [1][10]. - The company's gross margin is forecasted to be around 40.12% in 2024, with net profit margins of 11.95% [3][12]. Market Potential - The global analog chip market is projected to reach 84.1 billion USD in 2024, with a growth rate of 3.7% compared to 2023, driven by demand in AI, high-performance computing, and electric vehicles [9]. - The company is expanding its product offerings in industrial and automotive electronics, capitalizing on the increasing demand for sensors and communication chips in smart vehicles [9][10].
完整议程出炉!4月29日,共探先进封装技术 | 2025异质异构集成封装产业大会(HIPC 2025)
势银芯链· 2025-04-21 08:15
"宁波膜智信息科技有限公司"为势银(TrendBank)唯一工商注册实体及收款账户 势银研究: 势银产业研究服务 势银数据: 势银数据产品服务 势银咨询: 势银咨询顾问服务 重要会议: 4月29日,2025势银异质异构集成封装产业大会(浙江宁波) 点此报名 添加文末微信,加 先进封装 群 2025势银异质异构集成封装产业大会 将于 4月29日 在浙江宁波 · 甬江实验室举办。 会议议程 专题论坛:异质异构集成封装供应链论坛 大尺寸晶圆临时键合与精容减障 13:30 万青 异构集成研究中心主任 13:50 闻江实验室 Chiplet异构集成对测试技术的挑战 13:50 钟锋浩 董事, 副总经理, 高级工程师 14:10 杭州长川科技股份有限公司 先进封装在大规模Al智算芯片领域当中的 14:10 发展蹈径 14:30 谢建友 总经理 齐力半导体(绍兴)有限公司 泰睿恩先进封装技术现状与未来发展布局 14:30 舒耀明 市场部总监 14:50 宁波泰睿思微电子有限公司 三维系统集成与晶圆级扇出型封装技术进 14:50 展 15:10 吕书臣 董事/副总经理 江苏中科智芯集成科技有限公司 会計 15:10 15:3 ...