Core Viewpoint - The company has successfully launched a new generation of chips that support edge AI and various IoT wireless connectivity technologies, achieving significant sales growth and entering mass production by the second quarter of 2025 [1][4]. Market Expansion - The company is strategically expanding its product lines to meet the growing demand for edge AI capabilities in chips, providing solutions that include chips, modules, and AI software and hardware development platforms [1]. - The TL721X series is recognized as a leading low-power edge AI multi-protocol IoT wireless SoC chip, designed to meet the high standards of next-generation smart IoT terminal products [2]. - The TL751X series offers high performance and integration, supporting multiple wireless connectivity protocols, making it suitable for various smart wireless IoT applications [2]. Market Impact - The successful scale sales of the new edge AI products indicate substantial progress in integrating machine learning and AI hardware and software technologies, driving innovation in smart audio, smart home, and smart office applications [3]. - The TL7 series products have quickly gained traction in multiple sectors, including wireless audio, smart home, and wearable technology, achieving sales revenue in the million RMB range by the second quarter of this year [4]. - The company aims to deepen collaborations with leading domestic and international brands, enhancing its core competitiveness in the edge AI market [4].

针对客户对于芯片端侧AI能力集成需求的快速增长，以及AIOT产品多元化 的发展趋势，公司战略性地布局了不同系列的芯片产品线并配套了相对应的模 块。新产品集成了先进的端侧AI运算能力，支持多种物联网无线连接协议。 TL721X系列以其1mA超低功耗，成为业界领先的低功耗端侧AI多协议物联 网无线SoC芯片，满足了新一代智能物联网终端产品对超低功耗的AI算力和多 种无线连接的高标准要求。 TL751X系列则通过其高性能、多协议和高集成度，结合先进的多核设计包 括CPU、NPU和DSP，提供了强大的AI运算处理能力和几乎所有主流物联网无 线连接协议（BLE、Zigbee、Thread、Matter等）的支持，适用于各种智能无线 物联网和无线音频SoC等领域。 上述两款TL7系列芯片是国内最早通过最新的BLE6.0蓝牙协议认证的芯片 产品。公司同时提供面向广大开发者的基于这两款芯片的TL-EdgeAI开发平台， 支持包括谷歌LiteRT、TVM、PyTorch等在内的主流端侧AI模型，客户只需几个 小时就可以把训练好的AI模型植入公司芯片内并且实现所需的AI功能。这是全 球行业内功耗最低的智能物联网连接协议平台之一， ...

Core Insights - The company announced the launch of a new generation of chips supporting edge AI and multiple IoT wireless connectivity technologies by the end of 2024, with sales reaching tens of millions of RMB by Q2 2025 [1] - The rapid growth in customer demand for integrated edge AI capabilities and the diversification of AIoT products have led the company to strategically develop different series of chip product lines [1] - The TL721X series is recognized as an industry-leading low-power edge AI multi-protocol IoT wireless SoC chip, designed to meet the high standards of ultra-low power AI computing and various wireless connectivity for next-generation smart IoT terminal products [1] - The TL751X series offers high performance, multi-protocol support, and high integration, featuring advanced multi-core designs including CPU, NPU, and DSP, suitable for various smart wireless IoT and audio SoC applications [1] Product Certification and Development Support - The TL7 series chips are among the first in China to receive certification for the latest BLE 6.0 Bluetooth protocol [2] - The company provides a TL-EdgeAI development platform for developers, supporting mainstream edge AI models such as Google LiteRT, TVM, and PyTorch, allowing customers to integrate trained AI models into the chips within hours [2] - A certification module based on the TL721X will be launched soon to further assist customers in shortening development timelines and accelerating time-to-market [2]

Core Insights - The company, TaiLing Microelectronics (688591.SH), has successfully launched a new generation of chips that support edge AI integration and multiple IoT wireless connectivity technologies by the end of 2024, responding to the growing demand from customers for these capabilities [1] - The new products have quickly gained customer favor and entered mass production, with sales reaching tens of millions of RMB by the second quarter of 2025, marking a significant achievement in promoting edge AI products [1] Product Development - The company has strategically developed different series of chip product lines to meet the rapid growth in customer demand for edge AI capabilities and the diversification of AIoT products [1] - The TL721X series is recognized as an industry-leading low-power edge AI multi-protocol IoT wireless SoC chip, featuring an ultra-low power consumption of 1mA, which meets the high standards for AI computing power and various wireless connections in next-generation smart IoT terminal products [1] - The TL751X series offers high performance, multi-protocol support, and high integration, combining advanced multi-core designs including CPU, NPU, and DSP, providing robust AI processing capabilities and support for almost all mainstream IoT wireless connection protocols such as BLE, Zigbee, Thread, and Matter [1] Developer Support - The TL7 series chips are among the first in China to receive certification for the latest BLE 6.0 Bluetooth protocol, enhancing their market competitiveness [2] - The company provides a TL-EdgeAI development platform for developers, supporting mainstream edge AI models such as Google LiteRT, TVM, and PyTorch, allowing customers to integrate trained AI models into the chips within hours [2] - The upcoming certification module based on the TL721X will further assist customers in shortening development timelines and accelerating time-to-market for their products [2]

泰凌微公告，公司新一代支持端侧AI和多项物联网无线连接技术的芯片产品已进入规模量产阶段， 2025年二季度新产品销售额达到人民币千万元规模。此次端侧AI新品实现规模销售，标志着公司在融 合机器学习及人工智能软硬件技术、拓展端侧AI应用市场等方面取得了实质性进展。目前，公司端侧 AI新品虽已成功开始出货，但整体出货量尚在初期上升阶段，现阶段占公司营收比例仍较低。 ...

Group 1 - The core viewpoint of the article is that the company, Tai Ling Microelectronics (Shanghai) Co., Ltd., is implementing a differentiated dividend distribution plan for the fiscal year 2024, following a share buyback program [1][4]. - The company has approved a share buyback plan using part of the raised funds and its own funds, with a total buyback amount between RMB 75 million and RMB 150 million [1]. - As of the date of the verification opinion, the company has repurchased 4,242,687 shares, accounting for 1.76% of the total share capital, which will not participate in profit distribution [2]. Group 2 - The differentiated dividend plan proposes a cash dividend of RMB 2.05 per 10 shares (including tax), totaling RMB 48,482,674.05 (including tax) [2]. - The total share capital of the company is 240,743,536 shares, and after deducting the repurchased shares, the actual participating share capital for the dividend distribution is 236,500,849 shares [2]. - The adjusted cash dividend per share is calculated to be RMB 0.205, maintaining the total distribution amount unchanged [2][3]. Group 3 - The sponsor institution, Guotou Securities, has verified that the differentiated dividend distribution complies with relevant laws and regulations, and does not harm the interests of the company or its shareholders [4].

Core Points - The company has approved a differentiated cash dividend distribution plan, with a cash dividend of 0.205 CNY per share [1][2] - The total number of shares participating in the distribution is 236,500,849 shares after excluding 4,242,687 shares held in the repurchase account [2][3] - The total cash dividend amount to be distributed is approximately 48,482,674.05 CNY, including tax [2][3] Dividend Distribution Details - The cash dividend distribution plan was approved at the annual shareholders' meeting on May 28, 2025 [1] - The company will not issue bonus shares or convert capital reserves into share capital for the 2024 profit distribution [1][2] - The reference price for ex-dividend trading will be calculated based on the formula provided, with no change in circulating shares [2][3] Taxation Information - Individual shareholders will not have personal income tax withheld at the time of dividend distribution; the actual cash dividend received will be 0.205 CNY per share [4][5] - Different tax rates apply based on the holding period of the shares, with a maximum tax rate of 20% for shares held for one month or less [4][5] - For qualified foreign institutional investors (QFII), a 10% withholding tax will be applied, resulting in a net cash dividend of 0.1845 CNY per share [5][6]

国投证券股份有限公司 关于泰凌微电子（上海）股份有限公司 差异化分红事项的核查意见 国投证券股份有限公司（以下简称"国投证券"或"保荐机构"）作为泰凌 微电子（上海）股份有限公司（以下简称"泰凌微"、"公司"或"发行人"） 首次公开发行股票并在科创板上市的保荐机构，根据《中华人民共和国公司法》 《中华人民共和国证券法》《证券发行上市保荐业务管理办法》《上海证券交易 所上市公司自律监管指引第7号—回购股份》等有关规定，对泰凌微2024年度利 润分配所涉及的差异化分红（以下简称"本次差异化分红"）相关事项进行了审 慎核查，具体情况如下： 一、本次差异化分红的原因 2024年2月26日，公司召开第二届董事会第三次会议、第二届监事会第三次 会议，审议通过了《关于以集中竞价交易方式回购公司股份方案的议案》，同意 公司使用部分超募资金及自有资金，通过上海证券交易所交易系统以集中竞价交 易方式回购公司已发行的部分人民币普通股（A股）股份，回购股份的资金总额 不低于人民币7,500万元（含），不超过人民币15,000万元（含），回购股份在未 来适宜时机用于员工持股计划或股权激励，以及维护公司价值及股东权益并出售。 截至本核查 ...

证券代码：688591 证券简称：泰凌微 公告编号：2025-026 泰凌微电子（上海）股份有限公司 2024年年度权益分派实施公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 每股现金红利0.205元 2025 年 5 月 28 日，公司召开 2024 年年度股东会审议通过了《关于公司 2024 年度利润分配预案的议案》，公司以实施权益分派股权登记日登记的总股本扣减公 司回购专用证券账户中的股份为基数,向全体股东每 10 股派发现金红利 2.05 元（含 一、 通过分配方案的股东会届次和日期 本次利润分配方案经公司2025 年 5 月 28 日的2024年年度股东会审议通过。 二、 分配方案 1. 发放年度：2024年年度 2. 分派对象： 截至股权登记日下午上海证券交易所收市后，在中国证券登记结算有限责任 公司上海分公司（以下简称"中国结算上海分公司"）登记在册的本公司全体股东。 3. 差异化分红方案： （1）差异化分红方案 相关日期 | | 股权登记日 | 除权（息）日 | 现金红利发放日 | | ...

Group 1: Overall Industry Overview - The total import and export value of China's chip industry is projected to reach $545.14 billion in 2024, with a year-on-year growth of 12.32%, and a trade deficit of $226.14 billion, increasing by 5.97% [1] - In the first four months of 2025, the trade scale of the chip industry has already reached $179.61 billion, with a trade deficit of $66.73 billion [1] Group 2: Import Situation - In 2024, China's chip import volume is expected to be 549.18 billion units, reflecting a year-on-year increase of 14.52%, while the import value is approximately $385.64 billion, up by 10.38% [2] - For the first four months of 2025, the chip import volume is recorded at 181.33 billion units, with an import value of about $123.17 billion [2] - The import price of chips in China fluctuates between $0.60 and $0.80 per unit, remaining relatively stable due to the rapid development of the domestic IoT chip industry [5] Group 3: Export Situation - In 2024, China's chip export volume is projected to be 298.11 billion units, with a year-on-year growth of 11.31%, and the export value is expected to reach $159.50 billion, increasing by 17.31% [7] - In the first five months of 2025, the semiconductor export volume has reached 106.29 billion units, with an export value of $56.44 billion [7] - The export price of chips from China has shown a rising trend, increasing from $0.40 per unit in 2014 to $0.54 per unit in 2024, indicating improved self-innovation capabilities and increased market competitiveness [8]