行情速递 ① 主 板 领 涨 ， 御 银 股 份 (+10.12%)/ 盛 路 通 信 (+10.09%)/ 武 汉 凡 谷 (+10.05%)/ 华 脉 科 技 (+10.04%)/通宇通讯(+10.04%)/ ②创业板领涨， 达利凯普(+20.01%)/硕贝德(+20.00%)/慧翰股份(+19.23%)/ ③科创板领涨， 世华科技(+20.02%)/灿勤科技(+20.02%)/中润光学(+12.68%)/ ④活跃子行业， SW通信网络设备及器件(+3.16%)/SW通信线缆及配套(+2.69%)/ ① 托普云农，发布2024年年度报告/2024年公司实现总营业收入4.89亿元/ 同比增长6.41%/实现归母净利润1.23亿元/同比增长7.35%/ ② 天孚通信，发布2024年年度报告/2024年公司实现总营业收入32.52亿 元/同比增长67.74%/实现归母净利润13.44亿元/同比增长84.07%/ ③ 大族数控，发布2024年年度报告/2024年公司实现总营业收入33.43亿 元/同比增长104.56%/实现归母净利润3.01亿元/同比增长122.2%/ ④ 中熔电气，发布2024年年度报告/20 ...

Core Insights - The semiconductor industry is identified as a major driver of the stock market, influencing investor sentiment and market trends [1]. Industry Summary - Semiconductors are at the forefront of investor focus, research, and data, highlighting their critical role in the market [1]. - The operational mechanisms of semiconductor devices involve multiple components, indicating a complex ecosystem that supports their functionality [1].

Core Viewpoint - The A-share semiconductor stocks experienced a significant midday surge, with Shanghai Beiling hitting the daily limit, and other key players like Taiji Co., Shengbang Co., and major industry weights such as SMIC, Haiguang Information, and Cambrian also seeing substantial increases following an urgent notice from the China Semiconductor Industry Association regarding the "origin" recognition rules for semiconductor products [1] Group 1 - A-share semiconductor stocks saw a second surge in the afternoon [1] - Shanghai Beiling reached a daily limit increase [1] - Other companies like Taiji Co. and Shengbang Co. also experienced rapid gains [1] Group 2 - Major industry players such as SMIC, Haiguang Information, and Cambrian collectively rose [1] - The China Semiconductor Industry Association issued an urgent notice on semiconductor product "origin" recognition rules [1]

《 清华大学如何做创投 - 清华本部如何做孵化 》 《 清华大学如何做创投 - 围绕清华的投资机构 》 《 清华大学如何做创投 - 遍布全国的各分支力量 》 上周，智谱官宣合计完成18亿元融资，让我又想起这个还没收尾的"清华"系列。今天继续。 这个系列文章的初稿完成于2024年初，今年春节期间我又重新细化为多篇。写到第四篇已经非常累了。 但是，还是写不完呀，因为清华的创投体系太庞大了。 国内理工第一的高校，遇到了全球第二大经济体，遇到我们大力发展半导体和 AI ，就呈现出了今天这 个格局。 今天想写的是清华创投力量在华南的一个分支：深圳清华大学研究院（以下简称"深研院"），以及围绕 这个院的多个挂名"力合"的投资机构。 不卖关子，先把我了解到的，力合系的机构的名字罗列如下： 力合科创创投、力合清源、力合泓鑫、力合金控、力合清智、力合天使、力合英飞创投、力合智汇、力 合载物等等。 完了吗？还没有 … 上述几个力合主要投资大陆。除此之外还有：瑞穗力合基金、力合北美。 瑞穗力合基金 布局于更广泛的大中华地区，以及与中国市场有紧密联系的海外科技企业。 力合北美是力合自己在北美地区的分支机构，也服务于清华在北美的校友。 ...

Global Market Overview - The global market experienced mixed performance in the past week (March 3-7, 2025), with the US market indices generally declining and broad indices seeing overall valuation contraction, while major indices in Asia-Pacific and Europe mostly rose, indicating valuation expansion [3][10] - The Nasdaq index, Nasdaq 100, and Dow Jones Industrial Average saw significant valuation contractions, with PE ratios decreasing by 1.56x, 1.24x, and 1.11x respectively compared to February 28, 2025 [3][10] A-share Market Valuation - The core broad valuation of A-shares expanded overall, with significant growth in small-cap growth valuations. The PE expansion for the National Index 2000, CSI 1000, and CSI 500 reached 1.70x, 1.29x, and 0.63x respectively [3][19] - As of March 7, 2025, the overall valuation levels of major A-share indices over the past year showed significant expansion, with PE, PB, and PS ratios mostly above the 80th percentile, while PCF ratios were between the 35th and 65th percentiles over the last three years [3][22] Industry and Sector Valuation - The TMT (Technology, Media, and Telecommunications) sector saw valuation increases, with the computer industry rising by 6.74% and the defense and military industry experiencing the largest increase of 6.96% [3][37] - The PE expansion in the TMT sector was notable, with the computer industry seeing a PE increase of 5.17x, while the support services sector experienced valuation contraction [3][37] Emerging Industries - In emerging industries, valuations for artificial intelligence and military groups expanded significantly, with the cloud computing sector showing the largest increase of 6.03% in stock prices, leading to overall valuation expansion [3][3] - The PE expansion for cloud computing, semiconductor, and integrated circuit sectors reached 7.76x, 5.95x, and 3.58x respectively, while the Kimi index saw a PE expansion of 9.69x and the top ten military group index expanded by 5.56x [3][3]

Financial Data and Key Metrics Changes - In 2023, ASML achieved total revenue of €27.6 billion, a 30% increase compared to the previous year, despite the semiconductor industry experiencing an 8% decline [15][17] - The gross margin improved to 51.3%, with net income reported at €7.8 billion and net bookings at €20 billion [17][25] - The company returned €3.3 billion to shareholders, including €2.3 billion in dividends and €1 billion in share buybacks [18][37] Business Line Data and Key Metrics Changes - The Logic business saw substantial growth, increasing from approximately €10 billion in 2022 to nearly €16 billion in 2023, driven by demand for advanced logic and mature technologies [18][20] - EUV technology sales grew by 30%, while DPV sales surged by 60%, indicating strong demand for immersion technology [17][18] - The applications business experienced a slight decline, attributed to its shorter lead time and lack of significant backlog [18] Market Data and Key Metrics Changes - ASML's sales in China increased significantly, rising from 14% to 29% of total sales, reflecting the company's ability to meet previously unmet demand in the region [21] - The company noted that the semiconductor market is expected to grow from €600 billion to around €1 trillion by 2030, indicating a robust long-term outlook for the industry [55] Company Strategy and Development Direction - ASML is preparing for significant growth in 2025, viewing 2024 as a transition year with expected revenue levels similar to 2023 [32][33] - The company is focused on building capacity and hiring talent to meet anticipated demand, particularly in advanced technologies [33][56] - ASML emphasizes the importance of sustainability and ESG initiatives, aiming for net-zero greenhouse gas emissions by 2040 [59][64] Management's Comments on Operating Environment and Future Outlook - Management acknowledged the current downturn in the semiconductor industry but expressed confidence in a recovery, citing improved customer dynamics and tool utilization [34][35] - The company expects a stronger second half of 2024, driven by a healthy order intake and improved market conditions [34][36] Other Important Information - ASML's R&D expenditure reached €4 billion in 2023, reflecting the company's commitment to innovation and technology development [25][30] - The company reported a healthy cash balance of around €7 billion, providing resilience amid industry challenges [26] Q&A Session: All Questions and Answers Question: Impact of US Government Restrictions on Advanced DUV Machines - Management indicated that the restrictions would not significantly affect the 2025 or 2030 financial targets, as the impact is limited to specific factories under export control [80][89] Question: China's Advancements in DUV Technology - Management clarified that while China can technically achieve 5nm chips using multi-patterning, the economic feasibility for high-volume manufacturing remains a challenge [91][92] Question: Adoption of High NA EUV Technology - Management expressed confidence in the adoption of high NA EUV technology, noting that initial customer interest is strong, and the adoption will be gradual [94][96] Question: Free Cash Flow and Backlog Recovery - Management acknowledged that free cash flow is under pressure due to lower contract liabilities but expects a recovery in backlog as orders return [82][104] Question: Expansion Potential in Eindhoven - Management confirmed ongoing discussions with the Dutch government regarding expansion plans and emphasized the need for a supportive investment climate [83][102]

股票简称：晶合集成 股票代码：688249 合肥晶合集成电路股份有限公司 Nexchip Semiconductor Corporation （住所：安徽省合肥市新站区合肥综合保税区内西淝河路 88 号） 首次公开发行股票科创板上市公告书 保荐人（主承销商） （住所：北京市朝阳区建国门外大街1号国贸大厦2座27层及28层） 2023 年 5 月 4 日 合肥晶合集成电路股份有限公司 上市公告书 特别提示 合肥晶合集成电路股份有限公司（以下简称"晶合集成""公司""发行人"）股票将于 2023 年 5 月 5 日在上海证券交易所科创板上市。 本公司提醒投资者应充分了解股票市场风险及本公司披露的风险因素，在新股上市 初期切忌盲目跟风"炒新"，应当审慎决策、理性投资。 1 合肥晶合集成电路股份有限公司 上市公告书 第一节 重要声明与提示 一、重要声明与提示 本公司及全体董事、监事、高级管理人员保证上市公告书所披露信息的真实、准确、 完整，承诺上市公告书不存在虚假记载、误导性陈述或者重大遗漏，并依法承担法律责 任。 上海证券交易所、有关政府机关对本公司股票上市及有关事项的意见，均不表明对 本公司的任何保证。 本公司提 ...

股票简称：颀中科技 股票代码：688352 合肥颀中科技股份有限公司 Hefei Chipmore Technology Co.,Ltd. （合肥市新站区综合保税区内） 首次公开发行股票科创板上市公告书 保荐人（主承销商） （北京市朝阳区安立路 66 号 4 号楼） 二〇二三年四月十九日 特别提示 合肥颀中科技股份有限公司（以下简称"颀中科技"、"发行人"、"公司" 或"本公司"）股票将于 2023 年 4 月 20 日在上海证券交易所科创板上市。本 公司提醒投资者应充分了解股票市场风险及本公司披露的风险因素，在新股上 市初期切忌盲目跟风"炒新"，应当审慎决策、理性投资。 本上市公告书中所引用数据，如合计数与各分项数直接相加之和存在差异， 或小数点后尾数与原始数据存在差异，可能系由精确位数不同或四舍五入形成 的。 1 第一节 重要声明与提示 一、重要声明与提示 本公司及全体董事、监事、高级管理人员保证上市公告书所披露信息的真 实、准确、完整，承诺上市公告书不存在虚假记载、误导性陈述或重大遗漏， 并依法承担法律责任。 上海证券交易所、有关政府机关对本公司股票上市及有关事项的意见，均 不表明对本公司的任何保证。 ...