Core Viewpoint - The article discusses the rapid development and commercialization of High Bandwidth Flash (HBF) technology, which is expected to surpass High Bandwidth Memory (HBM) by 2038 due to the increasing demand for high-capacity storage solutions driven by AI data needs [1][5]. Group 1: HBF Technology Development - HBF technology is anticipated to be implemented in products by major companies like Samsung and SanDisk by the end of 2028, leveraging the design and process technologies developed during HBM research [2][3]. - HBF is designed to stack multiple 3D NAND flash memory vertically, similar to HBM, to enhance bandwidth, with predictions of exceeding 1638 GB/s in bandwidth [3]. Group 2: Market and Capacity Insights - HBF's capacity is projected to be 512 GB, significantly higher than HBM4's 64 GB, addressing the limitations of HBM in meeting the explosive growth of AI data requirements [3]. - The collaboration between Samsung, SK Hynix, and SanDisk aims to standardize HBF technology, with product development targeted for release by 2027 [3]. Group 3: HBF vs HBM - HBF is expected to complement HBM in AI accelerators, with a larger capacity but slower speed, making it suitable for different types of data processing tasks [4]. - The transition to HBM6 will involve a network of HBM units, while HBF will provide a more extensive data storage solution, potentially changing data processing pathways in GPUs [5]. Group 4: Future Predictions - By 2038, the market for HBF is predicted to exceed that of HBM, indicating a significant shift in memory technology preferences within the industry [5].