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美光DRAM的逆袭
半导体芯闻· 2025-06-11 10:08
Core Viewpoint - NVIDIA has commissioned Micron, Samsung, and SK Hynix to develop SOCAMM memory modules, with Micron surprisingly being the first to receive mass production approval, outpacing its competitors [1][2]. Group 1: SOCAMM Technology - SOCAMM is a memory module designed by NVIDIA, consisting of 16 stacked LPDDR5X chips in four groups, primarily aimed at supporting AI accelerators by ensuring peak performance [1]. - Unlike HBM, which connects DRAM through vertical drilling, SOCAMM uses wire bonding with copper wires, which helps reduce heat generation due to copper's high thermal conductivity [1]. - Micron claims its latest low-power DRAM has a power efficiency that is 20% higher than its competitors [1]. Group 2: Market Position and Innovations - NVIDIA's next-generation AI servers will feature four SOCAMM modules, equating to 256 LPDDR5X chips, indicating a significant technological advancement [2]. - Micron's later adoption of EUV exposure equipment has allowed it to supply products earlier than Samsung and SK Hynix, focusing on structural design innovations to enhance memory efficiency while minimizing heat [2]. - Micron is expected to expand its HBM market share due to its low heat generation technology, as the number of stacked DRAM chips continues to increase [3]. Group 3: Competitive Landscape - Despite entering the HBM market later, Micron's thermal management technology and geographical advantages as a U.S. company position it to catch up with competitors [3]. - Micron's capital expenditure for this year is projected to reach $14 billion, indicating potential stable orders from major clients [3].