双方计划在2030年前，将各自的半导体连接在同一块基板上。利用英伟达的技术，实现GPU、CPU等多 颗芯片像一颗芯片一样的超高速互联。海外科技企业普遍看好日本企业的节能技术…… 日本的富士通10月3日宣布，将与美国英伟达（NVIDIA）共同开发一款把双方芯片连接起来、面向人 工智能（AI）用途的半导体。富士通的半导体此前主要用于国家级超级计算机"富岳"等。 该合作将高速连接英伟达的半导体以提高运算效率，同时大幅提升节能水平，目标是开拓数据中心、机 器人等新需求市场。 英伟达是擅长AI计算处理的图形处理半导体（GPU）领域的全球龙头企业。富士通则从事作为计算"指 挥中枢"的中央处理器（CPU）开发。双方计划在2030年前，将各自的半导体连接在同一块基板上。利 用英伟达的技术，实现GPU、CPU等多颗芯片像一颗芯片一样的超高速互联。 英伟达首席执行官黄仁勋当日在记者会上强调，通过与富士通CPU的连接，"能够实现全新层级的节能 与高效"。 电力效率提高2倍 富士通社长时田隆仁表示："这标志着向AI驱动型社会迈出了重要一步"。双方将共同开发的半导体不仅 将用于AI数据中心，还将拓展至机器人、汽车等"物理AI（Phys ...

Group 1 - TSMC reported a record revenue of $30.07 billion in the second quarter, with AI-related revenue exceeding $10 billion for the first time in a single quarter, indicating strong growth potential for the year [1] - The company expects AI accelerator contributions to revenue to double compared to last year, projecting AI-related revenue to reach approximately NT$434.1 billion in 2024 and NT$868.3 billion in 2025 [1] - In the second quarter, revenue from A-chip manufacturing and advanced packaging was approximately $8.78 billion, a year-on-year increase of 3.67 times, while high-performance computing (HPC) chip revenue was $9.26 billion, a year-on-year increase of 9.8% [1] Group 2 - TSMC's chairman emphasized that despite external factors like tariffs and currency fluctuations, there has been no change in customer behavior, with continued strong demand for AI [2] - The company raised its revenue growth forecast for the year to approximately 30% due to strong demand for advanced processes and growth in HPC platforms [2] - The rapid development of AI applications is expected to drive long-term demand, with significant growth in the processing of text tokens for large language models and sovereign AI needs [2]