"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 添加文末微信，加 异质异构集成产业 群 11月18日上午，2025异质异构集成前沿论坛暨甬江实验室信息材料与微纳器件制备平台（以下简称"微纳平台"）验证线通线仪式举 行，备受关注的微纳平台8英寸验证线正式通线。 至此，甬江实验室正式建成国内领先、世界一流的全链条异质异构集成开放共享平 台。 当天，镇海区区委书记、宁波石化开发区党工委书记（兼）林斌，市政府副秘书长（兼）、甬江科创区建设领导小组办公室常务副 主任徐云，甬江实验室主任崔平，异质异构集成及半导体相关领域行业专家学者，共同见证微纳平台验证线正式通线。同期举办的 2025异质异构集成前沿论坛，吸引了国内外相关领域的龙头企业和科研机构参会，各方围绕前沿成果、技术趋势和关键挑战进行了 深入交流，探讨合作路径。 微纳平台是甬江实验室在电子信息材料与器件领域布局建设的重要公共科研支撑服务平台，也是甬江实验室迄今为止投入最大的平台。平台建 筑面积12000平方米，其中洁净室面积6000平方米，配备包含165台(套)高端精密设备和一支规模达到60余人的运营团队。 平台聚焦 "异质异构 ...

Core Insights - The article discusses the growing demand for "big computing power" driven by advancements in AI and high-performance computing, highlighting the need for a transformation in chip manufacturing due to challenges like the "von Neumann bottleneck" and the slowdown of Moore's Law [2][3] - Heterogeneous integration and heterogeneous-hybrid integration technologies are becoming crucial for achieving high-performance, multifunctional electronic systems, supported by national policies promoting foundational research in advanced technologies [2][3] Group 1: Heterogeneous Integration - Heterogeneous integration focuses on integrating different semiconductor materials (e.g., silicon-based chips with gallium nitride and silicon carbide) into a single package to overcome physical limitations of single materials [3] - The main challenges include managing thermal expansion coefficient mismatches, material interface defects, and thermal management [3] Group 2: Heterogeneous-Hybrid Integration - Heterogeneous-hybrid integration combines different process nodes (e.g., 7nm logic chips with 28nm I/O chips) and functional modules (e.g., CPU, GPU, memory) using advanced packaging technologies to create system-in-package (SIP) solutions [3] - This approach aims to optimize cost and performance while addressing challenges such as interconnect standardization, yield control, and signal integrity [3] Group 3: Upcoming Forum - TrendBank plans to host the "2025 Heterogeneous-Hybrid Integration Frontier Forum" in Ningbo on November 18-19, 2025, focusing on cutting-edge heterogeneous-hybrid integration technologies [4] - The forum will feature discussions on various topics related to heterogeneous-hybrid integration, with confirmed participation from several key industry players and research institutions [4][6] Group 4: Conference Details - The conference is expected to attract 300-500 participants and will include a range of presentations from experts in the field, covering advancements in semiconductor technologies and integration methods [36][37] - Registration details indicate different ticket pricing options, including early bird discounts and student rates [37]

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, focusing on advancements and challenges in heterogeneous integration technology within the semiconductor industry [2][22]. Event Details - The forum will take place from November 17 to 19, 2025, at the Pan Pacific Hotel in Ningbo, Zhejiang, with an expected attendance of 300 to 500 participants [22]. - The event aims to facilitate discussions among industry experts, academic institutions, and investment organizations regarding the current state and future trends of advanced packaging technologies [2][22]. Agenda Highlights - The forum will feature keynote speeches, technical presentations, and parallel sessions covering various topics such as micro-nano manufacturing technologies, advanced packaging trends, and the development of optical chips [4][6][10][12]. - Notable speakers include experts from leading institutions and companies, discussing topics like 2.5D/3D advanced packaging, silicon photonic integration, and Micro LED technology [6][10][12][15]. Registration Information - Registration fees are set at RMB 2500 per person, with early bird discounts available for those who register before October 31, 2025 [22]. - Special rates are offered for students, allowing them to attend for RMB 1500 [22]. Participant List - The article lists several companies and their representatives who have registered for the event, including Huawei, Longxin Storage, and various semiconductor technology firms [23][24].

Core Points - The article discusses the "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, scheduled for November 17-19, 2025, in Ningbo, Zhejiang [2][23]. - The forum aims to address challenges and breakthroughs in heterogeneous integration technology in chip applications, promoting industry collaboration and innovation [2][23]. Event Details - The forum will feature keynotes from industry experts, academic institutions, and emerging companies, focusing on advanced packaging industry trends and the current state of technology [2][23]. - The event will include a series of thematic forums, including discussions on micro-nano manufacturing technologies, advanced packaging, and optical chip innovations [10][21]. Agenda Highlights - The opening ceremony will include speeches from government leaders and representatives from the organizing bodies, followed by a series of thematic reports and discussions on various topics related to heterogeneous integration and advanced packaging technologies [6][10]. - Notable speakers include experts from major companies and academic institutions, discussing topics such as silicon photonic integration and advanced packaging trends [10][11][21]. Registration Information - The forum is expected to attract 300-500 participants, with registration fees set at RMB 2500 per person, offering early bird discounts and student rates [24][23]. - Participants will receive conference materials, lunch, and access to the evening banquet [24]. Participant List - A partial list of registered participants includes professionals from leading companies such as Huawei, Longxin Storage, and various semiconductor technology firms, indicating strong industry interest [25][26].

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by the Yongjiang Laboratory in collaboration with TrendBank and the Ningbo Electronic Industry Association, focusing on advancements and challenges in heterogeneous integration technology within the semiconductor industry [2][31]. Group 1: Event Details - The forum will take place from November 17-19, 2025, at the Pan Pacific Hotel in Ningbo, with an expected attendance of 300-500 participants [31]. - The event aims to facilitate discussions among industry experts, academic institutions, and investment organizations regarding the current state and future trends of advanced packaging technologies [2][31]. Group 2: Participants and Speakers - Notable companies and professionals from various sectors, including Huawei, Longxin Storage, and the Chinese Academy of Sciences, are expected to participate, showcasing a diverse range of expertise [2][3]. - The forum will feature keynote speeches and panel discussions led by industry leaders and researchers, addressing critical topics such as micro-nano manufacturing technologies and advanced packaging integration [16][18]. Group 3: Forum Agenda - The agenda includes specialized forums on topics like heterogeneous integration, advanced packaging, and micro LED technology, with sessions dedicated to discussing the latest innovations and challenges in these fields [19][28]. - Specific sessions will cover advancements in chiplet technology, high-performance sensors, and the application of polymer materials in semiconductor packaging [16][18][29]. Group 4: Registration and Fees - Registration for the forum is available, with ticket prices set at RMB 2500 per person, offering various benefits such as access to conference materials and meals [32]. - Early bird discounts are available for those who register before October 31, with student discounts also offered [32].

Core Viewpoint - The article discusses the upcoming "2025 Heterogeneous Integration Frontier Forum" organized by TrendBank and the Yongjiang Laboratory, focusing on advancements in semiconductor integration technology and its applications in the chip industry [2][27]. Event Overview - The forum will take place from November 17-19, 2025, at the Pan Pacific Hotel in Ningbo, Zhejiang [2][27]. - It aims to gather experts from academic institutions, industry groups, and investment firms to discuss challenges and breakthroughs in heterogeneous integration technology [2]. Agenda Highlights - The opening ceremony will feature speeches from government leaders and key stakeholders, including the CEO of TrendBank [8]. - Various parallel forums will cover topics such as advanced packaging, micro LED integration, and optical chip innovations [10][18][22]. - Notable presentations will include discussions on micro-nano manufacturing technologies, advanced packaging trends, and the latest developments in optical chip technology [11][15][23]. Participation Details - The forum expects to host between 300 to 500 participants, with different ticket options available, including early bird discounts [27][28]. - The ticket prices range from RMB 1,500 for students to RMB 2,500 for general attendees, excluding accommodation [28].

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on the strategic opportunities in the new generation of chip development and the importance of heterogeneous integration technology in the semiconductor industry [10][12]. Event Details - The conference will take place from November 17 to 19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, aiming to create a high ground for advanced electronic information industry in Ningbo and the Yangtze River Delta region [10][13]. - The event will feature a series of discussions and presentations on cutting-edge topics related to heterogeneous integration and advanced packaging technologies [12][13]. Conference Agenda - The agenda includes a closed-door meeting on heterogeneous integration, government speeches, and various technical discussions on topics such as advanced packaging trends, optical chip innovations, and the challenges of heterogeneous integration technology [3][5][6]. - Notable speakers include experts from various organizations, including Alibaba Cloud, COMSOL, and Zhejiang University, discussing topics like optical interconnect solutions and advanced semiconductor manufacturing techniques [5][6][10]. Industry Context - The conference is positioned against the backdrop of increasing demands for chip performance, power consumption, and cost efficiency driven by applications in artificial intelligence and high-performance computing [10]. - Heterogeneous integration is highlighted as a crucial direction for the semiconductor industry, especially in the context of 2.5D/3D integration and optical-electrical co-packaging [10][12]. Participation and Costs - The conference is expected to attract 300-500 participants, with registration fees set at RMB 2500 per person, offering early bird discounts and student rates [13][14].

Core Viewpoint - The article emphasizes the importance of heterogeneous integration technology in the semiconductor industry, particularly in the context of new demands from artificial intelligence, intelligent driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and Yongjiang Laboratory to address these challenges and promote collaboration between industry and academia [2][10]. Conference Background - The conference will focus on the critical issues of chip power consumption, performance, area, and cost, which are driving the acceleration of emerging semiconductor technologies. Heterogeneous integration, including 2.5D/3D integration and advanced packaging, is identified as a key area for development [2]. - Ningbo is positioned as a core city for advanced manufacturing, with a strong foundation in the electronics industry, making it an ideal location for this conference [2]. Conference Details - The 2025 Heterogeneous Integration Annual Conference will take place from November 17-19, 2025, in Ningbo, Zhejiang, co-hosted by TrendBank and Yongjiang Laboratory, with support from local industry associations [4][10]. - The expected scale of the conference is between 300 to 500 participants, featuring a diverse agenda that includes keynote speeches, technical sessions, and roundtable discussions on various topics related to heterogeneous integration and advanced packaging technologies [4][6][10]. Agenda Highlights - The agenda includes discussions on micro-nano device applications, 2.5D/3D integration, MEMS processing technology, and advanced packaging solutions. Notable topics also cover optical chip innovations and the integration of photonic and electronic components [6][7][10]. - The conference aims to facilitate deep research exchanges and industry topic sharing, promoting the integration of technology and industry applications [10]. Participation and Fees - The registration fee for the conference is set at RMB 2500 per person, with early bird discounts available for those who register before October 31 [12]. - The conference aims to attract a wide range of participants from the semiconductor industry, including EDA tool developers, chip manufacturers, and research institutions [15]. Industry Collaboration - The conference seeks to create a collaborative ecosystem that integrates technology, industry, and capital, breaking down barriers across the semiconductor supply chain [11][13]. - It will feature a combination of large-scale meetings and smaller closed-door sessions to enhance interaction quality and facilitate targeted discussions [13].

Core Viewpoint - The article emphasizes the significance of heterogeneous integration technology in the semiconductor industry, particularly in response to the increasing demands from artificial intelligence, smart driving, and high-performance computing applications. It highlights the upcoming 2025 Heterogeneous Integration Annual Conference as a platform for collaboration between industry and academia to address key challenges and drive innovation in advanced packaging technologies [2][3][4]. Conference Background - The conference will focus on the critical issues of chip power consumption, performance, area, and cost, which are driving the acceleration of new semiconductor technologies. Heterogeneous integration is identified as a vital and promising direction in the semiconductor field, especially in the context of the traditional Moore's Law nearing its physical limits [2]. - Ningbo is positioned as a key city for advanced manufacturing, with the Yongjiang Laboratory serving as a provincial-level innovation platform focusing on electronic information materials and micro-nano device preparation [2]. Conference Content - The conference will cover core technologies such as multi-material heterogeneous integration, optoelectronic integration, 3D heterogeneous integration, and advanced packaging techniques. Experts from both industry and academia will engage in deep research exchanges and discussions on industry topics [3]. Basic Information - The 2025 Heterogeneous Integration Annual Conference is organized by TrendBank and Yongjiang Laboratory, scheduled for November 17-19, 2025, in Ningbo, with an expected attendance of 200-500 participants [4]. Proposed Agenda - The agenda includes closed-door meetings, government speeches, and various forums focusing on topics such as optical communication chip integration, 2.5D/3D chip integration, and advanced packaging technologies [5][7]. Resource Integration - The conference aims to create a collaborative ecosystem that integrates technology, industry, and capital, facilitating discussions among all stakeholders in the semiconductor supply chain [6]. Participation and Services - The conference will feature a combination of large and small meetings to ensure broad discussions on common industry topics while providing private, efficient interaction spaces for specific fields. High-quality services will be emphasized to enhance the overall experience for participants [6].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 2025势银异质异构集成封装产业大会 将于 4月29日 在浙江宁波 · 甬江实验室举办。 会议议程 专题论坛： 异构集成研究中心成立仪式 09:00 09:10 相关领导 主办方、联合主办方致辞 09:10 09:20 相关领导 混合键合在异构集成先进封装中的应用 09:20 钟飞 主任助理、信息材料与微纳器件制备 09:40 平台负责人 爵江实验室 Chiplet EDA全流程:设计空间探索,物 理实现及多物理验证 09:40 吴晨 项目总监 10:00 芯粒CAD和制造浙江省工程研究中心/深圳 市比昂芯科技有限公司 聚焦2.5D/3D先进封装EDA平台,探索后 10:00 端全流程设计、仿真与验证协同创新模式 10:20 赵毅 创始人兼首席科学家 珠海硅芯科技有限公司 空部 10:20 10:40 硅基光芯片制造与集成工 ...