事件：2025 年12 月11 日至12 日，第二届光电合封 CPO 及硅光集成前瞻技术展示交流会在无锡举办。 行业机构 Light Counting、头部企业Senko、康宁等齐聚现场，深度解读光电合封及硅光集成技术发展态 势。 大会明确传递核心信号：硅光与 CPO（共封装光学）已脱离 "未来技术储备"范畴，成为当下破解 800G/1.6T 乃至3.2T 超高速互连能耗与带宽瓶颈的必经之路。在此行业趋势下，光芯片供应商长光华芯 有望深度受益。 依托IDM 全流程平台优势，深化"纵向延伸+横向扩展"的全产业链布局。公司作为少数具备高功率半导 体激光芯片量产能力的IDM 企业，已建成覆盖芯片设计、外延生长、晶圆处理至封装测试的全流程工 艺平台，实现了核心芯片的自主可控与国产化替代。在技术与产品端，公司依托GaAs、InP、GaN 三大 材料体系及边发射、面发射两大核心工艺平台，形成了以高功率单管/巴条芯片为基石，横向拓展 VCSEL 及光通信芯片，纵向向下游延伸至器件、模块及直接半导体激光器的多元化产品矩阵。这种垂 直整合的业务模式不仅巩固了其在光纤激光器泵浦源等传统领域的优势，更助力公司快速切入数据中心 通讯 ...

Core Viewpoint - The SEMI-e Shenzhen International Semiconductor Exhibition and the 2025 Integrated Circuit Industry Innovation Exhibition will take place from September 10-12, 2025, at the Shenzhen International Convention and Exhibition Center, focusing on the entire integrated circuit industry chain and attracting over 16,000 professional visitors [2][10]. Group 1: Exhibition Overview - The exhibition will cover three main themes: "IC Design and Application," "IC Manufacturing and Supply Chain," and "Compound Semiconductors," showcasing the latest products and technologies from 5,000 exhibitors across a 300,000 square meter area [2][10]. - The event will feature over 1,000 global exhibitors, including industry leaders from various sectors such as chip design, wafer manufacturing, power semiconductors, semiconductor equipment, materials, and components [4][5]. Group 2: Featured Exhibitors - Notable exhibitors include major companies in chip design like Unisoc and ZTE Microelectronics, wafer manufacturing firms such as Hua Hong Semiconductor, and power semiconductor companies like BYD Semiconductor [4]. - The exhibition will also highlight advancements in semiconductor equipment and materials, with participation from companies like North Huachuang and Shanghai Microelectronics [4]. Group 3: Thematic Display Areas - Six thematic display areas will focus on industry hotspots, including advanced packaging, power devices, and new industrial software applications [5]. - The event will showcase innovations in heterogeneous integration packaging and the latest developments in IGBT, MOSFET, and SiC/GaN wide bandgap devices [5]. Group 4: Concurrent Events and Conferences - The exhibition will host over 20 conferences discussing industry trends, covering topics such as edge AI chips, power semiconductors, and semiconductor manufacturing [6][7]. - Key conferences include the 2025 China RSIC-V Ecosystem Conference and the 7th Hard Core Chip Ecosystem Conference, focusing on automotive chip technology [7]. Group 5: Visitor Experience - Attendees can enjoy a seamless experience by accessing both the semiconductor and optoelectronics exhibitions with a single ticket, enhancing resource connectivity and efficiency [8][10].