Core Viewpoint - TSMC's stock increased by 3% to $303.16, driven by news regarding pricing for its 2nm process technology, which is approximately 15%-20% higher than the 3nm process pricing [1] Pricing Information - The price for TSMC's 2nm wafers is around $30,000 (approximately 214,000 RMB), which is an increase from the average price of the 3nm process, which ranges from $25,000 to $27,000 [1] - TSMC plans to implement a comprehensive price adjustment for its advanced processes (3/4/5/7nm) next year, with increases expected to remain in the single-digit percentage range, depending on the scale of customer cooperation [1]

周三，台积电(TSM.US)涨3%，报303.16美元。消息面上，供应链最新信息显示，台积电2nm单片晶圆 报价约3万美元(约合21.4万元人民币)，较3nm制程(2.5万-2.7万美元)的均价上涨约15%-20%。与此同 时，台积电已确定将于明年对3/4/5/7纳米等先进制程实施全面价格调整，涨幅维持在个位数百分比区 间，具体涨幅依客户合作规模而定。 ...

Core Viewpoint - The letter from Intel's CEO, Pat Gelsinger, emphasizes the importance of Intel's role in the U.S. technology and manufacturing sectors, highlighting the company's commitment to innovation and national security amidst recent political pressures [2][3][4]. Group 1: Leadership and Commitment - The CEO expresses gratitude for the opportunities provided by the U.S. and emphasizes the honor of leading Intel during a critical time [3]. - Intel's success is framed as vital for the U.S. technology sector, national security, and economic strength, which drives the company's global operations [3][4]. - The CEO addresses misinformation regarding his past experiences, asserting a commitment to high legal and ethical standards throughout his career [3]. Group 2: Government Relations and Future Outlook - The company is actively communicating with the government to address concerns and ensure accurate information is shared [4]. - The CEO supports the President's commitment to advancing U.S. national and economic security, highlighting Intel's crucial role in these efforts [4]. - Intel is set to adopt advanced semiconductor manufacturing technology later this year, marking a significant milestone for the company and the U.S. tech ecosystem [4].

Core Viewpoint - Samsung's semiconductor foundry business is facing significant challenges, particularly in the advanced 3nm process, where its yield is only 50%, compared to TSMC's 90% yield, leading to the loss of major clients to TSMC [1][4]. Group 1: Challenges in Semiconductor Foundry - Samsung's 3nm yield is significantly lagging behind TSMC, which poses a risk of losing key customers [1]. - Major clients such as Google, Qualcomm, and AMD have shifted their production to TSMC due to Samsung's low yield [1]. - China's SMIC is making progress in 5nm and 7nm processes, adding competitive pressure on Samsung's foundry business [1]. Group 2: Strategic Moves - Samsung has hired former TSMC executive Margaret Han to lead its North American foundry business, aiming to enhance customer engagement and competitiveness [2][4]. - The appointment of Margaret Han is seen as a strategic move to rebuild trust with North American clients and attract new orders from major tech companies like NVIDIA, AMD, Tesla, and Amazon [4]. - Samsung is investing $17 billion in a new advanced foundry facility in Taylor, Texas, to strengthen its position in the U.S. market [4].

Core Viewpoint - Intel's latest 18A process technology, featuring advanced capabilities and significant performance improvements, positions it as a strong competitor to TSMC's 2nm process, with potential applications in upcoming products by 2026 [2][3]. Group 1: Intel 18A Process Technology - Intel 18A process technology operates at 1.1V, achieving a 25% speed increase and a 36% reduction in power consumption compared to standard Arm core architecture chips [2]. - The area efficiency of Intel 18A is superior to that of Intel 3, indicating enhanced design potential and higher density capabilities [2]. - The technology utilizes RibbonFET gate-all-around (GAA) transistors for precise current control and introduces the industry's first PowerVia backside power delivery technology, improving power transmission stability [2]. Group 2: Market Implications - If yield rates are satisfactory, Intel 18A is expected to compete effectively with TSMC's 2nm process technology [3]. - The initial applications of Intel 18A are projected to be in Panther Lake SoC and Xeon Clearwater Forest CPU, with terminal products anticipated to debut as early as 2026 [3].

最新资料显示，Intel 18A提供了高性能（HP）和高密度（HD）库，具有全功能的技术设计功能和增强的设计易用性。 在PPA（性能、功耗、面积）比较中，Intel 18A在标准Arm核心架构的芯片上，1.1V电压下实现了25%的速度提升和36%的功耗降低。 此外，Intel 18A的面积利用率比Intel 3更高，这意味着该制程可以实现更好的面积效率和更高密度设计的潜力。 英特尔官网此前公布的资料显示，Intel 18A采用了RibbonFET环绕栅极晶体管（GAA）技术，可实现电流的精确控制，同时还率先采用 了业界首创的PowerVia背面供电技术。 英特尔还展示了电压下降图，描绘了高性能条件下节点的稳定性，由于Intel 18A的PowerVia供电技术，该制程能够提供更稳定的电力传 输。 比较显示，通过背面供电技术，英特尔实现了更紧密的单元封装，并提高了面积效率，这主要是因为相比正面布线释放了更多空间。 国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 4月21日消息，英特尔在2025年VLSI研讨会上披露了更多关于其最新的Intel 18 ...